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1. 发明专利

JP2007299117A Security ic tag 审中-公开
标题翻译：安全IC标签
公开(公告)号：JP2007299117A
公开(公告)日：2007-11-15
申请号：JP2006125132
申请日：2006-04-28
申请人： Toppan Printing Co Ltd , 凸版印刷株式会社
发明人： SAKAI TAKEJI , OMORI HIROYASU , SASAKI ATSUSHI , NAKAMURA MAKOTO , ABE KAZUO
IPC分类号： G06K19/077 , G06K19/07 , G09F3/00 , G09F3/03
摘要： PROBLEM TO BE SOLVED: To provide a security IC tag which can surely and easily be broken down, can be obtained inexpensively and is high in security with respect to the IC tag in which an antenna and an IC chip are mounted on a base material. SOLUTION: An IC chip 41 is flip-flop mounted on an antenna substrate 30 on which a cutoff line 31 for parting base materials is formed between mounting pads 21b of a base material 11 on which an antenna 21a, mounting pad 21b and mounting pad 21b are formed, and resin-packaged by sealing resin 51 so that a security IC tag 100 can be manufactured. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供可靠且容易地分解的安全IC标签，可以廉价地获得并且相对于其中安装有天线和IC芯片的IC标签的安全性高基材。解决方案：将IC芯片41安装在天线基板30上，在天线基板30上形成用于分离基材的切断线31，其中基材11的安装焊盘21b之间形成天线21a，安装焊盘21b和形成安装焊盘21b，并通过密封树脂51树脂封装，从而可以制造安全IC标签100。版权所有（C）2008，JPO＆INPIT

2. 发明专利

JP2007172020A Non-contact communication body 审中-公开
标题翻译：非接触通信体
公开(公告)号：JP2007172020A
公开(公告)日：2007-07-05
申请号：JP2005364499
申请日：2005-12-19
申请人： Toppan Printing Co Ltd , 凸版印刷株式会社
发明人： OMORI HIROYASU , SAKAI TAKEJI , SASAKI ATSUSHI , NAKAMURA MAKOTO , ABE KAZUO
IPC分类号： G06K19/077 , G06K19/07 , H01Q1/24 , H01Q1/38
摘要： PROBLEM TO BE SOLVED: To provide a non-contact communication body for preventing any unintended communication from being performed, and for achieving communication only by limited users or only within a limited time by providing an attachable/detachable dielectric member to the non-contact communication body mounted with an IC chip and an antenna on a base material. SOLUTION: A non-contact communication body 100a is configured by mounting the attachable/detachable dielectric member 51a at an antenna 31 mounted face side on a non-contact communication main body in a non-resonating state mounted with at least the IC chip 21 and the antenna 31 on the base material 11. A non-contact communication body 100b is configured by mounting an attachable/detachable dielectric member 51b at the opposite face side to the antenna mounted face, and a non-contact communication body 100c is configured by mounting an attachable/detachable dielectric member 51c and an attachable/detachable dielectric member 51d at the both sides of the non-contact communication body in a non-resonating state. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种非接触通信体，用于防止任何意外的通信被执行，并且为了仅通过有限的用户实现通信，或仅在有限的时间内通过向非接触的通信体提供可附接/ - 与基底材料上安装有IC芯片和天线的接触通信体。解决方案：非接触式通信主体100a通过将至少安装有IC的非谐振状态的非共振状态将安装在可接触/可拆卸的电介质部件51a安装在非接触式连通主体上的安装在天线31的侧面芯片21和基材11上的天线31.非接触连通体100b通过将安装/拆卸电介质部件51b在相对的正面侧安装到天线安装面而构成，非接触连通体100c是通过在非谐振状态下将可接触/可拆卸的电介质构件51c和可接合/可拆卸的电介质构件51d安装在非接触式连通体的两侧。版权所有（C）2007，JPO＆INPIT

3. 发明专利

JP2004272526A Bulletin board system with personal authentication function, and its program 审中-公开
公开(公告)号：JP2004272526A
公开(公告)日：2004-09-30
申请号：JP2003061327
申请日：2003-03-07
申请人： Toppan Printing Co Ltd , 凸版印刷株式会社
发明人： AKIMOTO KAZUMI , ABE KAZUO
IPC分类号： G06K17/00 , G06F13/00 , G06F15/00 , G06F21/20
摘要： PROBLEM TO BE SOLVED: To enhance security for treating personal information by adapting personal authentication using a non-contact ID tag to a bulletin board. SOLUTION: A bulletin board system with a personal authentication function is constituted of: a mail request detecting part 11 for detecting mail requests from event participants; a participant ID acquiring part 12 initiated by the mail requests to acquire IDs for specifying event participants recorded on the non-contact ID tag; an e-mail address generating part 13 for authenticating, based on the acquired IDs, acquiring local domains for the event and generating local e-mail addresses in which the authenticated IDs at each event participant are made as account names; and an e-mail managing part 14 for managing creation and browsing of mails by the event participants, based on the generated local e-mail addresses. COPYRIGHT: (C)2004,JPO&NCIPI

