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1. 发明专利

JP2013191888A Damage index prediction system and damage prediction method 有权
标题翻译：损伤指标预测系统和损伤预测方法
公开(公告)号：JP2013191888A
公开(公告)日：2013-09-26
申请号：JP2013129353
申请日：2013-06-20
申请人： Toshiba Corp , 株式会社東芝
发明人： KADOTA TOMOKO , MUKAI MINORU , HIROHATA KENJI
IPC分类号： H05K3/34 , G01R31/26 , H05K13/08
摘要： PROBLEM TO BE SOLVED: To provide a damage index prediction system of an electronic apparatus capable of highly accurately performing damage prediction of mounting components or the like on a circuit board.SOLUTION: A damage index prediction system is a damage prediction system that predicts an index associated with damage of a joining portion of an electronic apparatus having a joining portion for electrically connecting electronic components to a mounting circuit board and a detection joining portion designed to have a life shorter than that of the joining portion. The damage index prediction system comprises: a damage detection section for acquiring information associated with damage of the detection joining portion; and an arithmetic section for calculating a prediction value of the index associated with the damage of the joining portion from the information associated with the damage of the detection joining portion acquired by the damage detection section and a relation between an index associated with the damage of the detection joining portion and the index associated with the damage of the joining portion.
摘要翻译：要解决的问题：提供能够高精度地对电路板上的安装部件等进行损伤预测的电子设备的损伤指数预测系统。解决方案：损伤指标预测系统是预测指标的损伤预测系统与具有用于将电子部件电连接到安装电路板的接合部分的电子设备的接合部分和被设计为具有比接合部分的寿命短的寿命的检测接合部分的接合部分的损坏相关联。损伤指标预测系统包括：损伤检测部，用于获取与检测接合部的损伤相关的信息; 以及算术部，用于根据由损伤检测部获取的与检测接合部的损伤相关的信息计算与接合部的损伤有关的指标的预测值，以及与损伤检测部的损伤有关的指标之间的关系检测接合部分和与接合部分的损伤有关的指标。

2. 发明专利

JP2013015542A Method for predicting lifetime of solder joint part, device for predicting lifetime of solder joint part, and electronic apparatus 有权
标题翻译：用于预测焊接接头零件的寿命的方法，用于预测焊接点的寿命的装置和电子装置
公开(公告)号：JP2013015542A
公开(公告)日：2013-01-24
申请号：JP2012235607
申请日：2012-10-25
申请人： Toshiba Corp , 株式会社東芝
发明人： OMORI TAKAHIRO , HIROHATA KENJI , KADOTA TOMOKO , HIRAOKA KATSUAKI , MUKAI MINORU
IPC分类号： G01N17/00
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a method and device for predicting the lifetime of a solder joint part, which accurately evaluates the lifetime of a joint part in consideration of the reduction of rigidity due to advance of damage in individual solder joint parts, and to provide an electronic apparatus.SOLUTION: The method for predicting the lifetime of a solder joint part includes the steps of: referring to history information of a temperature of a measurement target including a solder joint part; examining at least one of physical quantities of an amplitude of temperature variation, the number of cycles, an average temperature, and a period by cycle counting in accordance with the history information of the temperature; calculating a distortion range from at least one of the physical quantities examined by cycle counting by using a preliminarily generated response curved surface; and calculating a distortion range increase rate by referring to a preliminarily obtained damage value and a distortion variation history of the distortion range in accordance with the distortion range.
摘要翻译：要解决的问题：提供一种用于预测焊接部件的寿命的方法和装置，其可以考虑到由于单个焊接部件中的损坏的进展而导致的刚度的降低来准确地评估接头部件的寿命，并提供电子设备。解决方案：用于预测焊接部件的寿命的方法包括以下步骤：参考包括焊接部分的测量目标的温度的历史信息; 根据温度的历史信息，检查温度变化幅度，循环次数，平均温度和周期计数的物理量中的至少一个; 通过使用预先生成的响应曲面来计算通过循环计数检查的物理量中的至少一个的失真范围; 以及根据失真范围参考预先获得的损伤值和失真范围的畸变变化历史来计算失真范围增加率。版权所有（C）2013，JPO＆INPIT

