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1. 发明专利

JP2008027933A Element, its fabrication process, substrate, its production process, mounting structure, packaging method, light emitting diode display, light emitting diode backlight and electronic apparatus 有权
标题翻译：元件，其制造工艺，基板，其生产工艺，安装结构，包装方法，发光二极管显示器，发光二极管背光和电子设备
公开(公告)号：JP2008027933A
公开(公告)日：2008-02-07
申请号：JP2006195051
申请日：2006-07-18
申请人： Sony Chemical & Information Device Corp , Sony Corp , ソニーケミカル&インフォメーションデバイス株式会社 , ソニー株式会社
发明人： TOMOTA KATSUHIRO , KANISAWA SHIKO , NAMIKI HIDEJI
IPC分类号： H01L21/60 , H01L33/32 , H01L33/48 , H05K3/32
CPC分类号： H05K3/326 , H01L23/49811 , H01L24/16 , H01L24/80 , H01L24/83 , H01L24/90 , H01L27/14618 , H01L27/14683 , H01L31/0203 , H01L33/62 , H01L2224/05568 , H01L2224/05573 , H01L2224/131 , H01L2224/13144 , H01L2224/1319 , H01L2224/1358 , H01L2224/13582 , H01L2224/13644 , H01L2224/13666 , H01L2224/16 , H01L2224/2919 , H01L2224/73204 , H01L2224/81193 , H01L2224/83192 , H01L2224/838 , H01L2224/83908 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/10253 , H01L2924/10349 , H01L2924/12041 , H01L2924/12043 , H01L2924/14 , H01R12/52 , H01R13/03 , H01R13/24 , H05K1/111 , H05K3/305 , H05K3/4007 , H05K2201/0314 , H05K2201/0367 , H05K2201/10977 , H05K2203/1189 , Y10T29/49139 , Y10T29/49155 , H01L2224/13099 , H01L2924/00 , H01L2224/05599
摘要： PROBLEM TO BE SOLVED: To provide a mounting structure and a packaging method in which the wiring and the element on a substrate can be electrically connected surely when the element is mounted on the substrate while further downscaling the bump and accelerating multi-pin connection. SOLUTION: At least one protrusion 15 of such a structure as the surface at least the distal end of a convex portion 13 composed of an elastic material is coated with a conductive film 14 is formed on the wiring 12 of a wiring board 10. A bump 22 is formed on an element 20. Adhesive 30 is applied on the wiring board 10 and the element 20 is mounted temporarily on the adhesive 30. At least the distal end of the protrusion 15 on the wiring board 10 is buried in the bump 22 of the element 20 by pressing the element 20 against the wiring board 10. Thereafter, the adhesive 30 is cured thus bonding and securing the element 20 and the wiring board 10. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种安装结构和封装方法，其中当元件安装在基板上时，基板上的布线和元件可以牢固地电连接，同时进一步降低凸起并加速多引脚连接。解决方案：在布线板10的布线12上形成至少一个突起15，其至少由弹性材料构成的凸部13的至少前端的表面涂覆有导电膜14 凸块22形成在元件20上。粘合剂30施加在布线板10上，元件20临时安装在粘合剂30上。布线板10上的突起15的至少远端被埋在通过将元件20压靠在布线板10上而使元件20的凸点22固定。此后，粘合剂30固化，从而粘合并固定元件20和布线板10.版权所有（C）2008，JPO＆INPIT