4. 发明专利

JP2004064650A Mobile terminal equipment 审中-公开
公开(公告)号：JP2004064650A
公开(公告)日：2004-02-26
申请号：JP2002223453
申请日：2002-07-31
申请人： Toppan Printing Co Ltd , 凸版印刷株式会社
发明人： ABE KAZUO , FUKUMORI SHIGERU , OTA KENJI
IPC分类号： G06F15/02 , G06T7/20 , H04L9/32 , H04M1/00 , H04M1/66
摘要： PROBLEM TO BE SOLVED: To provide mobile terminal equipment in which various kinds of information are displayed or a user is identified.
SOLUTION: A fingerprint identification sensor 5 reads physical features of the user and outputs the result as identification information. An identification control part 4 judges whether or not the identification information outputted from a physical feature reading means with identification information stored in advance and outputs fingerprint collation information representing whether they match or not. Besides, an input/display function control part 7 outputs display information read from a display information storage part 11 to a display part 10, and a communication/identification function control part 1 receives the fingerprint collation information from the identification control part and transmits instruction information based on the fingerprint collation information via a communication unit 2.
COPYRIGHT: (C)2004,JPO

5. 发明专利

JP2003037256A Package type solid-state image pickup element 审中-公开
标题翻译：包装类型固态摄像元件
公开(公告)号：JP2003037256A
公开(公告)日：2003-02-07
申请号：JP2001224203
申请日：2001-07-25
申请人： Toppan Printing Co Ltd , 凸版印刷株式会社
发明人： KUMAMOTO YUICHI , ABE KAZUTOSHI , ABE KAZUO
IPC分类号： H01L27/14
CPC分类号： H01L2224/48091 , H01L2224/8592 , H01L2924/16195 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a solid-state image pickup element, capable of preventing sticking of foreign materials to a light receiving part in a package type solid- state image pickup element, for which a solid-state image pickup element chip, having a light-receiving part is sealed inside a package, and the opening part of a package facing the light-receiving part is covered with a light-transmitting member.
SOLUTION: The package type solid-state image pickup element is provided with at least the package having an internal space, the solid-state image pickup element chip, having the light-receiving part sealed inside the internal space and the light-transmitting member arranged at the opening part of the package facing the light-receiving part to turn the internal space into a tightly sealed space, and an adhesive material layer is formed on the inner wall surface of the package forming the internal space.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：为了提供一种固态摄像元件，其能够防止异物粘附到封装型固体摄像元件中的光接收部分，固体摄像元件芯片具有：光接收部分密封在封装内，并且面向光接收部分的封装的开口部分被透光部件覆盖。解决方案：封装型固体摄像元件至少设置有具有内部空间的封装，固体摄像元件芯片具有密封在内部空间内的光接收部分，并且透光部件被布置在面向光接收部的封装的开口部处，将内部空间转动成密闭的空间，在形成内部空间的封装的内壁面上形成粘接材料层。

6. 发明专利

JP2010086253A Rf tag, and information disclosure method and exhibition information disclosure system using it 审中-公开
标题翻译： RF标签和信息公开方法和展览信息公开系统
公开(公告)号：JP2010086253A
公开(公告)日：2010-04-15
申请号：JP2008254145
申请日：2008-09-30
申请人： Toppan Printing Co Ltd , 凸版印刷株式会社
发明人： ABE KAZUO , OMORI HIROYASU , SASAKI ATSUSHI , FUKUDA YOICHIRO
IPC分类号： G06K19/10 , G06F13/00 , G06K17/00 , G06K19/07
摘要： PROBLEM TO BE SOLVED: To provide detailed material related to an exhibition, a lecture or the like to an individual visitor or participant visiting or participating in the exhibition, the lecture or the like via an RF (RFID (Radio Frequency Identification)) tag, and a data server on a promoter side or a network such as the Internet in response to a demand of the individual visitor or participant. SOLUTION: This exhibition information disclosure system has: the RF tag 10; a reader/writer 11; a demand exhibition material data processor 12 creating a visitor demand exhibition material list 13, and linking detailed exhibition material data 14 of each exhibition booth to the demand exhibition material list 13 to perform creation; a database 20 storing the demand exhibition material list 13 and the exhibition material data 14; the data server 21 supplying the exhibition material list 13 and the exhibition material data 14 to a terminal 25 of the visitor via the network N; the terminals 25 of the visitors; and RF tag readers 26 each reading recorded data of the RF tag 10 in the terminal 25. The exhibition material demanded by the individual visitor is transmitted to an exhibition HP screen of the terminal 25. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：通过RF（RFID（射频识别）技术）向参加或参与展览的个人访问者或参与者，讲座等提供与展览，演讲等相关的详细材料，）标签，以及响应于个人访问者或参与者的需求的启动器侧或诸如因特网的网络上的数据服务器。
解决方案：本展会信息披露制度有：RF标签10; 读写器11; 要求展览材料数据处理器12，创建访客需求展览材料清单13，并将每个展览摊位的详细展览资料数据14与要求展览材料清单13相连以进行创作; 存储需求展示材料列表13和展览材料数据14的数据库20; 数据服务器21经由网络N向参观者的终端25提供展览材料清单13和展览材料数据14; 访客的25号航站楼; 和RF标签读取器26，每个读取终端25中的RF标签10的记录数据。个人访问者所要求的展览材料被传送到终端25的展览HP屏幕。（C）2010年，JPO和INPIT

