专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2015032816A ピック、搬送装置、処理装置及び搬送方法审中-公开
标题翻译： PICK，输送装置，加工装置和输送方法
公开(公告)号：JP2015032816A
公开(公告)日：2015-02-16
申请号：JP2013164050
申请日：2013-08-07
申请人：東京エレクトロン株式会社 , Tokyo Electron Ltd
发明人： SAKAGAMI HIROMITSU
IPC分类号： H01L21/677
摘要：【課題】被処理体の搬送スループットを向上する。【解決手段】一実施形態に係るピックは、搬送アームに接続可能な基端部を有するベース部と、被処理体を下方から保持する複数の突起部であり、ベース部の一面上に設けられた該複数の突起部と、を備え、複数の突起は、複数の第一の突起部と一以上の第二の突起部とを含み、前記複数の第一の突起部は、前記一以上の第二の突起部の材料の耐熱性よりも高い耐熱性を有する材料から構成され、前記一以上の第二の突起部は、前記複数の第一の突起部の材料の摩擦係数よりも大きい摩擦係数を有する材料から構成され、前記複数の第一の突起部は、被処理体を保持するための第一の保持部を構成し、前記複数の第一の突起部の一部と前記一以上の第二の突起部とは、前記第一の保持部により被処理体を保持する領域から偏位した領域で被処理体を保持するための第二の保持部を構成する。【選択図】図2
摘要翻译：要解决的问题：提高工件的输送通过量。解决方案：一个实施例的拾取器包括：基部，包括可连接到输送臂的近端; 以及设置在所述基部的一个表面上的用于从下侧保持工件的多个突起。多个突起包括多个第一突起和一个或多个第二突起。多个第一突起由耐热性高于一个或多个第二突起的材料的材料形成。一个或多个第二突起由摩擦系数高于多个第一突起的材料的材料形成。多个第一突起形成用于保持工件的第一保持部，并且多个第一突起的一部分和一个以上的第二突起形成第二保持部，用于将工件保持在偏离工件的区域的区域由第一个持有部分持有。

2. 发明专利

JP2013042112A Substrate transfer apparatus, substrate processing system, substrate transfer method, and storage medium 有权
标题翻译：基板传输装置，基板处理系统，基板传送方法和存储介质
公开(公告)号：JP2013042112A
公开(公告)日：2013-02-28
申请号：JP2012077694
申请日：2012-03-29
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： SAKAGAMI HIROMITSU , OZAWA MASAHITO , FURUYA YUICHI , SHINODA NANAKO , HIROSE MASATO , INAGAKI MORIHITO
IPC分类号： H01L21/677 , B25J15/00
CPC分类号： H01L21/67739 , H01L21/67742 , H01L21/68707
摘要： PROBLEM TO BE SOLVED: To provide a substrate processing apparatus performing vacuum processing generating heat, which can improve location accuracy of a substrate even when the substrate is transferred at high speed.SOLUTION: A substrate transfer apparatus carrying a substrate in and carrying the substrate out with respect to a vacuum processing unit in which vacuum processing generating heat is performed, comprises: a positioning pin positioning the substrate; a pick holding the substrate in a positioned state; a drive part driving the pick so as to carry the substrate in and carry the substrate out by the pick with respect to the vacuum processing unit; and a transfer control part controlling a transfer operation of the substrate by the pick. The transfer control part preliminarily acquires reference position information of the substrate at an atmospheric temperature when the substrate is carried in the vacuum processing unit and calculates, in real processing, displacement of the substrate from a reference position to control the drive part so as to carry the substrate in the vacuum processing unit by correcting the displacement when the substrate is carried in the vacuum processing unit.
摘要翻译：要解决的问题：提供一种执行产生热量的真空处理的基板处理设备，即使当基板高速传送时，其也可以提高基板的定位精度。解决方案：一种基板传送装置，其相对于其中执行真空处理产生热量的真空处理单元携带衬底并携带衬底，包括：定位销定位衬底; 将基板保持在定位状态; 驱动所述拾取器的驱动部件，以便相对于所述真空处理单元将所述基板运送并由所述拾取器携带所述基板; 以及转印控制部，其通过所述拾取器来控制所述基板的转印动作。传送控制部分在真空处理单元中携带基板时，预先获取基板的大气温度下的基准位置信息，并且在实际处理中，基准位置计算基板与基准位置的位移，控制驱动部，通过在真空处理单元中承载基板时校正位移，在真空处理单元中的基板。版权所有（C）2013，JPO＆INPIT