3. 发明专利

JP2010237854A Memory device 有权
标题翻译：内存设备
公开(公告)号：JP2010237854A
公开(公告)日：2010-10-21
申请号：JP2009083345
申请日：2009-03-30
申请人： Toshiba Corp , 株式会社東芝
发明人： HIROHATA KENJI , YONEZAWA MINORU , MORITA CHIE , NISHIKAWA TAKEICHIRO , NAKATSUGAWA MINORU , MUKAI MINORU
IPC分类号： G06F12/16 , G06F3/06
CPC分类号： G06F11/008 , G06F3/0616 , G06F3/0625 , G06F3/0631 , G06F3/0685 , Y02D10/154
摘要： PROBLEM TO BE SOLVED: To distribute data in consideration of the total system failure occurrence risk including not only a deterioration failure of a memory cell but also a fatigue crack in a joint location made of solder or the like or in an interconnection.
SOLUTION: The storage device includes: a table that represents a failure occurrence probability of a failure occurrence portion address in a data storage area; a first module 12 for calculating the failure occurrence risk index for each data storage area address; and a second module 10 for generating a distribution table for distributing data to addresses so that a power saving index of each data storage area address, and an access speed index required for accessing each data storage area address per a unit data volume satisfy a constraint condition and the failure occurrence risk index is minimized, and for distributing data to addresses according to the distribution table.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：考虑到总体系统故障发生风险来分发数据，不仅包括存储单元的劣化故障，还包括由焊料等制成的接合位置或互连中的疲劳裂纹。解决方案：存储装置包括：表示数据存储区域中故障发生部分地址的故障发生概率的表; 用于计算每个数据存储区域地址的故障发生风险指数的第一模块12; 以及第二模块10，用于生成用于将数据分配到地址的分发表，使得每个数据存储区域的功率节省指数和每单位数据卷访问每个数据存储区域地址所需的访问速度指数满足约束条件并且故障发生风险指数被最小化，并且用于根据分布表将数据分发到地址。版权所有（C）2011，JPO＆INPIT

4. 发明专利

JP2010205821A Electronic apparatus and connection failure detecting method of electronic component using electronic apparatus 有权
标题翻译：使用电子设备的电子元件的电子设备和连接故障检测方法
公开(公告)号：JP2010205821A
公开(公告)日：2010-09-16
申请号：JP2009047912
申请日：2009-03-02
申请人： Toshiba Corp , 株式会社東芝
发明人： KADOTA TOMOKO , MUKAI MINORU , HIROHATA KENJI , OMORI TAKAHIRO
IPC分类号： H05K3/34
摘要： PROBLEM TO BE SOLVED: To detect breakage in a junction which joins a circuit board to an electronic component with sufficient accuracy in advance.
SOLUTION: An electronic apparatus includes: a chip component 11 which includes external electrodes; a first solder joint 16-1 for chip which is formed on a first and a second electrode pads 15-1 and 15-2 and is joined to one external electrode 13; a second solder joint 16-2 for chip which is formed on a third electrode pad 15-3 and is joined to the other external electrode 13; and a resistance measuring circuit 18 which is formed on a circuit board 14 and measures a resistance between the first and the second electrode pads 15-1 and 15-2. The first electrode pad 15-1 is formed so that the breakage life of the first solder joint 16-1 for chip determined by the area of the first electrode pad 15-1 become shorter than the breakage life of a solder joint for a semiconductor package which mounts the semiconductor package on the circuit board 14 in the proximity of the chip component 11.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：预先检测将电路板与电子部件接合的结的断裂是否足够准确。电子设备包括：芯片部件11，其包括外部电极; 形成在第一和第二电极焊盘15-1和15-2上并与一个外部电极13接合的用于芯片的第一焊料接头16-1; 形成在第三电极焊盘15-3上并与另一个外部电极13接合的芯片的第二焊点16-2; 以及电阻测量电路18，其形成在电路板14上并测量第一和第二电极焊盘15-1和15-2之间的电阻。第一电极焊盘15-1被形成为使得由第一电极焊盘15-1的面积确定的用于芯片的第一焊料接头16-1的断裂寿命变得短于用于半导体封装的焊接接头的断裂寿命其将半导体封装安装在芯片组件11附近的电路板14上。版权所有（C）2010，JPO＆INPIT