7. 发明专利

JP2003324019A Inductor element 审中-公开
标题翻译：电感元件
公开(公告)号：JP2003324019A
公开(公告)日：2003-11-14
申请号：JP2002131286
申请日：2002-05-07
申请人： Toppan Printing Co Ltd , 凸版印刷株式会社
发明人： SEKINE HIDEKATSU , DOCHI KATSUNORI , NAKAMURA MAKOTO , YOSHIMOTO HISASHI , ABE KAZUO , TONEGAWA MASAHISA , FUKADA TAKAYUKI
IPC分类号： H01F17/00 , H01F27/42
摘要： PROBLEM TO BE SOLVED: To provide an inductor element which is built in a multilayer circuit board and can be finely adjusted in inductance.
SOLUTION: The solenoid-type inductor element 100 is built in the multilayered circuit board such as a printed wiring board, an interposer, or the like. The inductor element 100 is composed of an inductor 20 provided with a main coil wiring and a trimming inductor 40 provided with a trimming coil wiring, and the inductor 20 and the trimming inductor 40 are connected in series. The trimming inductor 40 is smaller in sectional area than the inductor 20, and trimming wiring 61 provided between the adjacent discrete trimming coil wiring parts of the trimming inductor is cut off so as to adjust the inductor element 100 in inductance.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供内置在多层电路板中的电感器元件，并且可以在电感中进行微调。解决方案：螺线管式电感器元件100内置在诸如印刷线路板，插入器等的多层电路板中。电感器元件100由设置有主线圈布线的电感器20和设置有微调线圈布线的微调电感器40组成，电感器20和微调电感器40串联连接。修整电感器40的截面面积小于电感器20，并且切断设置在微调电感器的相邻离散微调线圈布线部分之间的微调布线61，以便将电感器元件100调整为电感。版权所有（C）2004，JPO

8. 发明专利

JP2003318549A Method for manufacturing multilayer circuit board (printed wiring board or interposer) 审中-公开
标题翻译：制造多层电路板（印刷电路板或插件）的方法
公开(公告)号：JP2003318549A
公开(公告)日：2003-11-07
申请号：JP2002125726
申请日：2002-04-26
申请人： Toppan Printing Co Ltd , 凸版印刷株式会社
发明人： SEKINE HIDEKATSU , DOCHI KATSUNORI , NAKAMURA MAKOTO , YOSHIMOTO HISASHI , ABE KAZUO , TONEGAWA MASAHISA , FUKADA TAKAYUKI
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer circuit board incorporating a capacitor and an inductor by which the cost can be reduced and a small thickness and light weight can also be realized.
SOLUTION: A first wiring layer 21a and an insulation layer 31 are formed on an insulation base material 11, and a lower electrode 41a for the capacitor and a lower coil wiring 41b for the inductor are formed at specified positions of the insulation layer 31. Then, a dielectric pattern layer 51 is formed on the lower electrode 41a and a magnetic pattern layer 61 is formed on the lower coil 41b, and an insulation layer 72 is formed on the dielectric pattern layer 51 and the magnetic pattern layer 61. A dielectric pattern layer 51a, a magnetic pattern layer 61a and an insulation layer 72a are formed by polishing, and then an upper electrode 81a for the capacitor and an upper coil wiring 81b for the inductor are formed, resulting in the multilayer circuit board wherein the capacitor and inductor are formed on the same plane as the insulation layer 31.
COPYRIGHT: (C)2004,JPO
摘要翻译：解决的问题：提供一种制造包含电容器和电感器的多层电路板的方法，通过该方法可以降低成本并且还可以实现小的厚度和重量。解决方案：在绝缘基材11上形成第一布线层21a和绝缘层31，在绝缘层的特定位置形成用于电容器的下电极41a和用于电感器的下线圈布线41b 然后，在下电极41a上形成电介质图案层51，在下线圈41b上形成磁性图案层61，在电介质图案层51和磁图案层61上形成绝缘层72。通过研磨形成介质图案层51a，磁性图案层61a和绝缘层72a，然后形成用于电容器的上部电极81a和用于电感器的上部线圈布线81b，得到多层电路板，其中，电容器和电感器形成在与绝缘层31相同的平面上。版权所有（C）2004，JPO

