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1. 发明专利

JP2002190460A POLISHING CLOTH, POLISHING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 审中-公开
公开(公告)号：JP2002190460A
公开(公告)日：2002-07-05
申请号：JP2001210856
申请日：2001-07-11
申请人： TOSHIBA CORP , NOF CORP
发明人： HIRABAYASHI HIDEAKI , SAITO AKIKO , SAKURAI NAOAKI , OSHIBE YOSHIHIRO , ISHIDOYA MASAHIRO
IPC分类号： B24B37/20 , B24B37/24 , B24B49/16 , B24D3/00 , B24D3/28 , B24D3/34 , B24D11/00 , B24D13/14 , C08F20/28 , C08F22/20 , C08F24/00 , C08F30/08 , C08J5/14 , C08K3/22 , C08K3/36 , C08L101/02 , C08L101/14 , H01L21/304 , B24B37/00
摘要： PROBLEM TO BE SOLVED: To provide a polishing cloth, capable of performing stable polishing for a relatively long time without dressing. SOLUTION: The polishing cloth comprises a polishing layer, containing a polymer material such as α,β-unsaturated homopolymer or copolymer or the like to be hydrolyzed by water medium.

2. 发明专利

JP2000319267A TRIS(2-CARBOXYETHYL)ISOCYANURATE DERIVATIVE 失效
公开(公告)号：JP2000319267A
公开(公告)日：2000-11-21
申请号：JP12313099
申请日：1999-04-28
申请人： NOF CORP
发明人： SATO ATSUSHI , NAKANISHI FUTOSHI , SATO HIROSHI , ISHIDOYA MASAHIRO
IPC分类号： C07D251/34 , C09D175/04
摘要： PROBLEM TO BE SOLVED: To obtain a new compound excellent in solubility to organic solvents and compatibility with various resins, and useful as e.g. a curing agent for one-part curable compositions by modifying with a specific vinyl ether compound the carboxyl group of tris(2-carboxyethyl)isocyanurate. SOLUTION: This new compound is a compound of formula I (R1 to R3 are each H or a 1-18C organic group; R4 is a 1-18C organic group; R3 and R4 may be bound to each other to form a heterocyclic ring with Y1 as heteroatom; Y1 is O or S), e.g. a compound of formula II. The compound of formula I is obtained by reaction between tris(2-carboxyethyl)isocyanurate and a vinyl ether compound of formula III (e.g. n-propylvinyl ether) in the equivalent ratio of the carboxyl group of the former to the vinyl ether group of the latter of pref. (1:1) to (1:1.2) pref. at 50-100 deg.C normally for 1-100 h, optionally in the presence of an acid catalyst.

3. 发明专利

JPH11246543A CARBOXYL COMPOUND DERIVATIVE 失效
公开(公告)号：JPH11246543A
公开(公告)日：1999-09-14
申请号：JP12543098
申请日：1998-03-05
申请人： NOF CORP
发明人： SATO HIROSHI , ISHIDOYA MASAHIRO
IPC分类号： C07D307/89 , C08K5/15 , C08L101/00 , C09D7/12 , C09D11/00 , C09J201/00
摘要： PROBLEM TO BE SOLVED: To obtain a new carboxyl compound derivative having excellent solubility in an organic solvent or compatibility with various resins and useful for giving a hardenable composition utilizable as a one-pack type by combining them, by reacting a specific compound with a monovinyl ether compound. SOLUTION: This derivative has a piece of functional group of formula I (R to R are each H or a 1-18C organic group; R is a 1-18C organic group; Y is O or S) and more than one acid anhydride group in a molecule, and is a compound of formula II. Preferably, the objective compound is obtained by reacting a carboxylic compound (e.g. trimellitic acid anhydride) having a piece of carboxylic group and more than a piece of acid anhydride group in a molecule with a monovinyl ether compound (e.g. isobutylvinyl ether) in an organic solvent such as benzene in the presence of an acid catalyst in the temp. range from room temperature to 150 deg.C.

