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1. 发明专利

JP2012090566A Seed storage medium 审中-公开
标题翻译：种子储存媒体
公开(公告)号：JP2012090566A
公开(公告)日：2012-05-17
申请号：JP2010240614
申请日：2010-10-27
申请人： Toppan Printing Co Ltd , 凸版印刷株式会社
发明人： TAKAYAMA MUTSUMI , MATSUI HATSUNE , OGASAWARA MIKI
IPC分类号： A01C1/04 , B42D15/10 , G06K19/00
摘要： PROBLEM TO BE SOLVED: To provide a seed storage medium to store seeds of plants, etc. in a substrate and free from trouble of seed storage failure caused by spring out of seed from the substrate in the case of filling the seed in the medium.SOLUTION: The seed storage medium 1 includes a substrate 2 at least having a seed storage part, and a cover film 7 to cover the seed storage part, wherein a seed sheet holding fixed seeds 5 is placed in the seed storage part of the seed storage medium 1 to prevent seed filling failure.
摘要翻译：要解决的问题：提供种子储存介质，以将植物的种子等存储在基质中，并且在将种子填充的情况下不会从基质中从种子中弹出的种子储存失败的麻烦介质。解决方案：种子储存介质1包括至少具有种子储存部分的基底2和覆盖种子储存部分的覆盖膜7，其中将固定种子5放置在种子储存部分的种子储存部分中种子储存介质1以防止种子填充失败。版权所有（C）2012，JPO＆INPIT

2. 发明专利

JP2012090567A Seed housing medium 审中-公开
标题翻译： SEED房屋中介
公开(公告)号：JP2012090567A
公开(公告)日：2012-05-17
申请号：JP2010240615
申请日：2010-10-27
申请人： Toppan Printing Co Ltd , 凸版印刷株式会社
发明人： MATSUI HATSUNE , TAKAYAMA MUTSUMI , OGASAWARA MIKI
IPC分类号： A01C1/04 , B42D15/10 , G06K19/00
摘要： PROBLEM TO BE SOLVED: To provide a seed housing medium which houses seeds of a plant in a base material, and has no seed housing defect due to jumping from the base material when filling the seeds.SOLUTION: The seed housing medium 1 includes: the base material 2 provided with at least a seed housing unit; and a cover film 7 for covering the seed housing unit. The seed housing medium 1 is comprised by arranging a seed housing bag in which a seed 5 is housed in the seed housing unit, thus, has no seed filling defect.
摘要翻译：要解决的问题：提供一种种子外壳介质，其种植基材的种子，并且在填充种子时由于从基材跳出而没有种子壳缺陷。种子容纳介质1包括：至少设置有种子容纳单元的基材2; 以及用于覆盖种子容纳单元的覆盖膜7。种子容纳介质1包括通过布置种子收容袋，籽种5容纳在种子容纳单元中，因此没有种子填充缺陷。版权所有（C）2012，JPO＆INPIT

3. 发明专利

JP2013118844A Seed storage medium 审中-公开
标题翻译：种子储存媒体
公开(公告)号：JP2013118844A
公开(公告)日：2013-06-17
申请号：JP2011268712
申请日：2011-12-08
申请人： Toppan Printing Co Ltd , 凸版印刷株式会社
发明人： MATSUI HATSUNE , HATA SOICHI
IPC分类号： A01C1/04 , G06K19/00
摘要： PROBLEM TO BE SOLVED: To provide a seed storage medium facilitating germination of seeds with few germination failures in the seed storage medium for storing seeds of a plant or the like in a base material.SOLUTION: The seed storage medium 1 includes the base material 2, a seed storage part having a low water absorbing layer or a water non-absorbing layer 7 on one surface of the base material 2 and having an opening in at least the other surface of the base material to arrange the seeds 5, and a cover film 6 provided on the other surface of the base material 2 to cover the opening of the seed storage part.
摘要翻译：待解决的问题：提供种子储存介质，用于在用于将植物等的种子储存在基材中的种子储存培养基中促进少量发芽失败的种子的发芽。解决方案：种子储存介质1包括基材2，在基材2的一个表面上具有低吸水层或水不吸收层7的种子储存部分，并且在至少基材的其他表面以种子5的布置，以及设置在基材2的另一表面上以覆盖种子贮存部的开口部的覆盖膜6。版权所有（C）2013，JPO＆INPIT

