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1. 发明专利

JP2008059001A Method for manufacturing optical waveguide 审中-公开
标题翻译：制造光波导的方法
公开(公告)号：JP2008059001A
公开(公告)日：2008-03-13
申请号：JP2007299737
申请日：2007-11-19
申请人： Toppan Printing Co Ltd , 凸版印刷株式会社
发明人： ISHIZAKI MAMORU , MATSUI HATSUNE , SASAKI ATSUSHI , INOUE SHINICHI , TSUKAMOTO TAKETO
IPC分类号： G02B6/13
摘要： PROBLEM TO BE SOLVED: To provide an optical waveguide that is inexpensive with high use efficiency of a core material, and to provide a method for manufacturing the optical waveguide. SOLUTION: The method for manufacturing an optical waveguide comprises: a step of forming a first clad (2) by applying a resin on a substrate (20) and curing the resin; a step of holding a core material (1') between a recessed mold (10) having a recess identical to a shape of the core and the first clad on the substrate; a step of curing the core material thus applied, thereby forming a core pattern (1) having a shape identical to that of the recess on the first clad; and a step of peeling the recessed mold (10) from the core pattern and the first clad. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种廉价且芯材的高效率的光波导，并提供一种制造光波导的方法。解决方案：制造光波导的方法包括：通过在基板（20）上施加树脂并固化树脂来形成第一包层（2）的步骤; 将芯材（1'）保持在具有与芯的形状相同的凹部的凹模（10）和基板上的第一包层之间的步骤; 固化由此施加的芯材的步骤，由此形成具有与第一包层上的凹部相同形状的芯图案（1）; 以及从芯图案和第一包层剥离凹模（10）的步骤。版权所有（C）2008，JPO＆INPIT

2. 发明专利

JP2007323272A Antenna structure and ic tag using the same 审中-公开
标题翻译：天线结构和IC标签使用它
公开(公告)号：JP2007323272A
公开(公告)日：2007-12-13
申请号：JP2006151495
申请日：2006-05-31
申请人： Toppan Printing Co Ltd , 凸版印刷株式会社
发明人： ONO ETSUKO , SASAKI ATSUSHI , NAKAMURA MAKOTO
IPC分类号： G06K19/077 , G06K19/07
摘要： PROBLEM TO BE SOLVED: To provide an antenna structure that can ensure the easy mounting of an IC chip and a reduced thickness of an IC tag by arranging an IC chip mounting area and a loop antenna on a metal base, and the IC tag using the structure. SOLUTION: The antenna structure 50 composed of a metal base having the IC chip mounting area 21, the loop antenna 12 and a slit 13 is mounted with the IC chip in the IC chip mounting area 21 and resin-packaged in sealing resin, and then both ends of the loop antenna are cut away to form antennas 12a and 12b separated by the slit 13, thus obtaining the IC tag with the antennas 12a and 12b electrically connected to the IC chip 51. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种天线结构，其可以通过将IC芯片安装区域和环形天线布置在金属基底上来确保IC芯片的容易安装和IC标签的减小，并且IC 标签使用结构。解决方案：由具有IC芯片安装区域21的金属基座，环形天线12和狭缝13组成的天线结构50在IC芯片安装区域21中安装有IC芯片，并且树脂封装在密封树脂中，然后切断环形天线的两端，以形成由狭缝13分开的天线12a和12b，从而获得具有与IC芯片51电连接的天线12a和12b的IC标签。版权所有（C））2008，JPO＆INPIT