3. 发明专利

JP2011171487A Substrate rear surface flattening method 审中-公开
标题翻译：基板表面平铺方法
公开(公告)号：JP2011171487A
公开(公告)日：2011-09-01
申请号：JP2010033483
申请日：2010-02-18
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： MATSUI HIDEAKI , MORIYA TAKESHI , TERASAWA NOBUTOSHI , SAKAGAMI HIROMITSU
IPC分类号： H01L21/027 , G03F7/20 , H01L21/302 , H01L21/304
CPC分类号： H01L21/302 , G03F1/60 , G03F1/82 , G11B7/261 , H01L22/12
摘要： PROBLEM TO BE SOLVED: To provide a substrate rear surface flattening method removing a fine scratch without damaging a rear surface of a substrate. SOLUTION: The position and size of the scratch S on the rear surface of the wafer W are detected, a cluster 29 of gas molecules 28 formed by gathering many gas molecules 28 is selectively sprayed to the scratch S whose position and size are detected, and a photo-resist 30 applied onto a front surface of the wafer W is exposed to light. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种在不损坏基板的后表面的情况下除去细小划痕的基板后表面平坦化方法。解决方案：检测晶片W的后表面上的划痕S的位置和尺寸，通过聚集许多气体分子28形成的气体分子28的簇29被选择性地喷射到其位置和尺寸为并且施加到晶片W的前表面上的光刻胶30曝光。版权所有（C）2011，JPO＆INPIT

4. 发明专利

JP2017084897A ロードロック装置における基板冷却方法、基板搬送方法、およびロードロック装置审中-公开
公开(公告)号：JP2017084897A
公开(公告)日：2017-05-18
申请号：JP2015209766
申请日：2015-10-26
申请人：東京エレクトロン株式会社 , Tokyo Electron Ltd
发明人： SAKAGAMI HIROMITSU , OKANO SHINYA
IPC分类号： H01L21/205 , C23C16/44 , H01L21/677
CPC分类号： H01L21/67109 , H01L21/67167 , H01L21/67173 , H01L21/67201 , H01L21/67742
摘要：【課題】ロードロック装置内で基板の反りを効果的にかつ十分に回復させつつ、基板を高効率で冷却することができる技術を提供する。【解決手段】ロードロック装置において高温の基板を冷却する基板冷却方法は、容器内を第2の圧力に保持し、容器と第2のモジュールとを連通して、高温の基板を容器内へ搬入する工程と、基板を冷却部材に近接した冷却位置に位置させる工程と、容器内の圧力が、冷却部材表面と基板裏面との間の領域が分子流条件を満たす第3の圧力となるように容器内を排気する工程と、容器内にパージガスを導入して容器内の圧力を第1の圧力に上昇させ、その過程で冷却部材からの伝熱により基板を冷却する工程とを有する。【選択図】図5

