专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2014147054A Piezoelectric substrate and surface acoustic wave element 审中-公开
标题翻译：压电基板和表面声波元件
公开(公告)号：JP2014147054A
公开(公告)日：2014-08-14
申请号：JP2013016174
申请日：2013-01-30
申请人： Sumitomo Electric Ind Ltd , 住友電気工業株式会社
发明人： TOSHIOKA HIDEAKI , SAITO HIROHISA , SHIMOJI KEIICHIRO
IPC分类号： H03H9/25 , H01L41/18 , H01L41/22
摘要： PROBLEM TO BE SOLVED: To provide a piezoelectric substrate which has less deformation amount caused by a temperature change; and which can reduce a frequency-temperature coefficient and inhibit the occurrence of a spurious response when used for a surface acoustic wave element.SOLUTION: A piezoelectric substrate 1 comprises: a piezoelectric layer 2 for producing a piezoelectric effect; and a support layer 3 which is laminated on a rear face side of the piezoelectric layer 2 and has a linear expansion coefficient smaller than that of the piezoelectric layer, in which a ratio (T2/T1) of an average thickness T2 of the support layer 3 to an average thickness T1 of the piezoelectric layer is not less than 5 and less than 15. It is preferable that the average thickness T1 of the piezoelectric layer 2 is not less than 10 μm and not more than 50 μm, and the average thickness T2 of the support layer 3 is not less than 100 μm and not more than 500 μm. It is preferable that an arithmetic surface roughness (Ra) of a surface of the support layer is not less than 0.05 μm and not more than 1 μm. It is preferable that a chief component of the piezoelectric layer 2 is lithium tantalate or lithium niobate.
摘要翻译：要解决的问题：提供一种由温度变化引起的变形量较小的压电基板; 并且当用于表面声波元件时可以降低频率 - 温度系数并抑制寄生响应的发生。压电衬底1包括：用于产生压电效应的压电层2; 以及层叠在压电体层2的背面侧的支撑层3，其具有小于压电层的线膨胀系数的线膨胀系数，其中支撑层的平均厚度T2的比（T2 / T1） 3相对于压电体层的平均厚度T1为5以上且15以下。优选压电体层2的平均厚度T1为10μm以上50μm以下，平均厚度支撑层3的T2不小于100μm且不大于500μm。优选的是，支撑层的表面的运算表面粗糙度（Ra）不小于0.05μm且不大于1μm。优选压电体层2的主要成分为钽酸锂或铌酸锂。

2. 发明专利

JP2010135513A Package 审中-公开
标题翻译：包
公开(公告)号：JP2010135513A
公开(公告)日：2010-06-17
申请号：JP2008309043
申请日：2008-12-03
申请人： Sumitomo Electric Ind Ltd , 住友電気工業株式会社
发明人： MATSUBARA HIDEKI , TOSHIOKA HIDEAKI , NAKATSUGI KYOICHIRO , ADACHI MASAHIRO , OKUDA YASUHIRO
IPC分类号： H01S5/022 , G02B6/42 , H01L21/60 , H01L23/12 , H01L31/02 , H01L31/0232 , H01L33/48
CPC分类号： H01L2224/2929 , H01L2224/293 , H01L2224/48091 , H01L2224/73204 , H01L2224/73265 , H01L2224/83851 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a package capable of expanding usability of an optical device while keeping low-cost and high reliability. SOLUTION: The package A has the optical device 10 mounted in a flip-chip state over a mother substrate 1. First and second interconnect pads 5 and 6 are provided on an upper surface of the mother substrate 1, and an opening 1a is formed in the mother substrate 1. On a principal surface side of the optical device 10, a p-type electrode 15 and an n-type electrode 16 are provided. Between the optical device 10 and mother substrate 1, an ACF 30 is interposed which has chain metallic particles 31 dispersed in light-transmissive resin. The p-type electrode 15 and n-type electrode 16, and the first and second interconnect pads 5 and 6 are electrically connected to each other by the chain metallic particles 31 in the ACF 30. The ACF 30 having the chain metallic particles dispersed functions as a path for light in addition to a chip bonding function and an electric connection function. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供能够在保持低成本和高可靠性的同时扩大光学装置的可用性的封装。解决方案：封装A具有在母板1上以倒装状态安装的光学器件10.第一和第二互连焊盘5和6设置在母基板1的上表面上，并且开口1a 形成在母基板1上。在光学装置10的主表面侧设置p型电极15和n型电极16。在光学装置10和母体基板1之间插入ACF 30，其具有分散在透光树脂中的链状金属颗粒31。 p型电极15和n型电极16以及第一和第二互连焊盘5和6通过ACF 30中的链状金属颗粒31彼此电连接。具有链状金属颗粒的ACF 30分散功能作为除了芯片接合功能和电连接功能之外的光的路径。版权所有（C）2010，JPO＆INPIT

