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1. 发明专利

JP2008193050A Solid-state imaging apparatus and imaging apparatus 审中-公开
标题翻译：固态成像装置和成像装置
公开(公告)号：JP2008193050A
公开(公告)日：2008-08-21
申请号：JP2007238893
申请日：2007-09-14
申请人： Sony Corp , ソニー株式会社
发明人： YASUNAKA KENTARO , SASANO KEIJI
IPC分类号： H01L27/148 , H04N5/335 , H04N5/372
摘要： PROBLEM TO BE SOLVED: To simplify a layout and to improve the quality by focusing on a structure of an electric charge discharging part for thinning in the columns direction.
SOLUTION: A solid-state imaging apparatus has a sensor part 12 in which photoelectric converters 11 are arranged in a matrix, a vertical electric charge transfer part 14 transferring a signal electric charge read out from the sensor part 12 in rows, a horizontal electric charge transfer part 15 transferring the signal electric charge transferred by the vertical electric charge transfer part 14 in columns, and an electric charge discharging part 18 selectively preventing the transfer of the signal electric charge from the vertical electric charge transfer part 14 to the horizontal electric charge transfer part 15 in units of columns and discharging the prevented signal electric charge. The electric charge discharging part 18 is formed in the sensor part 12 at the horizontal electric charge transfer part 15 side, and has a high concentration region 42 having higher concentration than that of the sensor part 12.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：通过集中于用于在列方向上减薄的电荷排出部分的结构来简化布局并提高质量。解决方案：固态成像装置具有传感器部分12，其中光电转换器11以矩阵形式布置;垂直电荷转移部分14，传送从传感器部分12读出的信号电荷行; 水平电荷转移部分15将由垂直电荷转移部分14传送的信号电荷传送到列中;电荷放电部分18选择性地防止信号电荷从垂直电荷转移部分14转移到水平面电荷转移部分15以列为单位并且排除阻止的信号电荷。电荷放电部18形成在水平电荷转移部15侧的传感器部12中，具有浓度高于传感器部12的浓度的高浓度区域42.权利要求（C）2008 ，JPO＆INPIT

2. 发明专利

JP2013098889A Electronic circuit, manufacturing method of electronic circuit, and packaging member 审中-公开
标题翻译：电子电路，电子电路的制造方法和包装部件
公开(公告)号：JP2013098889A
公开(公告)日：2013-05-20
申请号：JP2011241944
申请日：2011-11-04
申请人： Sony Corp , ソニー株式会社
发明人： YASUNAKA KENTARO , ITAGAKI TOMOARI , KAWASAKI KENICHI
IPC分类号： H01P5/08 , H01P3/08
摘要： PROBLEM TO BE SOLVED: To allow for high-quality data transfer while suppressing a larger circuit scale.SOLUTION: A single-end I/F having pads for exchanging a single end signal is provided in a millimeter wave transmission chip, for example, a semiconductor chip. Meanwhile, for example, a differential transmission line such as a coplanar strip line which transmits a differential signal and a stub connected to the differential transmission line are formed in a packaging section in which semiconductor chips such as an interposer and a printed-circuit board are mounted. The millimeter wave transmission chip is mounted in the packaging section so that the pads of the single-end I/F are electrically connected directly to a conductor constituting the differential transmission line. This technique, for example, is applicable to electronic circuits such as IC.
摘要翻译：要解决的问题：允许高质量的数据传输，同时抑制更大的电路规模。解决方案：在毫米波传输芯片（例如半导体芯片）中提供具有用于交换单端信号的焊盘的单端I / F。同时，例如，在诸如内插器和印刷电路板的半导体芯片的封装部分中形成有差分传输线，例如传输差分信号的共面带状线和连接到差分传输线的短截线安装。毫米波传输芯片安装在封装部分中，使得单端I / F的焊盘直接电连接到构成差分传输线的导体。例如，该技术可应用于诸如IC的电子电路。版权所有（C）2013，JPO＆INPIT

3. 发明专利

JP2013098888A Electronic circuit, manufacturing method of electronic circuit, and packaging member 有权
标题翻译：电子电路，电子电路的制造方法和包装部件
公开(公告)号：JP2013098888A
公开(公告)日：2013-05-20
申请号：JP2011241943
申请日：2011-11-04
申请人： Sony Corp , ソニー株式会社
发明人： ITAGAKI TOMOARI , KAWASAKI KENICHI , YASUNAKA KENTARO
IPC分类号： H01P5/10 , H01L23/12 , H01P5/02 , H05K1/02
CPC分类号： H05K1/025 , H01L23/48 , H01L23/538 , H01L23/66 , H01L24/16 , H01L24/48 , H01L2223/6611 , H01L2223/6627 , H01L2223/6638 , H01L2223/6677 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/12041 , H01L2924/19033 , H01L2924/19039 , H01L2924/30107 , H01L2924/3011 , H01P5/028 , H05K1/024 , H05K1/0243 , Y10T29/4913 , H01L2224/45099 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To allow for high-quality data transfer while suppressing a larger circuit scale.SOLUTION: A single-end I/F having pads for exchanging a single end signal is provided in a millimeter wave transmission chip, for example, a semiconductor chip. Meanwhile, for example, a differential transmission line such as a coplanar strip line which transmits a differential signal is formed in a packaging section in which semiconductor chips such as an interposer and a printed-circuit board are mounted. The millimeter wave transmission chip is mounted in the packaging section so that the pads of the single-end I/F are electrically connected directly to a conductor constituting the differential transmission line. This technique, for example, is applicable to electronic circuits such as IC.
摘要翻译：要解决的问题：允许高质量的数据传输，同时抑制更大的电路规模。解决方案：在毫米波传输芯片（例如半导体芯片）中提供具有用于交换单端信号的焊盘的单端I / F。同时，例如，在其中安装有诸如插入件和印刷电路板的半导体芯片的封装部分中形成诸如传输差分信号的共面带状线之间的差分传输线。毫米波传输芯片安装在封装部分中，使得单端I / F的焊盘直接电连接到构成差分传输线的导体。例如，该技术可应用于诸如IC的电子电路。版权所有（C）2013，JPO＆INPIT

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