2. 发明专利

JP2006245554A Mounting method of electric components 审中-公开
标题翻译：电气组件的安装方法
公开(公告)号：JP2006245554A
公开(公告)日：2006-09-14
申请号：JP2006024586
申请日：2006-02-01
申请人： Sony Chemical & Information Device Corp , ソニーケミカル&インフォメーションデバイス株式会社
发明人： MATSUMURA TAKASHI , ANDO TAKASHI , KANISAWA SHIKO , SUGA YASUHIRO , SUZUKI KAZUAKI
IPC分类号： H05K3/32 , G02F1/1345
CPC分类号： H01L24/75 , B30B5/02 , B30B15/065 , H01L24/83 , H01L2224/75315 , H01L2224/75316 , H01L2224/83192 , H01L2224/838 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/0781 , H01L2924/07811 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a mounting method which can efficiently mount electric components with different mounting systems by using an adhesive. SOLUTION: The present invention is a method of mounting electric components on a glass substrate 1 by using a thermocompression bonding head 7 which has a thermocompression bonding member 9 made of a predetermined elastomer on a head body 8. The method of the present invention comprises a process of laying an anisotropic conductive adhesive film 4 over the whole surface of a mounting area 3 of the glass substrate 1, a process of positioning electric components with different mounting systems on the mounting area 3, and a process of thermocompression bonding the electric components at one time by using the thermocompression bonding member 9 having a size corresponding to the anisotropic conductive adhesive film 4. As the electric components, an IC chip 5 with a COG system and a flexible printed wiring board 6 with a FOG system are suitably used. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种通过使用粘合剂可以有效地安装具有不同安装系统的电气部件的安装方法。解决方案：本发明是一种通过使用在头体8上具有由预定弹性体制成的热压接构件9的热压接头7将电气部件安装在玻璃基板1上的方法。本发明的方法本发明包括在玻璃基板1的安装区域3的整个表面上设置各向异性导电粘合膜4的过程，将具有不同安装系统的电气部件定位在安装区域3上的过程，以及热粘合通过使用具有与各向异性导电粘合膜4相对应的尺寸的热压接构件9，一次电气部件。作为电气部件，具有COG系统的IC芯片5和具有FOG系统的柔性印刷线路板6合适用过的。版权所有（C）2006，JPO＆NCIPI

3. 发明专利

JP2012212865A Light reflective anisotropic conductive adhesive and light-emitting device 审中-公开
标题翻译：光反射感应导电粘合剂和发光装置
公开(公告)号：JP2012212865A
公开(公告)日：2012-11-01
申请号：JP2012045401
申请日：2012-03-01
申请人： Sony Chemical & Information Device Corp , ソニーケミカル&インフォメーションデバイス株式会社
发明人： NAMIKI HIDEJI , KANISAWA SHIKO , UMAGOE HIDEAKI
IPC分类号： H01L33/62
CPC分类号： C09J9/02 , C08G59/42 , C08K3/22 , C08K9/02 , C08K2003/2237 , C09J11/04 , C09J163/00 , H01B1/22 , H01L33/60 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/73204 , H01L2224/73265 , H01L2924/07811 , H01L2924/3025 , H01R4/04 , H05B33/22 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an anisotropic conductive adhesive capable of improving luminous efficiency without providing a light reflection layer in a light-emitting diode (LED) device which leads to an increase in manufacturing cost, when manufacturing a light-emitting device by flip chip mounting a light-emitting device such as an LED device on a wiring board using an anisotropic conductive adhesive.SOLUTION: The light reflective anisotropic conductive adhesive, used for an anisotropic conductive connection of a light-emitting device to a wiring board, contains a thermosetting resin composition, conductive particles, and light reflective insulation particles. Such light reflective insulation particles are made by surface treatment of titanium oxide particles with a kind selected from a group consisting of AlO, SiO, SiO, ZnO, ZnO, and ZrO. A titanium oxide content of the light reflective insulation particles is 85 to 93%.
摘要翻译：要解决的问题：为了提供能够提高发光效率的各向异性导电粘合剂，而不在发光二极管（LED）装置中提供光反射层，这导致制造成本的增加，当制造发光装置，通过使用各向异性导电粘合剂在LED布线板上安装LED装置等发光装置。解决方案：用于发光器件到布线板的各向异性导电连接的光反射各向异性导电粘合剂包含热固性树脂组合物，导电颗粒和光反射绝缘颗粒。这种光反射绝缘颗粒是通过用选自下组的二氧化钛颗粒进行表面处理而制成的：由 POS O 3 ，SiO，SiO 2 ，ZnO，ZnO 2 和ZrO 2 。光反射绝缘粒子的氧化钛含量为85〜93％。版权所有（C）2013，JPO＆INPIT

