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1. 发明专利

JP2010135657A Ceramic package for housing electronic component, and method of manufacturing the same 有权
标题翻译：用于住宅电子元件的陶瓷包装及其制造方法
公开(公告)号：JP2010135657A
公开(公告)日：2010-06-17
申请号：JP2008311765
申请日：2008-12-08
申请人： Sumitomo Metal Electronics Devices Inc , 株式会社住友金属エレクトロデバイス
发明人： NISHIKAWA KATSUHIRO , OBA AKIRA , KAWAGUCHI HIDEYO , ANO SEIJI
IPC分类号： H01L23/08 , H01L23/12
摘要： PROBLEM TO BE SOLVED: To provide an inexpensive ceramic package for housing an electronic component easily mounted by stably erecting one side surface of a square ceramic base on a wiring substrate for mounting, and to provide a method of manufacturing the same.
SOLUTION: The ceramic package 10 for housing an electronic component houses the electronic component 12 by mounting on the ceramic base 11. The ceramic package includes: a cut surface 15, which is arranged on the square one side surface of the ceramic base 11 entirely in a thickness direction and orthogonally to a surface of the ceramic base 11; a dividing groove 16 formed on other three side surfaces except for the one side surface of the ceramic base 11 from the surface of the ceramic base 11 to the middle in the thickness direction; and a fracture surface 17 adjacent to the dividing groove 16.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种廉价的陶瓷封装，用于容纳通过稳定地将方形陶瓷基底的一个侧面稳定地安装在用于安装的布线基板上而容易安装的电子部件，并提供其制造方法。解决方案：用于容纳电子部件的陶瓷封装10通过安装在陶瓷基座11上而容纳电子部件12.陶瓷封装包括：切割面15，其布置在陶瓷基体的正方形侧表面上 11完全在厚度方向上并且与陶瓷基体11的表面正交; 形成在从陶瓷基体11的表面到厚度方向的中间除陶瓷基体11的一个侧面以外的其他三个侧面上的分割槽16; 以及与分隔槽16相邻的断裂表面17.版权所有（C）2010，JPO＆INPIT

2. 发明专利

JP2005123564A Package for housing electronic component 有权
标题翻译：外壳电子元件包装
公开(公告)号：JP2005123564A
公开(公告)日：2005-05-12
申请号：JP2004102651
申请日：2004-03-31
申请人： Sumitomo Metal Electronics Devices Inc , 株式会社住友金属エレクトロデバイス
发明人： NISHIKAWA KATSUHIRO , KIMURA YUKIO , ANO SEIJI , YAMAGATA YUTAKA
IPC分类号： H01L23/12 , H01L23/04 , H01L23/08
摘要： PROBLEM TO BE SOLVED: To provide a package for housing an electronic component which can cope with the downsizing and the lightening of weight, increase bonding reliability by preventing the flow-in of a brazing filler metal or a bonding material, and is adapted to packages in various forms.
SOLUTION: A package for housing an electronic component is provided with a first notch 15 communicated with all layers of a ceramic substrate 11, and a second notch 16 not communicated with a part of the layers on the side surface of the substantially rectangular ceramic substrate 11 composed of a plurality of layers. A first conductive film 17 is formed on the wall surface of the first notch 15, and a second conductive film 18 is formed on the wall surface of the notch 16. Respective conductive patterns formed on the upper surface and the lower surface of the ceramic substrate 11 by the first conductive film 17 are put into conductive states. The package has the first notch 15 having an insulating film 22 formed so as to cover at least one layer of the ceramic substrate 11 or the surface of the first conductive film 17 of a part of one layer.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提供一种用于容纳能够应对小型化和轻量化的电子部件的包装，通过防止钎料或粘合材料的流入来提高粘合可靠性，并且是适应各种形式的包装。解决方案：用于容纳电子部件的封装设置有与陶瓷基板11的所有层连通的第一凹口15和不与基本矩形的侧表面上的一部分层连通的第二凹口16 陶瓷基板11由多层构成。第一导电膜17形成在第一凹口15的壁表面上，第二导电膜18形成在凹口16的壁表面上。形成在陶瓷基板的上表面和下表面上的各导电图案 11由第一导电膜17导通。封装具有第一凹口15，其具有形成为覆盖陶瓷基板11的至少一层或第一导电膜17的一层的一部分的表面的绝缘膜22。版权所有（C）2005，JPO＆NCIPI