5. 发明专利

JP2009170647A Circuit board support structure for electronic apparatus 有权
标题翻译：电路板电路板支持结构
公开(公告)号：JP2009170647A
公开(公告)日：2009-07-30
申请号：JP2008006867
申请日：2008-01-16
申请人： Toshiba Corp , 株式会社東芝
发明人： KADOTA TOMOKO , MUKAI MINORU
IPC分类号： H05K7/14
CPC分类号： H05K1/0268 , H05K1/116 , H05K3/3447 , H05K7/142 , H05K2201/09663 , H05K2201/10598
摘要： PROBLEM TO BE SOLVED: To provide an electronic apparatus capable of keeping reliability in the joint part of an electronic component.
SOLUTION: A circuit board support structure for the electronic component includes: a first case body with a first boss part formed therein; a second case body where a second boss part is formed and a second boss part is fastened to the first boss part with the use of a screw member; a jig having a cylindrical part and a flange part formed in the outer periphery of the cylindrical part, wherein the first boss part and the second boss part are slidable on the inner peripheral wall in the cylindrical part; and the circuit board where a hole part penetrating the cylindrical part of the jig is formed, and a joint area to be soldered with the flange part is arranged in the circumference of the hole part, and which is arranged inside the case bodies composed of the first and second case bodies.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够保持电子部件的接合部的可靠性的电子设备。解决方案：用于电子部件的电路板支撑结构包括：第一壳体，其中形成有第一凸台部; 第二壳体，其中形成有第二凸台部，并且使用螺钉构件将第二凸台部紧固到第一凸台部; 具有圆柱形部分和形成在圆柱形部分的外周中的凸缘部分的夹具，其中第一凸台部分和第二凸台部分可在圆柱形部分的内周壁上滑动; 并且形成穿过夹具的圆筒部的孔部的电路基板，并且在孔部的圆周上配置有与凸缘部焊接的接合区域，并且布置在由壳体第一和第二案件机构。版权所有（C）2009，JPO＆INPIT

6. 发明专利

JP2009053949A Method for estimating support state of electronic equipment casing, and electronic equipment 有权
标题翻译：电子设备支架状态估算方法及电子设备
公开(公告)号：JP2009053949A
公开(公告)日：2009-03-12
申请号：JP2007220281
申请日：2007-08-27
申请人： Toshiba Corp , 株式会社東芝
发明人： MUKAI MINORU , OMORI TAKAHIRO , YAMAMOTO DAISUKE
IPC分类号： G06F1/00 , G01M7/02 , G06F1/20 , G11B21/08 , G11B25/04
CPC分类号： G01H3/08 , G01M99/005 , G01M99/007
摘要： PROBLEM TO BE SOLVED: To provide a method for estimating a support state of an electronic equipment casing, capable of estimating a dynamic support structure of an electronic equipment casing laid in a rest state at practical cost. SOLUTION: In the method for estimating a support state of an electronic equipment casing, vibration for detecting the dynamic support state is given from an exciting device to a casing of electronic equipment provided with the exciting device. The vibration responding characteristic to the given vibration is detected by an acceleration sensor provided in a place different from that of the exciting device, and compared with correlation information between vibration response characteristic and dynamic support state preliminarily stored in the electronic equipment to estimate the support state. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于估计电子设备外壳的支撑状态的方法，其能够以实际成本估计以静止状态放置的电子设备外壳的动态支撑结构。解决方案：在用于估计电子设备壳体的支撑状态的方法中，用于检测动态支撑状态的振动由激励装置给予设置有激励装置的电子设备的壳体。通过设置在与激励装置不同的位置的加速度传感器来检测给定振动的振动响应特性，并与预先存储在电子设备中的振动响应特性和动态支持状态之间的相关信息进行比较，以估计支撑状态。版权所有（C）2009，JPO＆INPIT