5. 发明专利

JP2012119626A Load lock device 审中-公开
标题翻译：负载锁定装置
公开(公告)号：JP2012119626A
公开(公告)日：2012-06-21
申请号：JP2010270471
申请日：2010-12-03
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： KOBAYASHI NORIHISA , SAKAGAMI HIROMITSU
IPC分类号： H01L21/683
摘要： PROBLEM TO BE SOLVED: To provide a load lock device capable of efficiently cooling a substrate to increase throughput of substrate processing.SOLUTION: A load lock device comprises: a vessel 31 provided so as to be variable in pressure in a range between pressure corresponding to that of a vacuum chamber 5 and atmospheric pressure; a purge gas supplying mechanism 48 for supplying a purge gas into the vessel 31; an exhaust mechanism 44 for exhausting the inside of the vessel 31; a pressure adjustment mechanism 49 for adjusting pressure inside the vessel 31 to pressure corresponding to that of the vacuum chamber 5 when the inside of the vessel 31 is communicated with the vacuum chamber 5, and adjusting the pressure inside the vessel 31 to the atmospheric pressure when the inside of the vessel 31 is communicated with a space having the atmosphere; a cooling member 32 provided in the vessel 31, for cooling a substrate adjacently disposed or placed thereon; and a heat absorbing layer 61 provided at a position opposing to the substrate adjacently disposed or placed on the cooling member 32, for absorbing radiation heat from the substrate.
摘要翻译：要解决的问题：提供能够有效地冷却基板以增加基板处理的生产量的负载锁定装置。解决方案：一种装载锁定装置，包括：容器31，设置成在与真空室5的压力和大气压力相对应的压力范围内可变压力; 吹扫气体供给机构48，用于将吹扫气体供给到容器31中; 用于排出容器31内部的排气机构44; 压力调节机构49，用于当容器31的内部与真空室5连通时将容器31内的压力调节到与真空室5相对应的压力，并且当容器31内部的压力调节到大气压时，容器31的内部与具有大气的空间连通; 设置在容器31中的用于冷却相邻设置或放置在其上的衬底的冷却构件32; 以及设置在与衬底相对设置或放置在冷却构件32上的位置处的吸热层61，用于吸收来自衬底的辐射热。版权所有（C）2012，JPO＆INPIT

6. 发明专利

JP2011119468A Conveying method of workpiece, and workpiece treating apparatus 审中-公开
标题翻译：工作的输送方法和工件处理装置
公开(公告)号：JP2011119468A
公开(公告)日：2011-06-16
申请号：JP2009275615
申请日：2009-12-03
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： SAKAGAMI HIROMITSU
IPC分类号： H01L21/677 , B65G49/07 , H01L21/205 , H01L21/3065
CPC分类号： H01L21/67745 , H01L21/67276
摘要： PROBLEM TO BE SOLVED: To provide a conveying method of a workpiece suppressing a situation causing upper limit of productivity even when a treatment time in various treatment is shortened.
SOLUTION: A treatment chamber is structured to treat n workpieces simultaneously (n is a natural number of 2 or more). A conveying device is configured to hold the (n+1) or more workpieces. The conveying method includes a process for conveying the n workpieces before treatment from a load lock chamber to a conveying chamber by using the conveying device; (1) a process for conveying at least one treated workpiece from the treatment chamber to the conveying chamber by using the conveying device; and (2) a process for conveying at least one workpiece before treatment held on the conveying device, from the conveying chamber to the treatment chamber by using the conveying device. The processes (1) and (2) are repeated until the treated workpieces housed in the treatment chamber are totally replaced with the workpieces before treatment held on the conveying device (the process 2).
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：即使在各种处理中的处理时间缩短时，也提供抑制产生生产上限生产率的情况的工件的输送方法。解决方案：处理室被构造成同时处理n个工件（n是2或更多的自然数）。输送装置构造成保持（n + 1）个或更多的工件。输送方法包括通过使用输送装置将处理前的n个工件从负载锁定室输送到输送室的处理; （1）通过使用输送装置将至少一个经处理的工件从处理室输送到输送室的处理; 以及（2）通过使用所述输送装置从所述输送室向所述处理室输送在所述输送装置上保持的处理前的至少一个工件的处理。重复方法（1）和（2），直到被处理的处理室内被处理的工件在运送装置处理之前被完全替换为工件（方法2）。版权所有（C）2011，JPO＆INPIT

