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1. 发明专利

JPH10132642A LIQUID-LEVEL AND LIQUID-TEMPERATURE COMPOUND SENSOR 失效
公开(公告)号：JPH10132642A
公开(公告)日：1998-05-22
申请号：JP28888296
申请日：1996-10-30
申请人： TDK CORP
发明人： SHIRAKI SATOSHI , ONO YOSHIYUKI , KATO TOMIO
IPC分类号： G01F23/62 , G01K1/14
摘要： PROBLEM TO BE SOLVED: To provide a liquid-level and liquid-temperature compound sensor with improved liquid-temperature detection accuracy and water resistance. SOLUTION: A case 1 has an epoxy-based resin as main constituent and is constituted as a continuous body by a material that contains an inorganic filler. A float 21 that constitutes a liquid level sensor 2 follows the movement of a liquid level and a liquid level detection element 22 is arranged inside the case 1 and responds to the float 21. A liquid temperature sensor 3 is arranged inside the case 1.

2. 发明专利

JP2012237571A Non-contact temperature sensor 有权
标题翻译：非接触式温度传感器
公开(公告)号：JP2012237571A
公开(公告)日：2012-12-06
申请号：JP2011104995
申请日：2011-05-10
申请人： Tdk Corp , Tdk株式会社
发明人： SHIODA KENTARO , KOBAYASHI HIROSHI , MATSUO YUTAKA , SHIRAKI SATOSHI
IPC分类号： G01J5/06
摘要： PROBLEM TO BE SOLVED: To provide a non-contact temperature sensor which not only can prevent manufacturing man-hour and cost from increasing, productivity from reducing, and work environment from deteriorating, but also suppress sensitivity error and sensibility decrease of a sensor.SOLUTION: For example, a guiding barrel 30A of the non-contact temperature sensor has a trunk 31 composed of a long side walls 31L and 31L, short side walls 31S and 31S. The trunk 31 has non-light guide means including blades 41L1, 41L2, 41S1 and 41S2, and pores 51L1, 51L2, 51S1 and 51S2, which prevents the infrared component progressing towards an inner wall or reflected by the inner wall among radiated infrared rays IR entering the inside of the guiding barrel 30A through its opening P from reaching a reception range including a heat sensitive element for infrared detection.
摘要翻译：要解决的问题：提供一种非接触式温度传感器，其不仅可以防止制造工时和成本提高，生产率从减少和工作环境劣化，而且抑制灵敏度误差和敏感性降低传感器。解决方案：例如，非接触式温度传感器的引导筒30A具有由长侧壁31L和31L，短侧壁31S和31S构成的主体31。躯干31具有包括叶片41L1,41L2,41S1和41S2以及孔51L1,51L2,51S1和51S2的非光导装置，其防止红外成分向内壁前进或由辐射红外线IR中的内壁反射通过其开口P进入引导筒30A的内部，到达包括用于红外检测的热敏元件的接收范围。版权所有（C）2013，JPO＆INPIT