4. 发明专利

JP2012084582A Buffer film for multi-chip packaging 有权
标题翻译：多芯片包装的缓冲膜
公开(公告)号：JP2012084582A
公开(公告)日：2012-04-26
申请号：JP2010227420
申请日：2010-10-07
申请人： Sony Chemical & Information Device Corp , ソニーケミカル&インフォメーションデバイス株式会社
发明人： ISHIGAMI AKIRA , KANISAWA SHIKO , NAMIKI HIDEJI , UMAGOE HIDEAKI , AOKI MASAHARU
IPC分类号： H01L21/60 , H01L33/48
CPC分类号： H01L24/29 , B32B7/12 , B32B27/08 , B32B27/281 , B32B27/283 , B32B27/304 , B32B27/32 , B32B27/36 , B32B2307/306 , B32B2307/416 , B32B2307/536 , B32B2457/00 , C08L27/06 , C08L67/00 , C08L79/08 , C08L83/04 , H01L24/16 , H01L24/32 , H01L24/75 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/95 , H01L25/0753 , H01L33/005 , H01L33/48 , H01L33/60 , H01L33/62 , H01L2224/131 , H01L2224/13144 , H01L2224/16225 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29364 , H01L2224/29387 , H01L2224/2939 , H01L2224/294 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/75315 , H01L2224/75317 , H01L2224/7532 , H01L2224/7598 , H01L2224/75985 , H01L2224/81001 , H01L2224/81192 , H01L2224/81193 , H01L2224/81203 , H01L2224/81444 , H01L2224/83192 , H01L2224/83203 , H01L2224/8385 , H01L2224/83851 , H01L2224/83907 , H01L2224/9205 , H01L2224/9211 , H01L2224/92143 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/07811 , H01L2924/12041 , H01L2924/15787 , H01L2924/15788 , H01L2933/0033 , H01L2933/0066 , Y10T156/10 , Y10T428/24967 , Y10T428/31544 , Y10T428/31663 , H01L2924/00014 , H01L2224/81 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2924/3512
摘要： PROBLEM TO BE SOLVED: To provide a buffer film for multi-chip packaging capable of securing excellent connection reliability without causing a misalignment when packaging a multi-chip.SOLUTION: A buffer film for multi-chip packaging has a structure in which a heat resistant resin layer having a linear expansion coefficient of 80 ppm/°C or less and a flexible resin layer formed of a resin material whose Shore A hardness in JIS-K6253 is 10 to 80 are laminated. A multi-chip module can be manufactured by aligning a plurality of chip elements to a substrate via an adhesive, temporarily pasting the plurality of the chip elements, disposing the buffer film for multi-chip packaging between the chip elements and a bonding head so that the heat resistant resin layer exists on the chip element side, and heating and pressurizing the plurality of the chip elements to the substrate with the bonding head.
摘要翻译：要解决的问题：提供一种用于多芯片封装的缓冲膜，其能够在封装多芯片时确保优异的连接可靠性而不会引起不对准。解决方案：用于多芯片封装的缓冲膜具有这样的结构，其中线膨胀系数为80ppm /℃或更低的耐热树脂层和由树脂材料形成的柔性树脂层，其肖氏A硬度在JIS-K6253中为10〜80层压。可以通过粘合剂将多个芯片元件与衬底对准，临时粘贴多个芯片元件，将用于多芯片封装的缓冲膜设置在芯片元件和结合头之间，从而制造多芯片模块，使得耐热树脂层存在于芯片元件侧，利用接合头对多个芯片元件进行加热加压。版权所有（C）2012，JPO＆INPIT