3. 发明专利

JP2010135122A Electrode connecting adhesive 审中-公开
标题翻译：电极连接胶
公开(公告)号：JP2010135122A
公开(公告)日：2010-06-17
申请号：JP2008307818
申请日：2008-12-02
申请人： Sumitomo Electric Ind Ltd , 住友電気工業株式会社
发明人： TOSHIOKA HIDEAKI , NAKATSUGI KYOICHIRO
IPC分类号： H01B1/22 , C09J9/02 , C09J11/06 , H01B1/00 , H01B5/16 , H01R11/01
摘要： PROBLEM TO BE SOLVED: To provide electrode connecting adhesive enabling to determine whether connected objects are successfully adhered to each other with the electrode connecting adhesive or not, independently of the average particle size of conductive particles.
SOLUTION: A metal electrode 5 of a flexible printed wiring board 3 and a wiring electrode 4 of a wiring substrate 1 are connected to each other via the electrode connecting adhesive 2 which contains an insulating thermoset resin as a main component, and conductive particles, latent hardener, and temperature indicator to be discolored with a temperature to indicate the temperature. Herein, the temperature indicated by the discolored temperature indicator is a curing temperature of the thermoset resin.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供电极连接粘合剂，其能够确定连接的物体是否与电极连接粘合剂彼此成功地粘附，而不管导电颗粒的平均粒度。解决方案：柔性印刷线路板3的金属电极5和布线基板1的布线电极4经由以绝缘热固性树脂为主要成分的电极连接粘合剂2彼此连接，导电颗粒，潜在的硬化剂和温度指示剂以温度变色以指示温度。这里，由变色温度指示器表示的温度是热固性树脂的固化温度。版权所有（C）2010，JPO＆INPIT

4. 发明专利

JP2010037389A Adhesive and electrode-connecting method using the same 有权
标题翻译：使用它的粘合和电极连接方法
公开(公告)号：JP2010037389A
公开(公告)日：2010-02-18
申请号：JP2008199890
申请日：2008-08-01
申请人： Sumitomo Electric Ind Ltd , 住友電気工業株式会社
发明人： TOSHIOKA HIDEAKI , OKUDA YASUHIRO
IPC分类号： C09J7/00 , C09J5/06 , C09J9/02 , C09J11/04 , C09J163/00 , C09J201/00 , H01B1/22 , H01L21/60 , H05K1/14 , H05K3/32 , H05K3/36
CPC分类号： H01L2224/2929 , H01L2224/293 , H01L2224/73204 , H01L2224/83851
摘要： PROBLEM TO BE SOLVED: To provide an adhesive capable of improving connection reliability between electrodes when connecting the electrodes to each other through the adhesive at a low temperature, and having excellent storage stability. SOLUTION: The adhesive 2 consists of a first adhesive 7 having a film shape, and containing an epoxy resin-curing agent and at least one of an epoxy resin having ≥1,000 epoxy equivalent and a resin free from the epoxy group, and a second adhesive 8 having a film shape, separated from the first adhesive, and containing an epoxy resin having ≤10 days usable time with the epoxy resin-curing agent, and electroconductive particles. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够在低温下通过粘合剂将电极彼此连接时能够提高电极之间的连接可靠性的粘合剂，并且具有优异的储存稳定性。粘合剂2由具有膜状的第一粘合剂7和含有环氧树脂固化剂和环氧树脂当量≥1000的环氧树脂和不含环氧基的树脂中的至少一种组成，以及具有与第一粘合剂分离的膜形状的第二粘合剂8，并且含有环氧树脂固化剂使用时间≤10天的环氧树脂和导电性颗粒。版权所有（C）2010，JPO＆INPIT