4. 发明专利

JP2011134194A Ic card 有权
标题翻译： IC卡
公开(公告)号：JP2011134194A
公开(公告)日：2011-07-07
申请号：JP2009294405
申请日：2009-12-25
申请人： Toppan Printing Co Ltd , 凸版印刷株式会社
发明人： SUGANO SEIJI , WAKANA MASAHIKO , MATSUI HATSUNE
IPC分类号： G06K19/077 , B42D15/10 , G06K19/07
摘要： PROBLEM TO BE SOLVED: To provide a structure of an IC card which never causes wrinkling on a surface of the IC card in thermal lamination and is also excellent in impact resistance. SOLUTION: The IC card includes at least inner layer sheets 91, 92 and a facing sheet 3, which are laminated on an antenna substrate 10 of an inlet provided with an IC chip 5. The IC chip 5 includes reinforcing plates 61, 62 adhered to a chip mount area on a chip mount surface of the antenna substrate 10 where the IC chip 5 is electrically connected with the antenna and on the chip mount area on the surface facing the chip mount surface of the antenna substrate respectively through an adhesive resin. The reinforcing plate on the chip mount area side is covered with a cushioning resin 4 lower in elasticity than the inner layer sheets 91, 92 and facing sheet 3. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供在热层压中不会在IC卡的表面上引起皱纹的IC卡的结构，并且抗冲击性也优异。解决方案：IC卡至少包括内层片材91,92和面层片材3，层压在设置有IC芯片5的入口的天线基板10上.IC芯片5包括加强板61， 62粘合到天线基板10的芯片安装表面上的芯片安装区域，其中IC芯片5分别通过粘合剂与天线电连接在与天线基板的芯片安装表面相对的表面上的芯片安装区域上树脂。芯片安装区域侧的加强板用比内层片91,92和面板3低弹性的缓冲树脂4覆盖。版权所有（C）2011，JPO＆INPIT

5. 发明专利

JP2008059001A Method for manufacturing optical waveguide 审中-公开
标题翻译：制造光波导的方法
公开(公告)号：JP2008059001A
公开(公告)日：2008-03-13
申请号：JP2007299737
申请日：2007-11-19
申请人： Toppan Printing Co Ltd , 凸版印刷株式会社
发明人： ISHIZAKI MAMORU , MATSUI HATSUNE , SASAKI ATSUSHI , INOUE SHINICHI , TSUKAMOTO TAKETO
IPC分类号： G02B6/13
摘要： PROBLEM TO BE SOLVED: To provide an optical waveguide that is inexpensive with high use efficiency of a core material, and to provide a method for manufacturing the optical waveguide. SOLUTION: The method for manufacturing an optical waveguide comprises: a step of forming a first clad (2) by applying a resin on a substrate (20) and curing the resin; a step of holding a core material (1') between a recessed mold (10) having a recess identical to a shape of the core and the first clad on the substrate; a step of curing the core material thus applied, thereby forming a core pattern (1) having a shape identical to that of the recess on the first clad; and a step of peeling the recessed mold (10) from the core pattern and the first clad. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种廉价且芯材的高效率的光波导，并提供一种制造光波导的方法。解决方案：制造光波导的方法包括：通过在基板（20）上施加树脂并固化树脂来形成第一包层（2）的步骤; 将芯材（1'）保持在具有与芯的形状相同的凹部的凹模（10）和基板上的第一包层之间的步骤; 固化由此施加的芯材的步骤，由此形成具有与第一包层上的凹部相同形状的芯图案（1）; 以及从芯图案和第一包层剥离凹模（10）的步骤。版权所有（C）2008，JPO＆INPIT

