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1. 发明专利

JPH04132216A HEAT TREATMENT APPARATUS 失效
公开(公告)号：JPH04132216A
公开(公告)日：1992-05-06
申请号：JP25388390
申请日：1990-09-21
申请人： TEL SAGAMI LTD
发明人： NISHI HIRONOBU
IPC分类号： H01L21/22 , H01L21/205 , H01L21/31
摘要： PURPOSE:To prevent heat from being dissipated from the opening part of a reaction tube and to effectively prevent a temperature near the opening part from being lowered by a method wherein a heat insulator is installed on the face at the inner side of the reaction tube of a sheetlike member which closes the opening part of the reaction tube and the heat insulator is constituted in such a way that its content substance displaying a heat-insulating effect is covered with another member. CONSTITUTION:At a shutter plate 6, a heat insulator 8 is placed on an SUS plate 7. A shutter quartz plate 9 is placed on the heat insulator 8; and it is attached to the SUS plate 7 by using a screw. The shutter plate 6 is of a sandwich structure where the heat insulator 8 is sandwiched between the quartz plate 9 as the surface on the side of a reaction tube and the SUS plate 7. The heat insulator 8 is constituted in such a way that a blanket 81 composed of, e.g. quartz wool is covered wholly with a silica cloth 82 composed of a glass fiber or the like. An air cylinder mechanism 12 is actuated; and the opening of the reaction tube 7 is closed by the shutter plate 6. Although the shutter plate 6 collides with the edge of the opening at the reaction tube 1, the shock is absorbed by the elasticity of the heat insulator 8 and the elasticity of springs 11.

2. 发明专利

JPH01230246A METHOD AND APPARATUS FOR TRANSFERRING SEMICONDUCTOR WAFER AND HEAT TREATING BOAT FOR SEMICONDUCTOR WAFER 失效
公开(公告)号：JPH01230246A
公开(公告)日：1989-09-13
申请号：JP27908988
申请日：1988-11-04
申请人： TEL SAGAMI LTD
发明人： NISHI HIRONOBU , FUMOTO MASASHI , ITO SHOZO , SAWATO KAZUTOSHI , YAMAGA KENICHI , MOCHIZUKI YOSHINORI , ASANO TAKANOBU
IPC分类号： H01L21/00 , H01L21/205 , H01L21/22 , H01L21/673 , H01L21/677
摘要： PURPOSE:To avoid the occurrence of mismatch, by mounting a plurality of wafer containing cassettes and a treating boat on a loading device, detecting the orientation of the boat when the cassettes are sequentially transferred into the boat, correcting the boat when the orientation of the boat is reverse, and moving the cassettes. CONSTITUTION:Before cassettes 46a-46d on which wafers 45 are mounted are transferred into a treating boat 40 with a wafer transfer device 10, the four cassettes 46a-46d are positioned on a first stage 12, and the boat 40 is positioned on a second stage 13. Then, the inherent attitude of the boat 40 is measured, and the measured data are inputted into a computer. Whether the orientation of the boat 40 is correct or not is judged. A sensor is provided in the vicinity of the boat 40 for this purpose. When the orientation of the boat 40 is reverse, an alarm is sounded. A control mechanism is operated by the output of the computer, and the position of the boat 40 is corrected. Thereafter, the cassettes 46a-46d are sequentially moved by using a cylinder mechanism 30 and a chucking mechanism 31 and transferred into the boat 40.

3. 发明专利

JPH0459515A WAFER TRANSFER DEVICE 失效
公开(公告)号：JPH0459515A
公开(公告)日：1992-02-26
申请号：JP17106490
申请日：1990-06-28
申请人： TEL SAGAMI LTD
发明人： NISHI HIRONOBU
IPC分类号： B65G1/02 , B65G1/04 , B65G49/00 , B65G49/07 , H01L21/145 , H01L21/673 , H01L21/68
摘要： PURPOSE:To maintain wafers in a clear condition even if a transfer device produces dust or particles, when the wafers are transferred between a carrier and a quartz port, by carrying out the transfer in such a condition that clean air flow has been taken into a closed exterior body. CONSTITUTION:A desired number of carriers 10 inside a storage chamber 2 are transferred into a transfer device 4 by a conveying device, and a port 11 is transferred to the transfer device of the device 4 from another storage chamber 3. At that time, fans 20 at the bottom and side of the device 4 are driven to take in a purifying air flow A through an air filter 19 at the upper surface thereof. Since the inside of the device 4 is isolated from a clean room by an exterior body 18, the air flow A is efficiently circulated in the transfer space K. In this purifying air flow region, a supporting body 15 is lifted by a vertically driving mechanism 14, and all the semiconductor wafers W inside a carrier 10 are collectively lifted, and are sandwichedly supported from right and left by an insertedly holding body 16 that has been horizontally moved to that position by a driving mechanism 17. Then, the supporting body 15 is lowered, and the insertedly holding body 16 is horizontally moved on the port 11, and then it is lowered and the wafer W is placed on the port 11.