5. 发明专利

JP2008084607A Film for connecting wiring board and method of connecting wiring board 有权
标题翻译：用于连接接线板的电路和连接接线板的方法
公开(公告)号：JP2008084607A
公开(公告)日：2008-04-10
申请号：JP2006261421
申请日：2006-09-26
申请人： Sumitomo Electric Ind Ltd , 住友電気工業株式会社
发明人： TOSHIOKA HIDEAKI , YAMAMOTO MASAMICHI
IPC分类号： H01R11/01 , B32B27/18 , H01B1/22 , H05K1/14 , H05K3/32
摘要： PROBLEM TO BE SOLVED: To provide a film for connecting wiring boards which provides sufficient adhesion reliability and does not cause poor connection even when the sum of heights of electrodes facing each other is larger than 30 μm, and a method of connecting wiring boards to bond two wiring boards having wired circuits on substrate surfaces using the film for connecting wiring boards, thereby connecting the wired circuits of two wiring boards to each other.
SOLUTION: In the film for connecting wiring boards consisting of a thermosetting resin composition in which conductive particles are dispersed, the curing reactivity increases from one surface of a film toward the other surface, or increases from both surfaces of the film toward the center. In the method of connecting wiring boards, the film for connecting wiring boards is held between the two wiring boards having wired circuits on a surface of the substrate, heated and pressed.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种连接线路板的膜，其提供足够的粘附可靠性，并且即使当彼此相对的电极的高度之和大于30μm时也不会导致不良连接，以及连接布线使用所述用于连接线路板的膜将基板表面上具有布线电路的两个布线板接合，从而将两个布线板的布线电路彼此连接。解决方案：在由导电颗粒分散的热固性树脂组合物组成的连接布线板的膜中，固化反应性从膜的一个表面向另一个表面增加，或者从膜的两个表面增加到中央。在连接布线板的方法中，用于连接布线板的膜保持在具有布线电路的两个布线板之间，加热和加压。版权所有（C）2008，JPO＆INPIT

6. 发明专利

JP2006299025A Epoxy resin composition 有权
标题翻译：环氧树脂组合物
公开(公告)号：JP2006299025A
公开(公告)日：2006-11-02
申请号：JP2005120510
申请日：2005-04-19
申请人： Sumitomo Electric Ind Ltd , 住友電気工業株式会社
发明人： TOSHIOKA HIDEAKI , KASHIWABARA HIDEKI
IPC分类号： C08G59/30 , C08G59/62 , C09J9/02 , C09J11/04 , C09J11/06 , C09J163/00 , C09J171/10 , H01B1/00 , H01B1/22 , H01B5/16 , H01L21/60
摘要： PROBLEM TO BE SOLVED: To provide a thermosetting epoxy resin composition having an excellent adhesion and heat resistance, and also capable of achieving a good void-less property, a conductive adhesive by using the epoxy resin composition and an anisotropic conductive membrane obtained from the conductive adhesive.
SOLUTION: This epoxy resin composition is characterized by containing (A) a straight chain fluorinated epoxy resin, (B) a phenoxy resin and (C) a potential curing agent. The conductive adhesive is characterized by containing the epoxy resin composition and conductive particles and having ≥0.5 and ≤30 wt.% content of the (A) straight chain fluorinated epoxy resin based on the total weight of the epoxy resin. The anisotropic conductive membrane is characterized by being obtained from the conductive adhesive and orienting the conductive particles by a magnetic field.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题为了提供具有优异的粘合性和耐热性并且还能够获得良好的无空隙性的热固性环氧树脂组合物，使用所述环氧树脂组合物和各向异性导电膜获得的导电粘合剂从导电胶。该环氧树脂组合物的特征在于含有（A）直链氟化环氧树脂，（B）苯氧基树脂和（C）潜在的固化剂。导电粘合剂的特征在于含有环氧树脂组合物和导电颗粒，并且基于环氧树脂的总重量，（A）直链氟化环氧树脂的含量≥0.5和≤30重量％。各向异性导电膜的特征在于从导电粘合剂获得并通过磁场定向导电颗粒。版权所有（C）2007，JPO＆INPIT