7. 发明专利

JP2012174716A Transfer method for workpiece and workpiece processing apparatus 有权
标题翻译：工作和工件加工设备的转移方法
公开(公告)号：JP2012174716A
公开(公告)日：2012-09-10
申请号：JP2011032081
申请日：2011-02-17
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： SAKAGAMI HIROMITSU
IPC分类号： H01L21/677 , H01L21/205 , H01L21/3065
CPC分类号： G05B19/4189 , H01L21/67742 , H01L21/67745
摘要： PROBLEM TO BE SOLVED: To provide a transfer method for workpiece which suppresses the state in which the productivity hits the peak even when processing times of various processes are shortened.SOLUTION: The transfer method for workpiece includes the processes of: extending and contracting a first transfer arm to make a first pick 35a receive a workpiece (a), having been processed, which is stored in a processing chamber 32a; swiveling first and second transfer arms to move a second pick 35b holding a workpiece (1) to be processed to a delivery position set before the processing chamber 32a and also to move the first pick 35a holding the workpiece (a) having been processed to a position adjoining the delivery position set before a load lock chamber 41b; extending and contracting the second transfer arm to store the workpiece (1) to be processed which is held by the second pick 35b in the processing chamber 32a; and swiveling the second transfer arm to move the second pick 35b which holds no workpiece to the delivery position set before the load lock chamber 41b.
摘要翻译：要解决的问题：即使在缩短了各种处理的处理时间的同时，也提供抑制生产率达到峰值的状态的工件的转印方法。解决方案：工件的传送方法包括以下过程：延伸和收缩第一传送臂以使第一拾取器35a接收被处理的工件（a），其被存储在处理室32a中; 旋转第一和第二传送臂以将保持要处理的工件（1）的第二拾取器35b移动到处理室32a之前设置的传送位置，并且还将保持被处理的工件（a）的第一拾取器35a移动到位于与负载锁定室41b之前设定的输送位置相邻的位置; 延伸和收缩第二传送臂，以将由第二拾取器35b保持的待处理工件（1）存储在处理室32a中; 并且使第二传送臂旋转以将不保持工件的第二拾取器35b移动到在装载锁定室41b之前设置的传送位置。版权所有（C）2012，JPO＆INPIT

8. 发明专利

JP2012069793A Substrate support device and thermal treatment device 审中-公开
标题翻译：基板支撑装置和热处理装置
公开(公告)号：JP2012069793A
公开(公告)日：2012-04-05
申请号：JP2010214110
申请日：2010-09-24
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： SAKAGAMI HIROMITSU , HORIUCHI TAKASHI , SAITO MISAKO , FUJIWARA KAORU , TAMURA AKITAKE
IPC分类号： H01L21/683 , H01L21/205 , H01L21/3065 , H01L21/31
摘要： PROBLEM TO BE SOLVED: To suppress the generation of scratches and the generation of particles on a back surface of a substrate due to contact of the substrate and a support device when horizontally supporting the substrate from the back surface side by the support device.SOLUTION: Rolling bodies 42 each including a core material 42a comprising a magnetic body and a covering material 42b covering the outer peripheral side of the core material 42a are freely rollably housed inside a plurality of recesses 41 formed on a support body 31, a wafer W is horizontally supported from the back surface side by the upper surfaces of the rolling bodies 42, and position regulating mechanisms 43 are provided on the lower side of the recesses 41. Then, the respective position regulating mechanisms 43 are configured such that the rolling bodies 42 roll opposing the drawing force of the position regulating mechanisms 43 imitating the movement of the wafer W when the wafer W mounted on the support body 31 is moved in the horizontal direction, and the rolling bodies 42 return to the upper side of the position regulating mechanisms 43 when the wafer W is not mounted on the support body 31.
摘要翻译：要解决的问题：为了抑制由于基板和支撑装置的接触而在基板的背面产生划痕和产生颗粒，当通过支撑装置从背面侧水平地支承基板时。解决方案：包括包括磁性体的芯材42a和覆盖芯材42a的外周侧的覆盖材料42b的滚动体42可自由地滚动地容纳在形成在支撑体31上的多个凹部41内，通过滚动体42的上表面从后表面侧水平地支撑晶片W，并且在凹部41的下侧设置有位置调节机构43.然后，各个位置限制机构43被构造成当安装在支撑体31上的晶片W沿水平方向移动时，滚动体42相对于模拟晶片W的移动的位置限制机构43的拉伸力滚动，并且滚动体42返回到当晶片W未安装在支撑体31上时，位置调整机构43.版权所有（C）2012，JPO＆INPIT