5. 发明专利

JP2011100927A Bonding agent composition 审中-公开
标题翻译：粘合剂组合物
公开(公告)号：JP2011100927A
公开(公告)日：2011-05-19
申请号：JP2009256187
申请日：2009-11-09
申请人： Sony Chemical & Information Device Corp , ソニーケミカル&インフォメーションデバイス株式会社
发明人： NAMIKI HIDEJI , KANISAWA SHIKO , KATAYANAGI MOTOKI
IPC分类号： H01L23/29 , C08G59/42 , C09J11/06 , C09J133/14 , C09J163/00 , H01L21/60 , H01L23/31 , H05K3/32
CPC分类号： C08G59/24 , C08F265/04 , C08F283/10 , C08G59/4215 , C08L33/068 , C08L33/10 , C08L2666/04 , C09J151/06 , C09J151/08 , C09J163/00 , H01L24/29 , H01L2224/16 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/29298 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01056 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07811 , H01L2924/12041 , H01L2924/14 , H01L2924/15788 , H01L2924/00 , C08F2220/1808 , C08F2220/1825 , C08F2220/325 , C08F2220/1858 , C08F220/06 , C08F220/14 , C08F220/20 , C08F22/04 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： PROBLEM TO BE SOLVED: To simultaneously solve the problems of reduction in bonding strength, whitening and coloring of hardening composition, and of corrosion of wires laid on a circuit board which occur, when the acrylic resin is mixed to a bonding agent composition containing alicyclic epoxy compound and acid anhydride for flip-chip mounting of a chip component. SOLUTION: The bonding agent composition for flip-chip mounting of a chip component to a circuit board contains: alicyclic epoxy compound; alicyclic acid anhydride system hardening agent; and acrylic resin. The content of alicyclic acid anhydride system hardening agent is 80 to 120 pts.mass for the alicyclic epoxy compound of 100 pts.mass, while the amount of acrylic resin is 5 to 50 pts.mass within 100 pts.mass in total of alicyclic epoxy compound, alicyclic acid anhydride system hardening agent and acrylic resin. The acrylic resin is obtained by co-polymerization of alkyl(metha)acrylate and glycidylmethacrylate of 2 to 100 pts.mass for the alkyl(metha)acrylate of 100 pts.mass, and has a suction coefficient of 1.2% or less. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题为了同时解决当发生丙烯酸树脂混合到粘合剂组合物中时，粘合强度降低，硬化组合物的增白和着色以及布置在电路板上的电线的腐蚀的问题含有脂环族环氧化合物和酸酐，用于芯片组件的倒装芯片安装。解决方案：用于将芯片部件倒装芯片安装到电路板的粘合剂组合物包含：脂环族环氧化合物; 脂环酸酐系硬化剂; 和丙烯酸树脂。脂环酸酐体系硬化剂的含量为80〜120 pts.mass，脂环族环氧化合物为100 pts.mass，而丙烯酸树脂的用量为5〜50 pts.mass，总共100 pts.mass为脂环族环氧树脂化合物，脂环酸酐系统硬化剂和丙烯酸树脂。丙烯酸树脂通过丙烯酸烷基酯（甲基）丙烯酸酯和甲基丙烯酸缩水甘油酯为100质量份的烷基（甲基）丙烯酸酯共聚而得到，吸附系数为1.2％以下。版权所有（C）2011，JPO＆INPIT