7. 发明专利

JP2006073397A Anisotropic conductive film and its manufacturing method 审中-公开
标题翻译：各向异性导电膜及其制造方法
公开(公告)号：JP2006073397A
公开(公告)日：2006-03-16
申请号：JP2004256787
申请日：2004-09-03
申请人： Sumitomo Electric Ind Ltd , 住友電気工業株式会社
发明人： YAMAMOTO MASAMICHI , KASHIWABARA HIDEKI , TOSHIOKA HIDEAKI
IPC分类号： H01R11/01 , C09J9/02 , C09J163/00 , H01R43/00
摘要： PROBLEM TO BE SOLVED: To provide an anisotropic conductive film of which time stability while stored at a room temperature is excellent, in other words, of which pot life is long, and free from deterioration of reliability of electric insulation and its manufacturing method.
SOLUTION: The anisotropic conductive film is made from anisotropic adhesive agent in which conductive particles are dispersed in adhesive agent composition containing epoxide resin of which molecule weight is less than 500, epoxide resin of which molecule weight is equal to or more than 500 including two or more epoxide bases in a molecule and latent hardening agent as essential ingredients. The anisotropic conductive film and its manufacturing method are characterized in that the content amount of solvent constituent for dissolving the epoxide resin is equal to or less than 1,000 ppm.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种各向异性导电膜，其在室温下储存时的时间稳定性优异，换句话说，其使用寿命长，并且不会劣化电绝缘及其制造的可靠性方法。解决方案：各向异性导电膜由各向异性粘合剂制成，其中导电颗粒分散在分子量小于500的环氧树脂的粘合剂组合物中，分子量等于或大于500的环氧树脂包括分子中的两个或多个环氧化物碱和潜在硬化剂作为必需成分。各向异性导电膜及其制造方法的特征在于，溶解环氧树脂的溶剂成分的含量等于或小于1,000ppm。版权所有（C）2006，JPO＆NCIPI

8. 发明专利

JP2003346556A Anisotropic conductive material 有权
标题翻译：各向异性传导材料
公开(公告)号：JP2003346556A
公开(公告)日：2003-12-05
申请号：JP2002151485
申请日：2002-05-24
申请人： Sumitomo Electric Ind Ltd , 住友電気工業株式会社
发明人： TOSHIOKA HIDEAKI , KASHIWABARA HIDEKI , SAKAMOTO TOSHIHIRO , KOYAMA KEIJI , MASHIMA MASATOSHI
IPC分类号： C09J9/02 , C09J121/00 , H01B1/22 , H01B5/16 , H01R11/01 , H05K1/14 , H05K3/32
摘要： PROBLEM TO BE SOLVED: To provide an anisotropic conductive material where a conductive material is dispersed in a rubber material, connection at a low pressure being possible while narrow pitch connection of 100 μm or less being also possible, which has a rubber-like elasticity so that a pressurized part is compressed for conductivity while it is restored to an original shape when the pressure is removed for an insulated condition. SOLUTION: The anisotropic conductive material has metal powder dispersed in the rubber material which has such form as micro metal particles are connected together in chain. A pressure-sensitive element is made of the anisotropic conductive material where the metal powder having such form as the micro metal particles are connected together in chain is dispersed in the rubber material. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：为了提供导电材料分散在橡胶材料中的各向异性导电材料，也可以在低压下连接，而窄的连接在100μm以下也是可能的，使得当绝缘条件下的压力被去除时，加压部分被压缩以便导电，同时恢复到原始形状。解决方案：各向异性导电材料具有分散在橡胶材料中的金属粉末，其具有如金属微粒在链中连接在一起的形式。压敏元件由各向异性导电材料制成，其中具有如金属微粒的形式的金属粉末以链状连接在一起分散在橡胶材料中。版权所有（C）2004，JPO