3. 发明专利

JP2004200332A Ceramic package 审中-公开
公开(公告)号：JP2004200332A
公开(公告)日：2004-07-15
申请号：JP2002365995
申请日：2002-12-18
申请人： Sumitomo Metal Electronics Devices Inc , 株式会社住友金属エレクトロデバイス
发明人： ANO SEIJI
IPC分类号： H01L23/12 , H01L23/13
CPC分类号： H01L2224/48091 , H01L2224/48227 , H01L2924/19105 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a ceramic package in which a flow prevention zone can be formed even at a place where conductor wiring patterns are jammed, and which easily deals with miniaturization and has good yield. SOLUTION: The ceramic package 10 includes on the surface thereof the conductor wiring pattern 13 and a bonding pattern 16 for adhering a bonding brazing material to a part of the conductor wiring pattern 13, and further the flow prevention zone 17 comprising an insulator formed by covering the conductor wiring pattern 13 for preventing a brazing material bonded to the bonding pattern 16 from flowing. In the ceramic package 10, a cutout part 18 is formed in the conductor wiring pattern 13 where the width of the conductor wiring pattern 13 is narrowed to provide a narrowed part, and further the flow prevention zone 17 is formed across the narrowed part. COPYRIGHT: (C)2004,JPO&NCIPI

4. 发明专利

JP2011223425A Package for housing electronic component elements 审中-公开
标题翻译：外壳电子元件元件包装
公开(公告)号：JP2011223425A
公开(公告)日：2011-11-04
申请号：JP2010091866
申请日：2010-04-13
申请人： Sumitomo Metal Electronics Devices Inc , 株式会社住友金属エレクトロデバイス
发明人： NISHIKAWA KATSUHIRO , KAMITAMARI MAKOTO , ANO SEIJI
IPC分类号： H03B5/32 , H01L23/08 , H03H9/02
CPC分类号： H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2924/16195 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a package for housing electronic component elements having a high airtight reliability in low price, capable of corresponding to reduction in weight and size of cell phones and such.SOLUTION: A package for housing electronic component elements 10, comprised of an assembly of a ceramic substrate 11 and a ceramic frame body 12, on which a semiconductor element 14 and a piezoelectric vibration piece 15 are mounted on the same surface on upper side of the ceramic substrate 11, includes: a connecting terminal pad 16 to make electric continuity with the semiconductor element 14; a connecting terminal pad 17 to make electric continuity with the piezoelectric vibration piece 15; a conductor wiring pattern 18 extended from the connecting terminal pad 16 and/or the connecting terminal pad 17 to the lower part of the piezoelectric vibration piece 15, on the same surface; and a pillow member 19 made of a ceramic insulator film, provided on upper side of a conductor wiring pattern 18a, which is set on the lower part of the other end of the piezoelectric vibration piece 15, to prevent the piezoelectric vibration piece 15 from touching the conductor wiring pattern 18 and 18a.
摘要翻译：要解决的问题：提供一种用于容纳以低价格具有高气密可靠性的电子元件的封装，能够对应于手机等的重量和尺寸的减小。解决方案：一种用于容纳电子元件10的包装件，包括陶瓷基板11和陶瓷框体12的组件，半导体元件14和压电振动片15安装在上面的同一表面上陶瓷基板11的一侧包括：与半导体元件14电连接的连接端子焊盘16; 与压电振动片15电连接的连接端子垫17; 在相同的表面上从连接端子焊盘16和/或连接端子焊盘17延伸到压电振动片15的下部的导体布线图案18; 以及设置在压电振动片15的另一端的下部设置的导体布线图案18a的上侧的由陶瓷绝缘膜制成的枕构件19，以防止压电振动片15触摸导体布线图案18和18a。版权所有（C）2012，JPO＆INPIT