3. 发明专利

JP2005099655A Method for manufacturing photomask, the photomask, and exposing method thereof 审中-公开
标题翻译：光电制造方法，光电二极管及其曝光方法
公开(公告)号：JP2005099655A
公开(公告)日：2005-04-14
申请号：JP2003387573
申请日：2003-11-18
申请人： Toppan Printing Co Ltd , 凸版印刷株式会社
发明人： SASAKI ATSUSHI , KONISHI TOSHIO , TAMURA AKIRA , CHIBA KAZUAKI , MORITA MOTOHIKO , OTAKI MASAO
IPC分类号： G03F1/32 , G03F1/36 , G03F1/54 , G03F1/68 , G03F7/40 , H01L21/027 , G03F1/08
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a photomask with steps, a photomask which is greatly improved in size precision of an auxiliary pattern by coating even a substrate, obtained by forming a shifter-dug step part on a transparent substrate by etching, with photosensitive resin so that the surface is smooth and the film thickness is uniform, or a photomask with a Levenson type phase shift.
SOLUTION: The method for manufacturing a photomask having a mask pattern formed of step parts of two or more kinds of height, includes, before a stage of forming at least one kind of step part in 2nd order or later, a stage of making the substrate surface smooth by coating the step parts formed in the previous stage with the photosensitive resin and then polishing the photosensitive resin.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提供一种用于制造具有台阶的光掩模的方法，光掩模通过涂覆均匀的基板而大大提高了辅助图案的尺寸精度，通过在透明的方式上形成换档切割步骤部分而获得用感光性树脂进行蚀刻，使得表面光滑，膜厚均匀，或具有莱文森型相移的光掩模。解决方案：用于制造具有由两个或更多种高度的台阶部分形成的掩模图案的光掩模的方法包括：在形成至少一种阶梯部分的阶段之前，在第二阶段或更后阶段中，形成阶段通过用感光性树脂涂布前述阶段形成的台阶部，然后研磨感光性树脂，使基板表面光滑。版权所有（C）2005，JPO＆NCIPI

4. 发明专利

JP2004078084A Method for manufacturing optical waveguide 有权
公开(公告)号：JP2004078084A
公开(公告)日：2004-03-11
申请号：JP2002241713
申请日：2002-08-22
申请人： Toppan Printing Co Ltd , 凸版印刷株式会社
发明人： ISHIZAKI MAMORU , TSUKAMOTO TAKETO , SASAKI ATSUSHI
IPC分类号： G02B6/13
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing an optical waveguide, which easily forms a stable core pattern, forms an optical path conversion mirror in a process that continues a manufacturing process of a core pattern and manufactures a stable polymer optical waveguide at a low cost. SOLUTION: In the manufacturing of an optical waveguide which forms a core pattern 1A in a pattern-shaped recessed part of a substrate 10, forms a state clad 2A overlapped on two surfaces of cladding material of another substrate 20 and forms a clad 3A over the entire surface of the other substrate, surface treatment that improves the affinity of the core material on the surface of a substrate having the pattern-shaped recessed part before filling the core material only in the pattern-shaped recessed part of the substrate. COPYRIGHT: (C)2004,JPO

5. 发明专利

JP2003050329A Optic/electric wiring board, method for manufacturing the board and package board 审中-公开
标题翻译：光/电接线板，制造板和包装板的方法
公开(公告)号：JP2003050329A
公开(公告)日：2003-02-21
申请号：JP2001237427
申请日：2001-08-06
申请人： Toppan Printing Co Ltd , 凸版印刷株式会社
发明人： KUMAI KOICHI , YOTSUI KENTA , TSUKAMOTO TAKETO , ISHIZAKI MAMORU , SASAKI ATSUSHI
IPC分类号： G02B6/122 , G02B6/13 , H05K1/02
摘要： PROBLEM TO BE SOLVED: To primarily provide an optic/electric wiring board on which a mirror for optical path conversion is arrange at an arbitral position in the optical wiring, secondarily to form an optic/electric wiring board on which an accurate mirror is mounted and thirdly to simplify the manufacturing process of the wiring board. SOLUTION: The optic/electric wiring board is provided with a board 4 furnished with an electronic wiring 3, an optical wiring layer 5 furnished with a core and a clad located on at least one face of the substrate and one or more mirror members 6 embedded between the board and the optical wiring layer. The fact that the mirror member is composed of metal or glass plated with metal layer is included.
摘要翻译：要解决的问题：主要提供一种光/电布线板，光路转换用反射镜在其上配置在光布线的仲裁位置，二次形成安装有精确反射镜的光/电布线板，三是简化接线板的制造工艺。解决方案：光/电布线板设置有配备有电子布线3的基板4，布置有芯的光布线层5和位于基板的至少一个面上的包层和嵌入的一个或多个反射镜部件6 在板和光布线层之间。包括反射镜部件由镀金属层的金属或玻璃构成的事实。

