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    • 7. 发明专利
    • MANUFACTURE OF SILICON THIN-FILM TRANSISTOR
    • JPH07142733A
    • 1995-06-02
    • JP29208893
    • 1993-11-22
    • TOSHIBA CORPTOSHIBA ELECTRONIC ENG
    • KASHIMOTO NOBORU
    • H01L29/78H01L29/786
    • PURPOSE:To thin only the silicon layer in a channel section and to lessen the dispersion of film thickness by forming the silicon layer on a substrate, forming an oxide film on the surface of the silicon layer after that, exfoliating the oxide layer in a region of a part to be the channel, and forming an oxide layer again after that. CONSTITUTION:First of all, a polycrystalline silicon film 102 is formed on an insulating substrate 101, and the silicon film 102 is patterned into the shape of an island to form a polycrystalline silicon island 103. The surface of the silicon island 103 is thermally oxidized to form a thermal oxidation film 104, and a part to be a channel of the thermal oxidation film is exfoliated. Furthermore, a thermal oxidation film 105 is formed by thermal oxidation, and all the thermal oxidation films formed on the polycrystalline silicon are exfoliated and a recessed polycrystalline silicon film 106 is formed. Accordingly, the oxide film in the source and drain regions is oxidized from the state that the oxide film has been formed already at the time of the second thermal oxidation, so their intrusion into the polycrystralline silicon is less than that of the oxide film in the channel region.