7. 发明专利

JP2008309528A Electronic device 有权
标题翻译：电子设备
公开(公告)号：JP2008309528A
公开(公告)日：2008-12-25
申请号：JP2007155576
申请日：2007-06-12
申请人： Toshiba Corp , 株式会社東芝
发明人： KADOTA TOMOKO , MUKAI MINORU
IPC分类号： G01R31/02 , H05K7/14
CPC分类号： H05K7/142 , G01R31/046 , G01R31/2812 , H05K1/0268 , H05K3/341 , H05K2201/10409 , H05K2203/163
摘要： PROBLEM TO BE SOLVED: To provide structures of the casing and circuit board of an electronic device, which detects beforehand approach of generation of an electric connection failure of a mounted component on the circuit board.
SOLUTION: This device is equipped with: the circuit board arranged inside the assembled casing, whose part is fixed between a first boss part and a second boss part; a first conductor and a second conductor formed in a clearance provided between the first boss part and the circuit board; a third conductor formed between the first boss part and the first conductor, and between the first boss part and the second conductor, for connecting electrically the first conductor to the second conductor; a first wiring and a second wiring formed on the circuit board, and connected electrically to the first conductor and the second conductor respectively; and a measuring circuit connected electrically to the first wiring and the second wiring, for measuring an electric characteristic value of the first conductor or the second conductor.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供电子设备的壳体和电路板的结构，其预先检测在电路板上产生安装部件的电连接故障的方法。解决方案：该装置配备有：布置在组装壳体内部的电路板，其部分固定在第一凸台部分和第二凸台部分之间; 第一导体和第二导体，形成在设置在第一凸台部和电路板之间的间隙中; 第三导体，形成在第一凸台部分和第一导体之间，并且在第一凸台部分和第二导体之间，用于将第一导体电连接到第二导体; 形成在电路板上的第一布线和第二布线，分别与第一导体和第二导体电连接; 以及与第一布线和第二布线电连接的测量电路，用于测量第一导体或第二导体的电特性值。版权所有（C）2009，JPO＆INPIT

8. 发明专利

JP2006127488A Input device, computer device, information processing method, and information processing program 审中-公开
标题翻译：输入设备，计算机设备，信息处理方法和信息处理程序
公开(公告)号：JP2006127488A
公开(公告)日：2006-05-18
申请号：JP2005270519
申请日：2005-09-16
申请人： Toshiba Corp , 株式会社東芝
发明人： OZAWA MASANORI , KUNO KATSUMI , FURUKAWA AKIRA , MUKAI MINORU
IPC分类号： G06F3/041 , G06F3/023 , G06F3/048 , H03M11/04
摘要： PROBLEM TO BE SOLVED: To provide an input device for properly setting a position of an object brought into contact with the input device. SOLUTION: This input device includes a display unit 5 for displaying an image for recognizing an input position, a contact position detecting part 21 for detecting the position of an object brought into contact with a contact detecting surface provided on the display surface of the display unit, a recording part 24 for recording a difference between the position detected by the contact position detecting part 21 and the central position of the image for recognizing the input position and an arithmetic unit 23 for calculating an amount for correcting the image for recognizing the input position to be displayed on the display unit 5 on the basis of the data recorded by the recording part 24. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用于正确设置与输入装置接触的物体的位置的输入装置。
解决方案：该输入装置包括用于显示用于识别输入位置的图像的显示单元5，用于检测与设置在显示表面上的接触检测表面接触的物体的位置的接触位置检测部21 显示单元，用于记录由接触位置检测部分21检测到的位置与用于识别输入位置的图像的中心位置之间的差异的记录部分24以及用于计算校正用于识别的图像的量的运算单元23 基于由记录部分24记录的数据显示在显示单元5上的输入位置。（C）2006年，JPO和NCIPI