4. 发明专利

JPH11140027A AROMATIC POLYCARBOXYLIC ACID DERIVATIVE 失效
公开(公告)号：JPH11140027A
公开(公告)日：1999-05-25
申请号：JP30520997
申请日：1997-11-07
申请人： NOF CORP
发明人： SATO HIROSHI , ISHIDOYA MASAHIRO
IPC分类号： C07C69/80 , C08K5/12
摘要： PROBLEM TO BE SOLVED: To obtain a new aromatic polycarboxylic acid derivative which has excellent solubility to organic solvent(s) and compatibility to various resins, and is useful as a curing agent which is a heat curing composition which is suitable for coating material, ink, adhesive, molded article, and so on, having excellent chemical and physical properties. SOLUTION: The derivative shown by formula I (R is a 1-8C alkyl: (n) is 1-3) (e.g. bis(methylethoxymethyl) terephthalate) is obtained by the reaction of an aromatic polycarboxylic acid, for example, shown by formula II (e.g. orthophthalic acid, isophthalic acid, terephthalic acid) with a vinyl ether shown, for example, by formula III (e.g. methyl vinyl ether, ethyl vinyl ether), preferably, at room temperature to 150 deg.C in the presence of an acid catalyst, for example, an acidic phosphate ester shown by formula IV (R is a 3-10 alkyl, a cycloalkyl, and so on; (m) is 1 car 2) (e.g. phosphoric acid monoester or diester of n-propanol or n-butanol).

5. 发明专利

JPH11130983A REACTIVE RESIN AND CURABLE RESIN COMPOSITION CONTAINING IT 失效
公开(公告)号：JPH11130983A
公开(公告)日：1999-05-18
申请号：JP29690797
申请日：1997-10-29
申请人： NOF CORP
发明人： NIIMURA KAZUHIKO , NAKANISHI FUTOSHI , ISHIDOYA MASAHIRO
IPC分类号： C08G59/14 , C08G59/40 , C09D5/00 , C09D11/023 , C09D11/033 , C09D11/037 , C09D11/10 , C09D11/102 , C09D163/00 , C09J163/00
摘要： PROBLEM TO BE SOLVED: To provide a reactive resin with good storage stability in such a state as dissolved or dispersed in an aq. medium and to provide a curable resin compsn., especially a water-based curable resin compsn, which gives a cured substance having excellent curing characteristics, anticorrosion, and water- resistance. SOLUTION: A reactive resin (A) which is soluble or dispersible in water, comprises a substrate of a polyphenol-type epoxy resin, and has in the mol., on the average, at least one cyclocarbonate group, a tertiary amino group and/or a secondary amino group. A curable resin compsn. contains the reactive resin (A), a compd. having in the mol., on the average, two or more ketimine groups, and an acid-neutralizing agent. Similarly, the compsn. contains the reactive resin (A) and a compd. having in the mol., on the average, two or more primary amino groups.

6. 发明专利

JPH11349979A AQUEOUS CUTTING FLUID, AQUEOUS CUTTING AGENT AND CUTTING OF HARD AND BRITTLE MATERIAL USING THE SAME 失效
公开(公告)号：JPH11349979A
公开(公告)日：1999-12-21
申请号：JP33337398
申请日：1998-11-10
申请人： NOF CORP , FUJIMI INC
发明人： ITO KENJI , MAEMICHI SHUNJI , NAKANISHI FUTOSHI , ISHIDOYA MASAHIRO , TANAKA TAKASHI , NAKAMICHI TOSHIHIKO , MORI KAZUYUKI , HAYASHI SHIGEHIRO , YOKOYAMA HIDEKI
IPC分类号： B28D5/04 , B28D1/02 , C10M125/26 , C10M125/30 , C10M149/14 , C10M173/02 , C10N20/02 , C10N30/02 , C10N30/04 , C10N40/22
摘要： PROBLEM TO BE SOLVED: To obtain an aqueous cutting fluid excellent in disperse stability and viscosity stability of abrasive grains and especially effective for wire saws and an aqueous cutting fluid usable therefor and provide a method for cutting hard and brittle materials excellent in processing accuracy, washing property, etc., of material to be cut. SOLUTION: This cutting fluid comprises a cationic water-soluble resin having 20-200 mg KOH/g amine value and at least one or more kinds of viscosity adjusters selected from inorganic and organic bentonite and aqueous silica sol and has nonvolatile substance content of the viscosity adjuster in an amount of 0.1-30 wt.% based on nonvolatile substance content of the cationic water-soluble resin. This method for cutting crustaceous materials comprises cutting hard and brittle materials with a cutter by using an aqueous cutting fluid obtained by adding abrasive grains to the above aqueous cutting fluid so that the content of the abrasive grains becomes 100-1,000 wt.% based on the nonvolatile substance content of the aqueous cutting fluid.