9. 发明专利

JP2015005931A 圧電基板及び弾性表面波素子审中-公开
标题翻译：压电基板和弹性表面波装置
公开(公告)号：JP2015005931A
公开(公告)日：2015-01-08
申请号：JP2013131145
申请日：2013-06-21
申请人：住友電気工業株式会社 , Sumitomo Electric Ind Ltd
发明人： TOSHIOKA HIDEAKI , SAITO HIROHISA , SHIMOJI KEIICHIRO
IPC分类号： H03H9/25
摘要：【課題】温度変化による変形量が小さく、加熱を伴う加工後も圧電層と支持層とが高い接着強度を有する圧電基板の提供を目的とする。【解決手段】本発明の圧電基板は、圧電層と、この圧電層の裏面に接着剤層を介して積層され、上記圧電層よりも線膨張係数が小さい支持層とを備え、上記接着剤層の25℃から150℃に加熱した時の質量減少率が1%以下である。上記接着剤層が主成分としてエポキシ樹脂を含有するとよい。上記接着剤層を構成する接着剤の25℃における粘度が50cP以上400cP以下であるとよい。上記圧電層及び支持層の接着直後の反りが200μm以下であるとよい。上記圧電層の主成分がタンタル酸リチウム又はニオブ酸リチウムであるとよい。上記支持層の主成分がサファイア、酸化アルミニウム、酸化マグネシウム、スピネル、ムライト又はシリコンであるとよい。【選択図】図1
摘要翻译：要解决的问题：为了提供由于温度变化导致的变形量小的压电基板，并且即使在经过了压电层和支撑层之后也能够具有高的压电层和支撑层之间的接合强度涉及加热步骤的方法。本发明的压电基片包括：压电层; 以及通过粘合剂层压在压电层的背面上并且以线膨胀系数小于压电层的支撑层。当从25℃加热至150℃时，粘合剂层的质量减少率为1％以下。粘合剂层可以包括环氧树脂作为主要成分。粘合剂层包括粘合剂。粘合剂在25℃下的粘度优选为50-400cP。在压电层和支撑层的粘合之后，压电层和支撑层的翘曲优选为200μm以下。压电体层的主要成分优选为钽酸锂或铌酸锂。支撑层的主要组分优选为蓝宝石，氧化铝，氧化镁，尖晶石，莫来石或硅。

10. 发明专利

JP2011132541A Adhesive composition 有权
标题翻译：粘合剂组合物
公开(公告)号：JP2011132541A
公开(公告)日：2011-07-07
申请号：JP2011062163
申请日：2011-03-22
申请人： Sumitomo Electric Ind Ltd , 住友電気工業株式会社
发明人： TOSHIOKA HIDEAKI , YAMAMOTO MASAMICHI
IPC分类号： C09J163/00 , C08G59/14 , C08G59/40 , C09J11/04 , C09J11/06 , C09J183/12
摘要： PROBLEM TO BE SOLVED: To provide an adhesive composition having excellent heat resistance and moisture resistance, together with a low thermal expansion coefficient and a low humidity expansion coefficient, therefor the adhesive composition is less in deterioration of properties even when using for a long time under the conditions at a high temperature and high humidity, and is enabled to use in applications required high reliability. SOLUTION: The adhesive composition includes an epoxy resin, an alkoxy-containing silane-modified epoxy resin obtained by dealcoholization condensation of a bisphenol type epoxy resin with an alkoxysilane partial condensate, an inorganic filler and a latent curing agent as essential components. Wherein the formulated amount of the alkoxy-containing silane modified epoxy resin is ≥0.01 wt.% and ≤20 wt.% based on the total weight of the epoxy resin. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：解决的问题：为了提供耐热性和耐湿性优异的粘合剂组合物以及低热膨胀系数和低湿膨胀系数，因此即使使用长时间在高温高湿条件下，能够在需要高可靠性的应用中使用。粘合剂组合物包括环氧树脂，通过双酚型环氧树脂与烷氧基硅烷部分缩合物的脱醇缩合获得的含烷氧基的硅烷改性环氧树脂，无机填料和潜在性固化剂作为必要成分。其中，含烷氧基的硅烷改性环氧树脂的配合量相对于环氧树脂的总重量为≥0.01重量％，≤20重量％。版权所有（C）2011，JPO＆INPIT

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式