3. 发明专利

JP2012105473A Lead wire attaching structure and lead wire attaching member 有权
标题翻译：引线连接结构和引线连接成员
公开(公告)号：JP2012105473A
公开(公告)日：2012-05-31
申请号：JP2010252774
申请日：2010-11-11
申请人： Tdk Corp , Tdk株式会社
发明人： SHIRAKI SATOSHI
IPC分类号： H02G3/30 , G01K7/00 , H01R13/58
摘要： PROBLEM TO BE SOLVED: To provide a lead wire attaching structure and a lead wire attaching member capable of performing orientation and movement limitation of a lead wire with a small number of components, small space, and easy work.SOLUTION: A hook part 18 includes a first hook part 26 arranged on the side of a hole 17, and a second hook part 27 arranged on the side of a hook end 18a. Also, the first hook part 26 includes a pair of first groove parts 31, 32 and a first wall part 33 extending between the first groove parts 31, 32. In the first hook part 26, a first lead wire 3 and a second lead wire 4 are arranged so as to be separated from each other by the first wall part 33. The second hook part 27 has a second bottom part 38 arranged more on the side of the hook end 18a than the first groove parts 31, 32 and a second wall part 37 forming a space SP with the second bottom part 38. In the second hook part 27, a second joint part 6B is arranged in the space SP.
摘要翻译：要解决的问题：提供一种能够执行具有少量部件的引线的取向和移动限制的引线附接结构和引线附接构件，空间小，并且容易的工作。解决方案：钩部18包括布置在孔17侧的第一钩部26和布置在钩端18a侧的第二钩部27。此外，第一钩部26包括一对第一槽部31,32和在第一槽部31,32之间延伸的第一壁部33.在第一钩部26中，第一引线3和第二引线 4被布置成通过第一壁部33彼此分离。第二钩部27具有比第一凹槽部31,32更靠在钩端18a侧的第二底部38，壁部37形成具有第二底部38的空间SP。在第二钩部27中，第二接合部6B布置在空间SP中。版权所有（C）2012，JPO＆INPIT

4. 发明专利

JPH103837A TEMPERATURE SWITCH 失效
公开(公告)号：JPH103837A
公开(公告)日：1998-01-06
申请号：JP15225196
申请日：1996-06-13
申请人： TDK CORP
发明人： KATO TOMIO , KAJIWARA MASARU , SHIRAKI SATOSHI
IPC分类号： H01H37/58
摘要： PROBLEM TO BE SOLVED: To have the stabilized temperature characteristic without generating looseness of a reed switch driving unit so as to improve the reliability by pressing a reed switch driving unit for contact with a part of a housing body or a part of a fixing member for holding. SOLUTION: A fixing member 1, which is made of the non-magnetic material and which is provided with a flange 1a as a holding part for preventing a fall in an end thereof, is inserted between an inner diameter part of a reed switch driving unit, which is formed of a temperature sensitive magnetic body 4 and permanent magnets 3a, 3b, and a housing body 5 for housing a reed switch, and a coil spring 2 is arranged in the periphery of the fixing member 1 made of the non-magnetic material. One side of this spring 2 is held by a part of the fixing member as a supporting part by pressing the lead switch driving unit for contact with the flange 1a as a holding part, which is provided in the fixing member 1 made of the non-magnetic material, with the elastic force thereof. A cut-out part 1b can be provided near the end in place of the flange 1a.

5. 发明专利

JP2001242018A TEMPERATURE/LEVEL SENSOR 失效
公开(公告)号：JP2001242018A
公开(公告)日：2001-09-07
申请号：JP2000056435
申请日：2000-03-01
申请人： TDK CORP
发明人： KAJIWARA MASARU , SHIRAKI SATOSHI
IPC分类号： G01F23/62 , G01K1/14 , G01K7/36
摘要： PROBLEM TO BE SOLVED: To provide a low price and small sized temperature/level sensor. SOLUTION: A temperature sensing switch 1 comprises a temperature sensing magnetic substance 11, magnets 12, 13, and a reed switch 14, and magnetic flux ϕ1 generated from the magnets 12, 13 forms a magnetic path passing through the temperature sensing magnetic substance 11 and the reed switch 14. A float 2 comprises the magnetic substance or a magnet 21, and a relative position of the float 2 is variable to the temperature sensing switch 1. An amount of the magnetic flux passing through the reed switch 14 is controlled according to the position.