6. 发明专利

JP2007242752A Mounting method, board with electrical component, and electrical device 有权
标题翻译：安装方法，带电气元件的电路板和电气设备
公开(公告)号：JP2007242752A
公开(公告)日：2007-09-20
申请号：JP2006060600
申请日：2006-03-07
申请人： Sony Chemical & Information Device Corp , ソニーケミカル&インフォメーションデバイス株式会社
发明人： FURUTA KAZUTAKA , KANISAWA SHIKO , TANIGUCHI MASAKI
IPC分类号： H01L21/60 , H05K3/32
CPC分类号： H05K3/323 , H01L24/29 , H01L24/31 , H01L24/75 , H01L24/83 , H01L2224/16225 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/73204 , H01L2224/75251 , H01L2224/75252 , H01L2224/75315 , H01L2224/7598 , H01L2224/83192 , H01L2224/83851 , H01L2224/83859 , H01L2224/83862 , H01L2224/83871 , H01L2224/83874 , H01L2224/83885 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01033 , H01L2924/01078 , H01L2924/0665 , H01L2924/0781 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/19043 , H05K3/305 , H05K2201/10674 , Y02P70/613 , H01L2924/00 , H01L2224/0401
摘要： PROBLEM TO BE SOLVED: To provide a mounting method for precisely mounting an electrical component. SOLUTION: An adhesive layer 20 contains a thermosetting resin and a radiation-setting resin, and a part of the adhesive layer 20 sticks outside the edge of an electrical component 15. Radiation 29 does not pass through the electrical component 15, so that the radiation-setting resin does not polymerize at the part right in the back of the electrical component 15 of the adhesive layer 20, but polymerizes at the stick-out part 26. The polymerized radiation-setting resin fixes the electrical component 15, so that the electrical component 15 does not shift in position when heated and pressed. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于精确安装电气部件的安装方法。粘合剂层20包含热固性树脂和辐射固化树脂，并且粘合剂层20的一部分粘附在电气部件15的边缘之外。辐射29不通过电气部件15，因此辐射固化树脂在粘合剂层20的电气部件15的背面的正好部分处不聚合，而是在伸出部分26聚合。聚合的辐射固化树脂固定电气部件15，因此当加热和按压时，电气部件15不会在位置上移动。版权所有（C）2007，JPO＆INPIT

7. 发明专利

JP2012186322A Light reflecting anisotropic conductive adhesive, and light-emitting device 有权
标题翻译：光反射导电粘合剂和发光装置
公开(公告)号：JP2012186322A
公开(公告)日：2012-09-27
申请号：JP2011048625
申请日：2011-03-07
申请人： Sony Chemical & Information Device Corp , ソニーケミカル&インフォメーションデバイス株式会社
发明人： NAMIKI HIDEJI , KANISAWA SHIKO , UMAGOE HIDEAKI , ISHIGAMI AKIRA
IPC分类号： H01L33/62
CPC分类号： H01L33/60 , C09J9/02 , H01L24/29 , H01L24/32 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16227 , H01L2224/2929 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29386 , H01L2224/2939 , H01L2224/294 , H01L2224/32225 , H01L2224/45144 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/81903 , H01L2224/83851 , H01L2224/9211 , H01L2924/00014 , H01L2924/01029 , H01L2924/07811 , H01L2924/12041 , H01L2924/181 , H01L2924/3512 , H01L2924/00 , H01L2924/00015 , H01L2924/00012 , H01L2924/05341 , H01L2924/05432 , H01L2224/81 , H01L2224/83 , H01L2224/05599
摘要： PROBLEM TO BE SOLVED: To provide an anisotropic conductive adhesive, along with a light-emitting device in which the adhesive is used to flip-chip mount a light emitting element on a wiring board, capable of improving light emission efficiency and suppressing/preventing degradation of connection reliability and occurrence of a crack, without providing a light reflecting layer which can cause increase in manufacturing cost on an LED element when manufacturing the light-emitting device by flip-chip mounting a light emitting element such as a light emitting diode (LED) element on a wiring board by using an anisotropic conductive adhesive.SOLUTION: A light reflecting anisotropic conductive adhesive which is used for anisotropic conductive connection of a light emitting element to a wiring board, contains a thermo-setting resin composition, conductive particles, light reflecting needle-like insulating particles, and light reflecting spherical insulating particles. The blending amount of the light reflecting needle-like insulating particles and the light reflecting spherical insulating particles in the thermo-setting resin composition is 1-50 vol.% respectively against the thermo-setting resin composition. The blending ratio (V/V) of the light reflecting spherical insulating particles against the light reflecting needle-like insulating particles is 1:1-10.
摘要翻译：要解决的问题：为了提供各向异性导电粘合剂以及发光装置，其中使用粘合剂将发光元件倒装安装在布线板上，能够提高发光效率并抑制 /防止连接可靠性的劣化和裂纹的发生，而不会提供光反射层，当通过倒装芯片安装诸如发光的发光元件来制造发光器件时，可以导致LED元件的制造成本的增加二极管（LED）元件通过使用各向异性导电粘合剂在布线板上。解决方案：用于发光元件到布线板的各向异性导电连接的光反射各向异性导电粘合剂包含热固性树脂组合物，导电颗粒，光反射针状绝缘颗粒和光反射球形绝缘颗粒。热固性树脂组合物中的光反射针状绝缘粒子和光反射球形绝缘粒子的配合量相对于热固性树脂组合物分别为1-50体积％。光反射球形绝缘颗粒与光反射针状绝缘颗粒的混合比（V / V）为1：1-10。版权所有（C）2012，JPO＆INPIT