7. 发明专利

JPH09221509A COATING COMPOSITION 失效
公开(公告)号：JPH09221509A
公开(公告)日：1997-08-26
申请号：JP2698796
申请日：1996-02-14
申请人： NOF CORP
发明人： ISHIDOYA MASAHIRO , MIZUTANI HIROKI , ISHIGAKI HIDEYO
IPC分类号： C08F4/36 , C08F4/28 , C09D153/00
摘要： PROBLEM TO BE SOLVED: To provide a coating composition which can give coating films excellent in transparency, surface gloss, smoothness and mechanical strengths. SOLUTION: This composition contains a block copolymer prepared by block- copolymerizing an ethylenically unsaturated monomer having at least one reactive functional group selected from the group consisting of hydroxyl, carboxyl, acid anhydride, epoxy, alkoxysilyl and aminomethylol groups with an ethylenically unsaturated monomer free from any reactive functional group in the presence of a radical polymerization initiator comprising a polymeric peroxide represented by the formula (wherein n is 3-30). The copolymer is desirably prepared by a two-stage solution polymerization process. The composition may further contain at least one curing agent selected from among aminoplant resins, polyisocyanate compounds, polyepoxide compounds and polycarboxylic acid compounds.

8. 发明专利

JP2001262076A ROSIN DERIVATIVE 失效
公开(公告)号：JP2001262076A
公开(公告)日：2001-09-26
申请号：JP2000079573
申请日：2000-03-22
申请人： NOF CORP
发明人： SAITO TAKASHI , SATO ATSUSHI , SATO HIROSHI , ISHIDOYA MASAHIRO
IPC分类号： C09F1/04 , C08H99/00 , C08H5/00
摘要： PROBLEM TO BE SOLVED: To provide a rosin derivative highly soluble in organic solvents in general, compatible with various kinds of resins, and suitable for use in soldering flux or soldering paste for soldering parts to curable compositions, packaging substrates, or the like excellent in chemical and physical performances by modifying rosin which is naturally hardly soluble. SOLUTION: The rosin derivative is produced by modifying a carboxy group of abietic acid contained in rosin by use of a vinyl ether compound or a vinyl thioehter compound.

9. 发明专利

JP2001261620A ROSIN DERIVATIVE CONTAINING ABIETIC ACID POLYFUNCTIONAL VINYL (THIO)ETHER DERIVATIVE 失效
公开(公告)号：JP2001261620A
公开(公告)日：2001-09-26
申请号：JP2000079561
申请日：2000-03-22
申请人： NOF CORP
发明人： SAITO TAKASHI , SATO ATSUSHI , SATO HIROSHI , ISHIDOYA MASAHIRO
IPC分类号： C07C69/753
摘要： PROBLEM TO BE SOLVED: To obtain a rosin derivative suitable for a curable composition excellent in solubility in usual organic solvents and compatibility with various resins and further chemical and physical performances or a soldering flux and a solder paste when a part is mounted on a mount board, etc., by modifying rosin which is sparingly soluble. SOLUTION: The carboxyl group of abietic acid contained in the rosin is modified with a polyvinyl ether compound or a polyvinyl thioether compound.

10. 发明专利

JP2001239395A THERMOSETTING FLUX, SOLDERING METHOD, AND SUBSTRATE WITH ELECTRONIC PART 失效
公开(公告)号：JP2001239395A
公开(公告)日：2001-09-04
申请号：JP2000053724
申请日：2000-02-29
申请人： TDK CORP , NOF CORP
发明人： ABE TOSHIYUKI , ISHIDOYA MASAHIRO , SATO ATSUSHI , SAITO TAKASHI
IPC分类号： B23K35/363 , B23K35/26 , C08G59/42 , C08K3/08 , C08L63/00 , C08L67/00 , C08L101/08 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide thermosetting flux, soldering method, and a substrate with electronic parts which has an ability to improve joint strength between electronic parts and the substrate even after soldering. SOLUTION: The soldering method uses thermosetting flux provided for soldering, which includes (A) a compound which has one more shadow carboxyl group in a molecule and (B) a compound which has two more reacting sensory groups able to be chemically bonded with carboxyl groups by heating in a molecule.

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