6. 发明专利

JP2001153732A METHOD FOR ASSEMBLING SENSOR FOR TEMPERATURE DETECTION AND SAME SENSOR 失效
公开(公告)号：JP2001153732A
公开(公告)日：2001-06-08
申请号：JP33625599
申请日：1999-11-26
申请人： TDK CORP
发明人： SASAKI KAORU , KAJIWARA MASARU , TAMURA HIDEO , SHIRAKI SATOSHI
IPC分类号： H01C7/02 , G01K7/22
摘要： PROBLEM TO BE SOLVED: To accurately mount and electrically securely connect a temperature detecting chip type thermistor element between the axes of partially exposed core conductors of a two-core parallel insulating coating electric conductor. SOLUTION: The insulating coating electric conductor 12 has its core conductors 11a and 11b exposed to length reaching the place where the thermistor element 10 is mounted and also has the tip side beyond the exposed core part held by an insulating film 13b, and the thermistor element 10 is mounted between the axes of the exposed core conductors 11a and 11b so that the insulating film 13b holding the tip side of the insulating coating electric conductor 12 is left.

7. 发明专利

JP2005024344A Temperature sensor 审中-公开
标题翻译：温度感应器
公开(公告)号：JP2005024344A
公开(公告)日：2005-01-27
申请号：JP2003188511
申请日：2003-06-30
申请人： Tdk Corp , Tdk株式会社
发明人： SHIRAKI SATOSHI , SASAKI KAORU , WAKABAYASHI YUTAKA , MORITA MAKOTO
IPC分类号： G01K7/22 , G01K1/08 , G01K1/14
CPC分类号： G01K1/14 , G01K1/08
摘要： PROBLEM TO BE SOLVED: To provide a temperature sensor for enhancing manufacturing work efficiency.
SOLUTION: In this temperature sensor 10, a thermistor 32 with a pair of lead wires 23A and 34B connected thereto is housed in a sensing part 12a. The thermistor 32 is covered only with an element protection part 43 made of resin. That is, since the temperature sensor 10 utilizes no conductive holders, it does not occur that the thermistor 32 and a pair of harnesses 34A and 34B contact with a conductor, actualizing stabilization of temperature detection signals of the sensor 10. Accordingly, in contrast to a conventional temperature sensor with a thermistor housed in a holder made of metal, the sensor 10 dispenses with the need for thinking of insulating the thermistor 32 and the pair of harnesses 34A and 34B from the conductor when housing the thermistor 32 in a holder 12. This simplifies sensor manufacturing work to increase the efficiency of the manufacturing work.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用于提高制造工作效率的温度传感器。解决方案：在该温度传感器10中，连接有一对引线23A和34B的热敏电阻32容纳在感测部分12a中。热敏电阻32仅被树脂制的元件保护部分43覆盖。也就是说，由于温度传感器10不使用导电保持器，所以不会发生热敏电阻32和一对线束34A和34B与导体接触，实现传感器10的温度检测信号的稳定。因此，与传统的温度传感器具有容纳在由金属制成的保持器中的热敏电阻，传感器10不需要考虑将热敏电阻32和一对线束34A和34B从导体上将热敏电阻32保持在保持器12中。这简化了传感器制造工作，提高了制造工作的效率。版权所有（C）2005，JPO＆NCIPI

8. 发明专利

JP2005019644A Temperature sensor, manufacturing method thereof, and mold therefor 有权
标题翻译：温度传感器，其制造方法及其模具
公开(公告)号：JP2005019644A
公开(公告)日：2005-01-20
申请号：JP2003181635
申请日：2003-06-25
申请人： Tdk Corp , Tdk株式会社
发明人： KATO SATOSHI , SHIRAKI SATOSHI , TAMURA HIDEO , SATO KAZUO
IPC分类号： G01K7/22 , B29C39/10 , B29C39/26 , B29K83/00 , G01K1/08 , H01C7/04
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a temperature sensor which suppresses a temperature sensitive portion from being exposed on the surface of a resin in insertion molding, and also to provide the temperature sensor and a mold for the temperature sensor.
SOLUTION: An mold is prepared which has a first cavity region 71 and a second cavity region 72 continuing to this region 71 and having a width smaller than that of the region 71. Then, insertion molding is performed in such a way that the temperature sensitive portion 11 is positioned on the first cavity region 71, and a thermistor 10 is disposed in the mold 70 so that a pair of lead wires 12, 13 are arranged in parallel in the second cavity region 72. Since the width of the second cavity region 72 is smaller than that of the first cavity region 71, even if resin injection pressure is applied to the thermistor 10, the lead wires 12, 13 contact the inner wall portion of the second cavity region 72, thereby regulating the movement of the thermistor 10.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种制造温度传感器的方法，该温度传感器抑制温度敏感部分在插入成型中暴露在树脂表面上，并且还提供用于温度传感器的温度传感器和模具。解决方案：制备具有连续到该区域71并且具有小于区域71的宽度的第一空腔区域71和第二空腔区域72的模具。然后，以如下方式进行插入成型：温度敏感部分11位于第一腔区域71上，并且热敏电阻器10设置在模具70中，使得一对引线12,13平行布置在第二腔区域72中。由于第二空腔区域72比第一空腔区域71小，即使对热敏电阻10施加树脂注入压力，引线12,13接触第二空腔区域72的内壁部分，从而调节热敏电阻10.版权所有（C）2005，JPO＆NCIPI