4. 发明专利

JPH04133446A SUBSTRATE ALIGNMENT DEVICE 失效
公开(公告)号：JPH04133446A
公开(公告)日：1992-05-07
申请号：JP25615890
申请日：1990-09-26
申请人： TEL SAGAMI LTD
发明人： NISHI HIRONOBU
IPC分类号： H01L21/68
摘要： PURPOSE:To obtain a device, which is capable of making circular substrate align reliably and accurately in a state that the circular substrates, each having a notch part like an orientation flat, are housed in a housing container by a method wherein the device is constituted into one provided with two parallel rollers, which support simultaneously a plurality of the circular substrates and at the same time, rotate the substrates, alignment plates, which are respectively specified, and an elevating mechanism. CONSTITUTION:In a device, which makes circular substrates align on the basis of notch parts 19a in a state that a plurality of the circular substrates 19, which respectively have the notch part 19a for alignment use at their peripheral edge parts, are housed in a housing container 20, the device is constituted into such a structure that it is provided with two parallel rollers 1 and 2, which support simultaneously the plurality of the above substrates 19 and at the same time, rotate the substrates 19, alignment plates 17 and 18, which are respectively provided outside of the two rollers 1 and 2 and support the circumferential parts 19b of the substrates 19 when the upper surfaces of the two rollers 1 and 2 are brought into a state that they are parallel to the notch parts 19a, and an elevating mechanism, which inserts the above two rollers 1 and 2 in the container 20 through the opened bottom 20a of the container 20. For example, the above two rollers 1 and 2 are provided in such a way that they are rotationally driven by a motor installed under the lower end surface of a support member 3 via belts and pulleys.

5. 发明专利

JPH0459516A WAFER HOUSING TRANSFER DEVICE 失效
公开(公告)号：JPH0459516A
公开(公告)日：1992-02-26
申请号：JP17106590
申请日：1990-06-28
申请人： TEL SAGAMI LTD
发明人： NISHI HIRONOBU
IPC分类号： B65G49/00 , H01L21/673 , H01L21/677 , H01L21/68
摘要： PURPOSE:To enable manufacture of high-quality wafers by providing a means for forming a purifying gas flow in the transfer space of wafer housings, so that when the wafers are transferred, clean transfer without adhesion of dust or particles can be carried out. CONSTITUTION:A port 11 for supporting a semiconductor wafer W is insertedly held by the fitting part 25 of a port turning device 21 which has been moved to the position of the port 11 by a horizontally driving mechanism 22, and further is supported to the driving mechanism 22 vertically from the horizontal position by means of a driving mechanism 24 of the turning device 21 that has been moved in a prescribed position. Then, the turning device 21 is further lowered by a vertically driving mechanism 23 to place the vertically supported port 11 in the port placing position of a port transfer device 6. At that time, fans 31 in the transfer device 6 are operated to positively take in the downdraft from a clean room through an air filter 30, so that a purifying gas flow B can be formed in the space k1. And the transfer device 6 conveys the port 11 along a transfer passage 26 up to the front of a desired heat treatment furnace 7 (not shown), and moves it to the position of a robot arm 33 (not shown) of a heat treatment furnace 5.

6. 发明专利

JPH01251633A WAFER TRANSFERRING METHOD 失效
公开(公告)号：JPH01251633A
公开(公告)日：1989-10-06
申请号：JP30857788
申请日：1988-12-06
申请人： TEL SAGAMI LTD
发明人： NISHI HIRONOBU
IPC分类号： H01L21/677 , B65G25/00 , B65G47/80 , B65G47/90 , H01L21/68
摘要： PURPOSE:To enable a face to face arrangement, by rotating a second wafer accommodating vessel to be transferred by 180 deg., extracting a prescribed number of wafers, and transferring them into a first accommodating vessel. CONSTITUTION:By a pushing-up member 34, a wafer 45 in a cassette 43 is lifted at a height of a first on-off chuck 24; rods 24c, 24d are protruded; rods 24e, 24f are retreated; the wafer row 45 is pinched by the ON-OFF chuck 24. Then, by moving the rods, the wafer 45 transfers from the ON-OFF chuck 24 to a boat 44. By rotating a turn table 30 by 180 deg., the cassette 43 is inverted. When the residual wafers 452 are loaded on a first area of the boat 44, these are turned into an arrangement of face 45a to face 45a with respect to the 451 which is transferred in the preceding process.