9. 发明专利

JP2006053629A Electronic equipment, control method and control program 审中-公开
标题翻译：电子设备，控制方法和控制程序
公开(公告)号：JP2006053629A
公开(公告)日：2006-02-23
申请号：JP2004232974
申请日：2004-08-10
申请人： Toshiba Corp , 株式会社東芝
发明人： KUNO KATSUMI , OZAWA MASANORI , FURUKAWA AKIRA , MUKAI MINORU
IPC分类号： G06F3/048 , G06F3/041 , G06F3/14
CPC分类号： G06F1/1616 , G06F1/1647 , G06F1/1679 , G06F1/1692
摘要： PROBLEM TO BE SOLVED: To provide electronic equipment having excellent portability, operability, situation adaptability, and silencing property. SOLUTION: This electronic equipment has: a first display device 202; an input device 201 disposed near the first display device 202, acquiring position information of a contacted object; an interface specification holding part 701 holding interface specifications wherein an image of operation equipment displayed on the first display device 202, and correspondence relation between the position information inputted from the input device 201 and a signal outputted when the position information is inputted from the input device 201 are described; and a conversion means 300 converting the position information inputted from the input device 201 into the output signal of the operation equipment according to the interface specifications. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供具有优异的便携性，可操作性，情况适应性和消音性能的电子设备。解决方案：该电子设备具有：第一显示装置202; 设置在第一显示装置202附近的输入装置201，获取被接收物体的位置信息; 接口规格保持部701，保持接口规格，其中显示在第一显示装置202上的操作设备的图像以及从输入装置201输入的位置信息与从输入装置输入位置信息时输出的信号之间的对应关系 201描述; 以及根据接口规格将从输入装置201输入的位置信息转换成操作装置的输出信号的转换装置300。版权所有（C）2006，JPO＆NCIPI

10. 发明专利

JPH0912980A ADHESIVE, ADHESION USING THE SAME AND PEELING THEREOF 失效
公开(公告)号：JPH0912980A
公开(公告)日：1997-01-14
申请号：JP16162795
申请日：1995-06-28
申请人： TOSHIBA CORP
发明人： HIRAO AKIKO , YASUMOTO YASUAKI , IIJIMA TADASHI , MUKAI MINORU , MAJIMA YUTAKA , TEZUKA FUMINOBU
IPC分类号： G03G5/06 , C08K3/00 , C08K5/00 , C08L101/00 , C09J5/00 , C09J11/06 , C09J201/00
摘要： PURPOSE: To obtain an adhesive which comprises an insulating matrix, a charge- producing material and a charge-transporting material, can firmly bond electroconductive base materials to each other and can readily peel off, when necessary. CONSTITUTION: This adhesive is prepared by formulating (A) a charge-producing material 3 such as selenium, preferably in an amount of 1-30 pts.wt. and (B) a charge-transporting material 4 such as a hydrazone compound, preferably in an amount of 10-80 pts.wt. to (C) an insulating matrix material 2 such as polycarbonate in an amount of 100 pts.wt. After the adhesive is electrically charged, it is brought into contact with an electroconductive base plate to effect adhesion with the adhesive 1, then the adhesive 1 is irradiated with a light to be absorbed by the charge-producing material and the adhesive 1 is peeled off.

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