5. 发明专利

JP2011134773A Package for housing semiconductor device 有权
标题翻译：外壳半导体器件封装
公开(公告)号：JP2011134773A
公开(公告)日：2011-07-07
申请号：JP2009290698
申请日：2009-12-22
申请人： Sumitomo Metal Electronics Devices Inc , 株式会社住友金属エレクトロデバイス
发明人： ANO SEIJI
IPC分类号： H01L23/04
CPC分类号： H01L2224/48091 , H01L2224/49175 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a package for housing a semiconductor element which allows coping with size reduction of the package.
SOLUTION: The package 10 for housing the semiconductor element includes a ceramic substrate 12; a ceramic plate 14, where square or rectangular through-holes 13 are formed on an upper face; and a cavity part 17 which has a ceramic frame 16, where an insertion hole 15 is formed on an upper face and stores a semiconductor element 11. Centers 19 and 19a which are the intersections of diagonal lines of the through-holes 13 and the insertion hole 15 have identical position, and the direction of the through-hole 13 has an inclination of angle ≥30° and ≤60°, with respect to a direction of the insertion hole 15. A pair of facing two apexes of at least the through-hole 13 are given to positions abutting on two facing wall faces of the insertion hole 15; and moreover, a rack 20 is arranged on the ceramic plate 14, at a lower face of a corner of the ceramic frame 16, and a wire bond pad 22 on an upper face.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于容纳半导体元件的封装，其能够应对封装的尺寸减小。解决方案：用于容纳半导体元件的封装10包括陶瓷衬底12; 陶瓷板14，其中在上表面上形成方形或矩形通孔13; 以及具有陶瓷框架16的空腔部17，其中在上表面上形成有插入孔15，并且存储半导体元件11.作为通孔13的对角线的交叉部的中心19和19a以及插入孔15具有相同的位置，并且通孔13的方向相对于插入孔15的方向具有角度≥30°和≤60°的倾斜。一对面对的两个顶点至少包括通孔孔13被赋予与插入孔15的两个相对的壁面相邻的位置; 此外，在陶瓷板14上，陶瓷框架16的角部的下表面和上表面上的引线接合焊盘22设置有齿条20。版权所有（C）2011，JPO＆INPIT

6. 发明专利

JP2011114031A Ceramic package for storing electronic component 审中-公开
标题翻译：用于存储电子元件的陶瓷包装
公开(公告)号：JP2011114031A
公开(公告)日：2011-06-09
申请号：JP2009266513
申请日：2009-11-24
申请人： Sumitomo Metal Electronics Devices Inc , 株式会社住友金属エレクトロデバイス
发明人： ANO SEIJI
IPC分类号： H01L23/12 , H01L23/04 , H01L23/08
摘要： PROBLEM TO BE SOLVED: To provide a ceramic package for storing an electronic component high in reliability in joining at a junction between an external connection terminal pad of a ceramic base body and a soldering pad of a mounting wiring board.
SOLUTION: In the ceramic package 10 for storing an electronic component that can be mounted by bringing one side face 15 of a ceramic base body 11 formed in a rectangular shape capable of storing an electronic component 12 into contact with a mounting wiring board 16 to be vertically erected, and jointing external connection terminal pads 17 formed on the ceramic base body 11 for bringing the electronic component 12 and the outside into an electrically conducting state to soldering pads 18 of the mounting wiring board 16 through solder pieces 19, the external connection terminal pads 17 include: end terminal pads 20 formed at both the respective ends in the longitudinal direction of the one side face 15 and both principal surfaces of the ceramic base body 11 in the vicinities thereof; and intermediate-part terminal pads 21 formed in intermediate parts in the longitudinal direction of the one side face 15 and both the principal surfaces of the ceramic base body 11 in the vicinities thereof.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种陶瓷封装，用于存储陶瓷基体的外部连接端子焊盘与安装布线板的焊盘之间的接合处可靠性高的电子部件的接合。解决方案：在用于存储电子元件的陶瓷封装10中，该电子元件可以通过使形成为能够存储电子元件12的矩形形状的陶瓷基体11的一个侧面15与安装布线板接触来安装并且连接形成在陶瓷基体11上的外部连接端子焊盘17，用于通过焊料片19使电子部件12和外部进入导电状态到安装配线板16的焊盘18，外部连接端子焊盘17包括：在一个侧面15的长度方向的两端形成的端子焊盘20和陶瓷基体11的附近的两个主面。以及形成在一个侧面15的纵向方向上的中间部分和陶瓷基体11的两个主表面附近的中间部分端子焊盘21。版权所有（C）2011，JPO＆INPIT