6. 发明专利

JP2006100524A Solder-bump feeder and repairing method 审中-公开
标题翻译：卖方供应商和修理方法
公开(公告)号：JP2006100524A
公开(公告)日：2006-04-13
申请号：JP2004283994
申请日：2004-09-29
申请人： Toppan Printing Co Ltd , 凸版印刷株式会社
发明人： INATA MIHO , KATO ISAO , SHINKAWA HARUHIKO , MAEHARA MASATAKA , MATSUI HATSUNE
IPC分类号： H01L21/60
摘要： PROBLEM TO BE SOLVED: To provide a feeder efficiently and surely feeding bumps when solder balls are not loaded correctly at each bump forming place.
SOLUTION: A structure in the solder-bump feeder has an outer tube, an attraction member vertically movable in the outer tube and having an attraction section at a front end, and a ball feed tube composed of a hollow tube, the front end of which is arranged to the attraction section of the attraction member.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：当焊球在每个凸点形成位置未正确地装载时，能够有效地提供馈线，并且可靠地馈送凸起。解决方案：焊料凸块进给器中的结构具有外管，可在外管中垂直移动并且在前端具有吸引部的吸引部件，以及由中空管构成的球供给管，前端其端部设置在吸引部件的吸引部。版权所有（C）2006，JPO＆NCIPI

7. 发明专利

JP2011167119A Medium for seed storage 有权
标题翻译：种子储存媒介
公开(公告)号：JP2011167119A
公开(公告)日：2011-09-01
申请号：JP2010033453
申请日：2010-02-18
申请人： Toppan Printing Co Ltd , 凸版印刷株式会社
发明人： OGASAWARA MIKI , MATSUI HATSUNE , SAKATA HIROYASU
IPC分类号： A01C1/04
摘要： PROBLEM TO BE SOLVED: To provide a medium for seed storage to store seeds of vegetables, etc., in a substrate, effective for improving germination rate independent of embedding direction and angle, etc., of the medium in soil and suitable for hydroponic culture as well as soil culture. SOLUTION: Seeds are stored in a cavity of the substrate and the cavity is sealed with a cover film. Accordingly, water, nutrients, etc., can be absorbed in the seeds through openings at both sides of the cavity to improve the germination rate of the seeds independent of the direction, angle, etc., of the medium embedded in the soil. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：待解决的问题：提供种子储存用培养基，将蔬菜等种子储存在基材中，有效地提高发芽率，与土壤中介质的包埋方向和角度等无关，适合用于水培培养以及土壤培养。解决方案：将种子储存在基材的空腔中，并用覆盖膜密封空腔。因此，水，营养物等可以通过空腔两侧的开口在种子中吸收，以提高种子的发芽率，而不依赖于土壤中介质的方向，角度等。版权所有（C）2011，JPO＆INPIT

8. 发明专利

JP2011167118A Seed-housing medium 有权
标题翻译： SEED-HOUSING MEDIUM
公开(公告)号：JP2011167118A
公开(公告)日：2011-09-01
申请号：JP2010033452
申请日：2010-02-18
申请人： Toppan Printing Co Ltd , 凸版印刷株式会社
发明人： MATSUI HATSUNE , OGASAWARA MIKI
IPC分类号： A01C1/04
摘要： PROBLEM TO BE SOLVED: To provide a seed-housing medium for housing the seeds of a plant or the like in a substrate material, which enables stable germination and growth irrespective of the material quality of cover film or the like, and the environment of a medium. SOLUTION: Since the seeds 5 and a polymer absorbent material 6 are housed together at a seed-housing part provided in the substrate material 2 and the seed-housing part is sealed with the cover film 7, the polymer adsorbent material 6 adsorbs water in soil on being buried in the soil to increase its volume, and the cover film 7 can surely be destroyed to increase the germination rate of the seeds 5. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于将植物等的种子容纳在基材中的种子容纳介质，其能够与覆盖膜等的材料质量无关地稳定地发芽和生长，并且介质的环境。解决方案：由于种子5和聚合物吸收材料6一起放置在设置在基材2中的籽壳部分上，并且种子壳体部分用覆盖膜7密封，聚合物吸附材料6吸附土壤中的水被埋在土壤中以增加其体积，并且可以肯定地破坏覆盖膜7以增加种子5的发芽率。版权所有（C）2011，JPO＆INPIT