8. 发明专利

JP2011219683A Curable resin composition, adhesive epoxy resin paste, die-bonding agent, non-conductive paste, adhesive epoxy resin film, non-conductive epoxy resin film, anisotropic conductive paste, and anisotropic conductive film 有权
标题翻译：可固化树脂组合物，粘合剂环氧树脂粘合剂，粘合剂，非导电性粘合剂，粘合性环氧树脂膜，非导电性环氧树脂膜，各向异性导电胶和各向异性导电膜
公开(公告)号：JP2011219683A
公开(公告)日：2011-11-04
申请号：JP2010092671
申请日：2010-04-13
申请人： Sony Chemical & Information Device Corp , ソニーケミカル&インフォメーションデバイス株式会社
发明人： NAMIKI HIDEJI , ISHIGAMI AKIRA , UMAGOE HIDEAKI , KANISAWA SHIKO
IPC分类号： C08G59/18 , C08G59/42 , C09J7/00 , C09J9/02 , C09J11/06 , C09J163/00 , C09J201/00 , H01B1/22 , H01B5/16
CPC分类号： C08G59/42 , C08F220/18 , C08L33/068 , C08L63/00 , C09J9/02 , C09J163/00 , H01L2224/14 , H01L2224/48091 , H01L2224/49107 , H01L2224/73204 , H01L2224/73265 , C08F2220/1808 , C08F2220/325 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a curable resin composition which exhibits increased resistance to thermal shock or the like in a high temperature and high humidity environment and high adhesion, high conduction reliability and excellent crack resistance.SOLUTION: The curable resin composition contains an epoxy resin and a curing agent for an epoxy resin, and is characterized in that the difference between the maximum tanδ value in a viscoelastic spectrum and a tanδ value at -40°C is at least 0.1.
摘要翻译：要解决的问题：提供一种在高温高湿环境下耐热冲击等性能提高的固化性树脂组合物，高粘合性，高传导可靠性和优异的抗龟裂性。解决方案：可固化树脂组合物含有环氧树脂和环氧树脂固化剂，其特征在于，粘弹性谱中的最大tanδ值与-40℃下的tanδ值之间的差异至少为 0.1。版权所有（C）2012，JPO＆INPIT