9. 发明专利

JP2005017088A Temperature sensor 有权
标题翻译：温度感应器
公开(公告)号：JP2005017088A
公开(公告)日：2005-01-20
申请号：JP2003181598
申请日：2003-06-25
申请人： Tdk Corp , Tdk株式会社
发明人： SHIRAKI SATOSHI , SASAKI KAORU , WAKABAYASHI YUTAKA
IPC分类号： G01K7/22 , G01K1/08 , G01K1/14
CPC分类号： G01K1/14 , G01K1/08
摘要： PROBLEM TO BE SOLVED: To provide a temperature sensor aimed at the reduction of the number of components.
SOLUTION: In the temperature sensor 10, whole opening 14 of a holder 12 is covered with a cap section 44A of a sensor cover 44 so as to prevent a situation where waterdrop and the like enter between a holder 12 and a resin section 42. Breakage of wire of harness pair 34A and 34B due to excess bending is deterred. Such a cap section 44A and a neck section 44B are both parts of the sensor cover 44 and made into an integral body. In the temperature sensor 10 having such sensor cover 44 adopted, the number of components is reduced, as compared with those of a temperature sensor 50, in which the cap and a lead withdrawing member are separated.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种旨在减少部件数量的温度传感器。
解决方案：在温度传感器10中，保持器12的整个开口14被传感器盖44的盖部分44A覆盖，以防止水滴等进入保持器12和树脂部分之间的情况由于过度弯曲，线束对34A和34B的线断裂被阻止。这种盖部44A和颈部44B都是传感器盖44的一部分，并且形成为一体。与采用这种传感器盖44的温度传感器10相比，与分离盖和引出引出部件的温度传感器50相比，部件数量减少。版权所有（C）2005，JPO＆NCIPI

10. 发明专利

JPH03138902A THERMISTOR AND ITS MANUFACTURE 失效
公开(公告)号：JPH03138902A
公开(公告)日：1991-06-13
申请号：JP27664489
申请日：1989-10-24
申请人： TDK CORP
发明人： SASAKI KAORU , SATO MINORU , ONO YOSHIYUKI , MIKI NOBUYUKI , SHIRAKI SATOSHI , SAKANO SHIGERU
IPC分类号： H01C7/04
摘要： PURPOSE:To enable reduction of the deviation of resistance value by equalizing the diameter of an electrode to that of a thermistor base. CONSTITUTION:A thermistor is equipped with electrodes E11 each having a diameter equal to that D11 of a disc thermistor base 12 on both surfaces of this base. Equalization of the diameter D11 of the thermistor base 12 to the D11 of an electrode E11 makes the diameter D11 inversely proportional to resistance R, and control of the diameter D11 is ready to provide a high-precision resistance R0. When measurement of the resistance R of a finished device shows that it is less than a specified R0, the peripheral face 12 is ground to provide a specified R0. This can reduce the deviation of resistance value.

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