9. 发明专利

JP2011108002A Ic card and method for manufacturing the same 审中-公开
标题翻译： IC卡及其制造方法
公开(公告)号：JP2011108002A
公开(公告)日：2011-06-02
申请号：JP2009262608
申请日：2009-11-18
申请人： Toppan Printing Co Ltd , 凸版印刷株式会社
发明人： IGARASHI SUSUMU , FUKAYA NAO , MATSUI HATSUNE
IPC分类号： G06K19/077 , B42D15/10
摘要： PROBLEM TO BE SOLVED: To provide an IC card having no problem in quality, hardly causing deformation and warping even in an environmental change and using vulcanized fiber plates. SOLUTION: The IC card equipped with an IC module having an external connection terminal includes a surface base material layer, a core base material layer and a rear base material layer. The surface base material layer and the rear base material layer comprise vulcanized fiber plates. A thickness of each vulcanized fiber plate is almost equal to that of an external connection terminal substrate. COPYRIGHT: (C)2011,JPO&INPIT

10. 发明专利

JP2007305652A Semiconductor package 审中-公开
标题翻译：半导体封装
公开(公告)号：JP2007305652A
公开(公告)日：2007-11-22
申请号：JP2006130047
申请日：2006-05-09
申请人： Toppan Printing Co Ltd , 凸版印刷株式会社
发明人： MATSUI HATSUNE , NAKAMURA KIYOTOMO
IPC分类号： H01L23/12
摘要： PROBLEM TO BE SOLVED: To provide a reliable semiconductor package that relieves thermal stress applied to a multilayer wiring board and a chip, and prevents the deformation and damage of the multilayer wiring board and chip in the semiconductor package.
SOLUTION: The semiconductor package comprises: the multilayer wiring board 2 where an insulating resin layer and a conductor layer are laminated; a semiconductor chip 1 joined to one surface of the multilayer wiring board 2 via a solder bump 4 electrically; underfill 5 that covers the solder bump 4, and fills the junction surface between the multilayer wiring board 2 and the semiconductor chip 1; and a stiffener 3, where the multilayer wiring board 2 is bonded onto the junction surface of the semiconductor chip 1 on the multilayer wiring board supportably. In the semiconductor package, the stiffener 3 is in a frame shape capable of storing the semiconductor chip 1 inside, and the shortest distance between the inner frame of the stiffener 3 and the outer periphery of the semiconductor chip 1 ranges from 0.5 mm to 2.9 mm.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种可靠的半导体封装，其减轻施加到多层布线板和芯片的热应力，并且防止半导体封装中的多层布线板和芯片的变形和损坏。解决方案：半导体封装包括：层叠绝缘树脂层和导体层的多层布线板2; 半导体芯片1，其经由焊料凸块4电连接到多层布线板2的一个表面; 底部填充物5，其覆盖焊料凸块4，并且填充多层布线板2和半导体芯片1之间的接合面; 以及加强件3，其中多层布线板2可支撑地接合到多层布线板上的半导体芯片1的接合面上。在半导体封装中，加强件3是能够将半导体芯片1内部存储的框架形状，并且加强件3的内框与半导体芯片1的外周之间的最短距离为0.5mm〜2.9mm 。版权所有（C）2008，JPO＆INPIT

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