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    • 1. 发明专利
    • Semiconductor test module and test method of semiconductor device
    • 半导体器件的半导体测试模块和测试方法
    • JP2005127765A
    • 2005-05-19
    • JP2003361572
    • 2003-10-22
    • Toshiba Corp株式会社東芝
    • OSADA TATSUOGOTO KENJITSURUMURA KOJIFUJIMORI MASARUNAKAJIMA YASUYUKI
    • G01R31/316G01R31/28G01R31/3183G01R31/319
    • G01R31/2889
    • PROBLEM TO BE SOLVED: To provide a semiconductor device test module and its test method capable of testing a semiconductor device in a short time, while keeping reliability of the semiconductor device, without increasing the number of testers.
      SOLUTION: This semiconductor device test module 100 is equipped with an interface 195 for inputting test condition information when a test object is tested from an external testing device 300 for testing an electrical characteristic of the test object 400, and outputting test result information for showing a test result of the test object to the external testing device, a storage part 115 capable of storing the test condition information, an operation processing part 170 for processing the test condition information independently of the external testing device, output parts 130, 140 for outputting a test signal based on the test condition information to the test object following an instruction from the operation processing part, input parts 150, 160 for inputting a response signal from the test object to the test signal, and a storage part 114 capable of storing information based on the response signal as test result information.
      COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题:提供一种能够在保持半导体器件的可靠性的同时在短时间内测试半导体器件的半导体器件测试模块及其测试方法,而不增加测试器的数量。 解决方案:该半导体器件测试模块100配备有用于当从外部测试装置300测试测试对象以测试测试对象400的电气特性时输入测试条件信息的接口195,并输出测试结果信息 用于将测试对象的测试结果显示给外部测试装置,能够存储测试条件信息的存储部分115,用于独立于外部测试装置处理测试条件信息的操作处理部分170,输出部分130,140 用于根据来自操作处理部分的指令将测试条件信息输出到测试对象信息,以及用于将来自测试对象的响应信号输入到测试信号的输入部分150,160以及能够 基于响应信号存储信息作为测试结果信息。 版权所有(C)2005,JPO&NCIPI