7. 发明专利

JPH04133314A VERTICAL-TYPE HEAT TREATMENT APPARATUS 失效
公开(公告)号：JPH04133314A
公开(公告)日：1992-05-07
申请号：JP25493190
申请日：1990-09-25
申请人： TEL SAGAMI LTD
发明人： NISHI HIRONOBU
IPC分类号： H01L21/22 , H01L21/205 , H01L21/31 , H01L21/677 , H01L21/68
摘要： PURPOSE:To suppress drop of the treatment efficiency due to the transfer operation of an object to be treated and to suppress the defect of the object due to an increase in the waiting time by a method wherein a function of pretreating the object is additionaly provided to a stocker for storing a container for treatment use, which has been provided so as to keep the object on standby and all devices from the stocker of a container, for conveyance use, in which the object has been housed to a vertical- type heat treatment furnace are incorporated inside a series of devices. CONSTITUTION:A wafer boat 4 conveyed to a vertical-type heat treatment furnace 30 by using a boat conveyance mechanism 40 is loaded inside a reaction container 31 by using a boat elevator 38; a semiconductor wafer 2 is treated. On the other hand, the wafer boat 4 conveyed to a boat stocker 50 is placed on a turntable 52; it is covered with a reaction table 54 which has been lowered; a desired pretreatment is executed during the waiting period of a heat treatment process by using a gas, for pretreatment use, which has been supplied from a treatment gas introduction pipe 56. The boat stocker 50, a carrier stocker in which a wafer carrier 3 conveyed from a previous process is housed, a transfer mechanism of the semiconductor wafer 2 and individual mechanisms 40, 60 which transfer and convey the wafer boat 4 are installed inside one apparatus.

8. 发明专利

JPH04133318A VERTICAL-TYPE HEAT TREATMENT APPARATUS 失效
公开(公告)号：JPH04133318A
公开(公告)日：1992-05-07
申请号：JP25493090
申请日：1990-09-25
申请人： TEL SAGAMI LTD
发明人： NISHI HIRONOBU
IPC分类号： H01L21/22 , H01L21/205 , H01L21/31 , H01L21/324
摘要： PURPOSE:To execute a pretreatment during the waiting time for an object to be treated, to make a heat treatment process efficient and to restrain a defect from being produced due to the waiting time by a method wherein a stocker, for the object to be treated, which keeps the object to be treated on standby is provided and a surrounding container is installed at the stocker for the object to be treated. CONSTITUTION:For example, a semiconductor wafer is loaded on a wafer boat, and a process is on standby in this state. At this time, the wafer boat 3 is conveyed to a boat stocker 30 by using a boat conveyance mechanism; it is transferred onto a mounting stand on a turntable 33 by using a boat transfer arm 35. When the wafer boat 3 is transferred, a reaction tube 34 is lowered; the semiconductor wafer 2 housed on the wafer boat 3 is covered with a reaction tube 36. In this state, a desired gas for pretreatment use is supplied into the reaction tube 36 from a treatment gas introduction pipe 39; the wafer boat 3 is turned by using the turntable 33. Thereby, during the waiting period for a heat treatment process, a desired pretreatment is executed uniformly to the semiconductor wafer 2 which has not yet been treated.

9. 发明专利

JPS6433941A POSITIONING APPARATUS OF WAFER BOAT 失效
公开(公告)号：JPS6433941A
公开(公告)日：1989-02-03
申请号：JP18969687
申请日：1987-07-29
申请人： TEL SAGAMI LTD
发明人： NISHI HIRONOBU
IPC分类号： H01L21/22 , H01L21/677 , H01L21/68
摘要： PURPOSE:To position a wafer boat accurately and to avoid the discarding of the wafer boat even if a kicker is deformed, by providing a boat tray, a tray plate, the kicker and an original point sensor, which are specified for this purpose. CONSTITUTION:The following parts are provided: a boat tray 11, on which a wafer boat 10 is mounted; a tray plate 12, on which the boat tray 11 is mounted, and which can be slidden in the longitudinal direction; a kicker 14, which is provided at the side part of the tray plate 12; and an original point sensor 27, which detects the position of the kicker 14. Then, e.g., the boat tray 11, on which the wafer boat 10 is mounted, is mounted on the tray plate 12. A pin hole 15 of the tray plate 12 is coupled with a positioning pin 17 of a boat liner 16. A master side clamp 19 is moved so as to push a tray clamp 20 to the end surface of the tray plate 12. A boat clamp 22 is brought into contact with one end surface of the wafer boat 10. The master side clamp 19 is brought into contact with a stopper 23. Then, a slave side clamp 25 is moved, and a boat clamp 26 is brought into contact with the other end surface of the wafer boat 10. Thus the wafer boat 10 is clamped.

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