7. 发明专利

JP2007311436A Ceramic package for storing electronic components 有权
标题翻译：用于存储电子元件的陶瓷包装
公开(公告)号：JP2007311436A
公开(公告)日：2007-11-29
申请号：JP2006137142
申请日：2006-05-17
申请人： Sumitomo Metal Electronics Devices Inc , 株式会社住友金属エレクトロデバイス
发明人： ANO SEIJI
IPC分类号： H01L23/12 , H01L23/08 , H01L23/13 , H03H3/02 , H03H9/02
CPC分类号： H01L24/97
摘要： PROBLEM TO BE SOLVED: To provide a ceramic package for storing electronic component corresponding to reduction in weight and size of the package. SOLUTION: The ceramic package 10 for storing individual pieces of electronic components that is formed through division along a dividing groove 11 from a ceramic package assembly 30 formed of a multilayer structure. In this ceramic package 10, a plurality of through-holes 14 respectively crossing the center points are provided to a part where the dividing groove 11 is provided, a first metalized film 17 is provided to the wall surface of the through-holes 14, a second metalized film 18 is provided to the periphery of the upper surface side of the through-holes 14 through connection with the entire circumferential edge of the upper surface side of the first metalized film 17, a gap (a) exceeding 0.20 mm is provided between the second metalized films 18 adjacent to the part where the dividing groove 11 is provided, and furthermore the second metalized film 18 has at least a width in the side where the dividing groove 11 is provided that is narrower than the width in the side orthogonally crossing the dividing groove 11. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于存储电子部件的陶瓷包装件，其与包装的重量和尺寸减小相对应。解决方案：用于存储通过沿着由多层结构形成的陶瓷封装组件30沿着分隔槽11分割形成的各个电子部件的陶瓷封装10。在该陶瓷封装10中，在设置有分隔槽11的部分设置有分别与中心点交叉的多个通孔14，在通孔14的壁面设置有第一金属化膜17，第二金属化膜18通过与第一金属化膜17的上表面侧的整个周边边缘连接而设置在通孔14的上表面侧的周边，间隔（a）超过0.20mm设置在与设置有分隔槽11的部分相邻的第二金属化膜18，此外，第二金属化膜18在分隔槽11的至少一侧的宽度方向上至少具有比正交交叉侧的宽度窄的宽度分割槽11.版权所有（C）2008，JPO＆INPIT