9. 发明专利

JP2011174108A Cooling apparatus and substrate processing apparatus having the same 审中-公开
标题翻译：冷却装置及其基板加工装置
公开(公告)号：JP2011174108A
公开(公告)日：2011-09-08
申请号：JP2010037274
申请日：2010-02-23
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： SAKAGAMI HIROMITSU , YAGI HIRONORI
IPC分类号： C23C14/50 , C23C16/54 , H01L21/31 , H01L21/683
摘要： PROBLEM TO BE SOLVED: To provide a cooling apparatus cooling a heated object to be processed while suppressing warp of the object to be processed (hereinafter called as workpiece).
SOLUTION: The cooling apparatus includes a lower cooling member 101, an upper cooling member 102 provided above the lower cooling member 101, and a workpiece elevating/lowering mechanism 103 for elevating/lowering the workpiece W between the lower cooling member 101 and the upper cooling member 102. The workpiece is brought close to the lower cooling member 101 while the space d1 between the workpiece W and the lower cooling member 101 and the space d2 between the workpiece W and the upper cooling member 102 are made equal to each other.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种冷却装置来冷却被处理物体，同时抑制待处理物体的翘曲（以下称为工件）。解决方案：冷却装置包括下部冷却构件101，设置在下部冷却构件101上方的上部冷却构件102，以及用于在下部冷却构件101与下部冷却构件101之间升降工件W的工件升降机构103。上部冷却构件102.工件靠近下部冷却构件101，同时将工件W和下部冷却构件101之间的空间d1与工件W和上部冷却构件102之间的空间d2设定为等于每个其他。版权所有（C）2011，JPO＆INPIT

10. 发明专利

JP2011129610A Transfer device and target object processing apparatus including the same 审中-公开
标题翻译：传输设备和目标对象处理设备，包括它们
公开(公告)号：JP2011129610A
公开(公告)日：2011-06-30
申请号：JP2009284823
申请日：2009-12-16
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： SAKAGAMI HIROMITSU , OZAWA MASAHITO , IIZUKA YOJI
IPC分类号： H01L21/677
CPC分类号： H01L21/67742
摘要： PROBLEM TO BE SOLVED: To provide a transfer device that has a simple structure and can solve a problem in which an increase in the productivity is limited even when a processing time in a processing apparatus is shortened. SOLUTION: The transfer device includes a first transfer mechanism 33a including a first shaft 35a which is rotatable and vertically extended and a horizontally extensible and retractable first arm 39a having at a leading end thereof a first pick 40a for holding a processing target object W, the first arm being attached to the first shaft; and a second transfer mechanism 33b including a second shaft 35b which is rotatable and vertically extended and a horizontally extensible and retractable second arm 39b having at a leading end thereof a second pick 40b for holding a processing target object W, the second arm being attached to the second shaft. The first and the second transfer mechanism 33a and 33b are vertically separated from each other while a rotation center 42a of the first shaft 35a and a rotation center 42b of the second shaft 35b coincide with each other. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：解决的问题：提供一种具有简单结构的转移装置，并且能够解决即使在缩短处理装置中的处理时间的情况下生产率的提高也受到限制的问题。解决方案：传送装置包括第一传送机构33a，其包括可旋转和垂直延伸的第一轴35a和水平可伸缩的第一臂39a，其第一臂39a的前端具有用于保持加工对象物体的第一拾取40a W，第一臂连接到第一轴; 以及包括可旋转和垂直延伸的第二轴35b的第二传送机构33b和在其前端具有用于保持处理对象物W的第二拾取40b的水平伸缩的第二臂39b，第二臂附接到第二轴。当第一轴35a的旋转中心42a和第二轴35b的旋转中心42b彼此重合时，第一和第二传送机构33a和33b彼此垂直分离。版权所有（C）2011，JPO＆INPIT

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式