6. 发明专利

JP2007299117A Security ic tag 审中-公开
标题翻译：安全IC标签
公开(公告)号：JP2007299117A
公开(公告)日：2007-11-15
申请号：JP2006125132
申请日：2006-04-28
申请人： Toppan Printing Co Ltd , 凸版印刷株式会社
发明人： SAKAI TAKEJI , OMORI HIROYASU , SASAKI ATSUSHI , NAKAMURA MAKOTO , ABE KAZUO
IPC分类号： G06K19/077 , G06K19/07 , G09F3/00 , G09F3/03
摘要： PROBLEM TO BE SOLVED: To provide a security IC tag which can surely and easily be broken down, can be obtained inexpensively and is high in security with respect to the IC tag in which an antenna and an IC chip are mounted on a base material. SOLUTION: An IC chip 41 is flip-flop mounted on an antenna substrate 30 on which a cutoff line 31 for parting base materials is formed between mounting pads 21b of a base material 11 on which an antenna 21a, mounting pad 21b and mounting pad 21b are formed, and resin-packaged by sealing resin 51 so that a security IC tag 100 can be manufactured. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供可靠且容易地分解的安全IC标签，可以廉价地获得并且相对于其中安装有天线和IC芯片的IC标签的安全性高基材。解决方案：将IC芯片41安装在天线基板30上，在天线基板30上形成用于分离基材的切断线31，其中基材11的安装焊盘21b之间形成天线21a，安装焊盘21b和形成安装焊盘21b，并通过密封树脂51树脂封装，从而可以制造安全IC标签100。版权所有（C）2008，JPO＆INPIT

7. 发明专利

JP2007172020A Non-contact communication body 审中-公开
标题翻译：非接触通信体
公开(公告)号：JP2007172020A
公开(公告)日：2007-07-05
申请号：JP2005364499
申请日：2005-12-19
申请人： Toppan Printing Co Ltd , 凸版印刷株式会社
发明人： OMORI HIROYASU , SAKAI TAKEJI , SASAKI ATSUSHI , NAKAMURA MAKOTO , ABE KAZUO
IPC分类号： G06K19/077 , G06K19/07 , H01Q1/24 , H01Q1/38
摘要： PROBLEM TO BE SOLVED: To provide a non-contact communication body for preventing any unintended communication from being performed, and for achieving communication only by limited users or only within a limited time by providing an attachable/detachable dielectric member to the non-contact communication body mounted with an IC chip and an antenna on a base material. SOLUTION: A non-contact communication body 100a is configured by mounting the attachable/detachable dielectric member 51a at an antenna 31 mounted face side on a non-contact communication main body in a non-resonating state mounted with at least the IC chip 21 and the antenna 31 on the base material 11. A non-contact communication body 100b is configured by mounting an attachable/detachable dielectric member 51b at the opposite face side to the antenna mounted face, and a non-contact communication body 100c is configured by mounting an attachable/detachable dielectric member 51c and an attachable/detachable dielectric member 51d at the both sides of the non-contact communication body in a non-resonating state. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种非接触通信体，用于防止任何意外的通信被执行，并且为了仅通过有限的用户实现通信，或仅在有限的时间内通过向非接触的通信体提供可附接/ - 与基底材料上安装有IC芯片和天线的接触通信体。解决方案：非接触式通信主体100a通过将至少安装有IC的非谐振状态的非共振状态将安装在可接触/可拆卸的电介质部件51a安装在非接触式连通主体上的安装在天线31的侧面芯片21和基材11上的天线31.非接触连通体100b通过将安装/拆卸电介质部件51b在相对的正面侧安装到天线安装面而构成，非接触连通体100c是通过在非谐振状态下将可接触/可拆卸的电介质构件51c和可接合/可拆卸的电介质构件51d安装在非接触式连通体的两侧。版权所有（C）2007，JPO＆INPIT