9. 发明专利

JP2003318548A Multilayer circuit board and its manufacturing method 审中-公开
标题翻译：多层电路板及其制造方法
公开(公告)号：JP2003318548A
公开(公告)日：2003-11-07
申请号：JP2002125725
申请日：2002-04-26
申请人： Toppan Printing Co Ltd , 凸版印刷株式会社
发明人： SEKINE HIDEKATSU , DOCHI KATSUNORI , NAKAMURA MAKOTO , YOSHIMOTO HISASHI , ABE KAZUO , TONEGAWA MASAHISA , FUKADA TAKAYUKI
IPC分类号： H05K3/46 , H01L23/12
摘要： PROBLEM TO BE SOLVED: To provide a multilayer circuit board incorporating a capacitor, an inductor and a resistor, and its manufacturing method by which the cost can be reduced and a small thickness and light weight be also realized.
SOLUTION: First wiring layers 21a and 21b and an insulation layer 31 are formed on both surfaces of an insulation base material 11, and a lower electrode 41a for the capacitor and a lower coil wiring 41b for the inductor are formed on one surface of the insulation layer 31. A dielectric layer 61 is formed on the lower electrode 41a to form the lower coil wiring 41b for the inductor, and furthermore, an upper electrode 41a for the capacitor is formed to form a capacitor 60 and an upper coil wiring 41b for the capacitor, forming the inductor 70. A resistor 91 is formed between the upper electrode 41a for the capacitor and a third wiring layer 82c, resulting in the multilayer circuit board 400 wherein the capacitor, inductor and resistor are formed on the same plane as the insulation layer 31.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供一种包含电容器，电感器和电阻器的多层电路板及其制造方法，其可以降低成本并且还实现小的厚度和重量。解决方案：在绝缘基材11的两个表面上形成第一布线层21a和21b以及绝缘层31，在一个表面上形成用于电容器的下电极41a和用于电感器的下线圈布线41b 电介质层61形成在下电极41a上，形成用于电感器的下线圈布线41b，此外，用于电容器的上电极41a形成电容器60和上线圈布线 41b，形成电感器70.在电容器的上电极41a和第三布线层82c之间形成电阻器91，形成多层电路板400，其中电容器，电感器和电阻器形成在同一平面上作为绝缘层31.版权所有（C）2004，JPO

10. 发明专利

JP2003037260A Solid-state image pickup device 审中-公开
标题翻译：固态图像拾取器件
公开(公告)号：JP2003037260A
公开(公告)日：2003-02-07
申请号：JP2001224202
申请日：2001-07-25
申请人： Toppan Printing Co Ltd , 凸版印刷株式会社
发明人： KUMAMOTO YUICHI , ABE KAZUTOSHI , ABE KAZUO
IPC分类号： H01L27/14 , H01L31/02 , H04N5/335 , H04N5/372 , H04N5/374
CPC分类号： H01L2224/48091 , H01L2924/16151 , H01L2924/16152 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a solid-state image pickup device, capable of preventing sticking of foreign materials to a light-receiving surface and to perform monitor display without scratch display by foreign material sticking in the solid-state image pickup device, provided with at least a solid-state image pickup element having the light-receiving surface, an inner wall surrounding the periphery of the light-receiving surface and forming a space on the light-receiving surface and a light-transmitting member facing the light-receiving surface.
SOLUTION: In the solid-state image pickup device provided with at least a solid-state image pickup element, having a light-receiving surface, the inner wall surrounding the solid-state image pickup element or the periphery of the light-receiving surface and forming the space on the light-receiving surface and the light-transmitting member faces the light-receiving surface, an adhesive material layer is formed on the inner wall exposed to the space.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：提供一种固态摄像装置，其能够防止异物粘附到光接收表面并且执行监视器显示，而不会在固态图像拾取装置中粘附异物显示而不显示至少具有光接收表面的固态摄像元件，围绕光接收表面的周边的内壁并在光接收表面上形成空间，以及面向光接收的透光元件表面。解决方案：在固态图像拾取装置中，至少设有具有受光面的固体摄像元件，围绕固态摄像元件的内壁或受光面的周围，以及在光接收表面上形成空间并且透光构件面向光接收表面，在暴露于该空间的内壁上形成粘合材料层。

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