8. 发明专利

JP2011114032A Ceramic package for storing electronic component 审中-公开
标题翻译：用于存储电子元件的陶瓷包装
公开(公告)号：JP2011114032A
公开(公告)日：2011-06-09
申请号：JP2009266514
申请日：2009-11-24
申请人： Sumitomo Metal Electronics Devices Inc , 株式会社住友金属エレクトロデバイス
发明人： ANO SEIJI
IPC分类号： H01L23/12 , H01L25/065 , H01L25/07 , H01L25/18
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a ceramic package for storing an electronic component capable of improving reliability in joining at a junction between an external connection terminal pad and a mounting wiring board, and improving mounting density to the mounting wiring board.
SOLUTION: The ceramic package 10 for storing an electronic component that can be mounted by bringing one side face of a ceramic base body 11 into contact with a mounting wiring board to be vertically erected, and jointing external connection terminal pads 17 to the mounting wiring board, is characterized as follows. The external connection terminal pads 17 include end terminal pads 20, and intermediate-part pads 21; the end terminal pad 20 includes a first cutout part 22, a second cutout part 23, first metalized films 24 on the surface thereof, and a second metalized film 25 in the vicinity thereof; and each intermediate-part terminal pad 21 includes a third cutout part 26, first metalized films 24a on the surface thereof, and second metalized films 25a in the vicinities thereof.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：解决问题：提供一种用于存储能够提高在外部连接端子焊盘和安装布线板之间的接合处的接合中的可靠性的电子部件的陶瓷封装，并且提高对安装布线板的安装密度。解决方案：用于存储可以通过使陶瓷基体11的一个侧面与垂直竖立的安装布线板接触而安装的电子部件的陶瓷封装10，以及将外部连接端子焊盘17连接到安装接线板，其特征如下。外部连接端子焊盘17包括端子焊盘20和中间部分焊盘21; 端子接头焊盘20包括第一切口部22，第二切口部23，其表面上的第一金属化膜24和其附近的第二金属化膜25; 并且每个中间部分端子焊盘21包括第三切口部分26，其表面上的第一金属化膜24a和其附近的第二金属化膜25a。版权所有（C）2011，JPO＆INPIT

9. 发明专利

JP2006245494A Substrate for mounting multiple patterning electronic components 审中-公开
标题翻译：用于安装多个模式电子组件的基板
公开(公告)号：JP2006245494A
公开(公告)日：2006-09-14
申请号：JP2005062694
申请日：2005-03-07
申请人： Sumitomo Metal Electronics Devices Inc , 株式会社住友金属エレクトロデバイス
发明人： ANO SEIJI
IPC分类号： H05K1/02 , H01L23/13
摘要： PROBLEM TO BE SOLVED: To provide a substrate for mounting an electronic component in which insulation between electrodes is acquired after an electronic component element is divided into pieces.
SOLUTION: The substrates for mounting the electronic component element are aligned in the substrate 1 for mounting multiple patterning electronic components. Electrodes 2-1 and 2-2 formed by plating, a plated lead main line 3-1 to which the electrode 2-1 and an external power source (not shown) are connected, and a plated lead branch line 3-2 to which the plated lead main line 3-1 and the electrode 2-2 are connected are provided in the same plane. The plated lead main line 3-1 and the plated lead branch line 3-2 are obliquely crossed to a cutting line 4, respectively, between adjacent mounting substrates, in the substrate for mounting the multiple patterning electronic components. Especially it is desirable that the plated lead branch line 3-2 is obliquely crossed to both the cutting lines 4 in the vertical and horizontal directions between the mounting substrates.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用于安装电子部件的基板，电子部件在电子元件被分割成多个部分之后获取电极之间的绝缘。解决方案：用于安装电子元件元件的基板在基板1中对准，用于安装多个图案化电子元件。通过电镀形成的电极2-1和2-2，电极2-1和外部电源（未示出）连接到的电镀引线主线3-1和镀覆引线支线3-2，电镀引线主线3-1和电极2-2连接在同一平面上。在用于安装多个图案化电子部件的基板中，电镀引线主线3-1和电镀引线支线3-2分别在相邻的安装基板之间与切割线4交叉。特别优选的是，电镀引线支线3-2在安装基板之间的垂直和水平方向上与两条切割线4倾斜交叉。版权所有（C）2006，JPO＆NCIPI

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