8. 发明专利

JP2007148457A Optical waveguide 审中-公开
标题翻译：光波导
公开(公告)号：JP2007148457A
公开(公告)日：2007-06-14
申请号：JP2007066060
申请日：2007-03-15
申请人： Toppan Printing Co Ltd , 凸版印刷株式会社
发明人： ISHIZAKI MAMORU , HARA HATSUNE , SASAKI ATSUSHI , INOUE SHINICHI , TSUKAMOTO TAKETO
IPC分类号： G02B6/122 , G02B6/13
摘要： PROBLEM TO BE SOLVED: To provide an inexpensive optical waveguide with high use efficiency of a core material and a method for manufacturing the waveguide. SOLUTION: The method for manufacturing the optical waveguide comprises a step of forming a first clad (2) by applying a resin on a substrate (20) and curing the resin, a step of interposing a core material (1') between a recessed mold (10) which has a recess having a shape identical to a shape of the core, and the first clad on the substrate, a step of curing the interposed core material and forming a core pattern (1) having a shape corresponding to the recess on the first clad, and a step of releasing the recessed mold (10) from the core pattern and the first clad. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种芯材的高使用效率的便宜的光波导和制造该波导的方法。解决方案：制造光波导的方法包括通过在基板（20）上施加树脂并固化树脂来形成第一包层（2）的步骤，将芯材（1'）介于具有与芯的形状相同形状的凹部和基板上的第一包层的凹部模具（10），固化插入的芯材的步骤，形成具有对应于所述芯部的形状的芯图案（1）第一包层上的凹部，以及从芯图案和第一包层释放凹模（10）的步骤。版权所有（C）2007，JPO＆INPIT

9. 发明专利

JP2007148456A Optical waveguide 有权
公开(公告)号：JP2007148456A
公开(公告)日：2007-06-14
申请号：JP2007066059
申请日：2007-03-15
申请人： Toppan Printing Co Ltd , 凸版印刷株式会社
发明人： ISHIZAKI MAMORU , HARA HATSUNE , SASAKI ATSUSHI , INOUE SHINICHI , TSUKAMOTO TAKETO
IPC分类号： G02B6/122
摘要： PROBLEM TO BE SOLVED: To provide an inexpensive optical waveguide with high use efficiency of a core material and a method for manufacturing the waveguide. SOLUTION: The method for manufacturing the optical waveguide comprises a step of forming a first clad (2) by applying a resin on a substrate (20) and curing the resin, a step of interposing a core material (1') between a recessed mold (10) which has a recess having a shape identical to a shape of the core, and the first clad on the substrate, a step of curing the interposed core material and forming a core pattern (1) having a shape corresponding to the recess on the first clad, and a step of peeling the recessed mold (10) from the core pattern and the first clad. COPYRIGHT: (C)2007,JPO&INPIT

10. 发明专利

JP2004191903A Optical path conversion component and its manufacturing method, and optical surface mounting waveguide using the same 审中-公开
公开(公告)号：JP2004191903A
公开(公告)日：2004-07-08
申请号：JP2003011954
申请日：2003-01-21
申请人： Toppan Printing Co Ltd , 凸版印刷株式会社
发明人： SASAKI ATSUSHI , ISHIZAKI MAMORU , TSUKAMOTO TAKETO , HARA HATSUNE
IPC分类号： G02B6/122
摘要： PROBLEM TO BE SOLVED: To provide an optical path conversion component which can be mounted with high-density or miniaturized, enables mounting of a photoelectric element to be easily performed with low coupling loss and consequently can be used for an optic/electric wiring substrate, its manufacturing method and a surface mounting waveguide. SOLUTION: The optical path conversion component 1 is constituted by joining tilted surfaces provided in two or more optical fibers having transmission line structure consisting of a core and a clad, wherein the optical path conversion component has a reflection surface for propagating light from transmission line structure of one optical fiber to transmission line structure of the other optical fiber. The optical path conversion component 1 is embedded in a through hole 7 of an optical waveguide and an optical signal to be transmitted on the optical waveguide 8 is made to reach photoelectric elements 12, 13. In addition, it is preferable that a single layer of metal thin film or a multi-layer film combining the single-layer film is deposited on the reflection surface of the optical path conversion component. COPYRIGHT: (C)2004,JPO&NCIPI

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