9. 发明专利

JP2007235045A Functional element packaging module, its process for fabrication, resin sealing plate used therefor, and substrate structure for resin sealing 有权
标题翻译：功能元件包装模块，其制造方法，其使用的树脂密封板以及用于树脂密封的基板结构
公开(公告)号：JP2007235045A
公开(公告)日：2007-09-13
申请号：JP2006057876
申请日：2006-03-03
申请人： Sony Chemical & Information Device Corp , ソニーケミカル&インフォメーションデバイス株式会社
发明人： HOTTA YOSHITO , KANISAWA SHIKO , ASADA TAKAHIRO , YONEDA YOSHIHIRO
IPC分类号： H01L21/56
CPC分类号： H01L21/56 , B81B7/0067 , B81C2203/0109 , B81C2203/032 , H01L23/24 , H01L24/48 , H01L27/14618 , H01L31/0203 , H01L2224/05554 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/01004 , H01L2924/09701 , H01L2924/10161 , H01L2924/16195 , H01L2924/1815 , Y10T156/10 , Y10T428/24273 , Y10T428/24331 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： PROBLEM TO BE SOLVED: To provide a process for fabrication of a functional element packaging module which achieves resin sealing of a functional element, without degrading function of a functional part. SOLUTION: On a substrate 2 where a functional element 1 having a functional part 1a is mounted, a resin sealing plate 3 provided with an opening 3a corresponding to the functional part 1a of the functional element 1 is arranged to face each other with a specified interval. A sealing resin 5 is made to penetrate and fill the gap between the substrate 2 and the resin sealing plate 3 by utirizing capillarity. COPYRIGHT: (C)2007,JPO&INPIT

10. 发明专利

JP2012124504A Method of implementing electrical component 审中-公开
标题翻译：实现电气元件的方法
公开(公告)号：JP2012124504A
公开(公告)日：2012-06-28
申请号：JP2012007682
申请日：2012-01-18
申请人： Sony Chemical & Information Device Corp , ソニーケミカル&インフォメーションデバイス株式会社
发明人： MATSUMURA TAKASHI , ANDO HISASHI , KANISAWA SHIKO , SUGA YASUHIRO , SUZUKI KAZUAKI
IPC分类号： H05K3/32 , G02F1/1345 , H01L21/60
CPC分类号： H01L2224/75315 , H01L2224/75316 , H01L2924/07811 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a method of implementation by which electrical components of different method of implementation can be efficiently implemented using adhesive agent.SOLUTION: With a method of implementation, an electrical component is implemented on a glass substrate 1 using a thermo-compression-bonding head 7 having a crimp component 8 made of prescribed elastomer for a head body 8. The method includes a process in which after an anisotropic conductive adhesive film 4 is arranged in the whole area of an implementation area 3 on the glass substrate 1 for a liquid crystal display device having an ITO electrode, electrical components of a COG method and a FOG method are arranged in the implementation area 3 and the electrical components are collectively thermally crimped using the crimp component 8 whose size corresponds to the anisotropic conductive adhesive film 4. The thermo-compression-bonding process also serves as a process in which the ITO electrode is sealed by thermo-compressing and thermally hardening the binding resin of the anisotropic conductive adhesive film 4 arranged in the whole area of the implementation area 3 using the thermo-compression-bonding head 7.
摘要翻译：要解决的问题：提供一种实现方法，通过该方法可以使用粘合剂有效地实现不同实施方式的电气部件。解决方案：使用实施方法，使用具有由用于头体8的规定弹性体制成的卷曲部件8的热压接头7在玻璃基板1上实现电部件。该方法包括：其中，在具有ITO电极的液晶显示装置的玻璃基板1上，在实施区域3的整个区域中布置各向异性导电粘合膜4之后，将COG法和FOG法的电气元件配置在使用尺寸对应于各向异性导电粘合膜4的卷曲部件8，将电气部件共同热卷曲。热压接工序也用作通过热压缩来密封ITO电极的工序并使用热敏电阻热固化布置在实施区域3的整个区域中的各向异性导电粘合膜4的粘合树脂，压接头7.版权所有（C）2012，JPO＆INPIT

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