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    • 1. 发明专利
    • Projection type display apparatus and rear projection television
    • 投影类型显示设备和后期投影电视
    • JP2008170774A
    • 2008-07-24
    • JP2007004381
    • 2007-01-12
    • Showa Denko KkSony Corpソニー株式会社昭和電工株式会社
    • TERASAKI KAZUYAMIWA SATORUHATASAKI TOMOYAKUMAKURA KAZUHIRO
    • G03B21/16G02F1/13G03B21/10H04N5/74
    • PROBLEM TO BE SOLVED: To provide a projection type display apparatus advantageous in efficiently cooling an illuminating optical section and an image forming section, and to provide a rear projection television. SOLUTION: Air circulates within a first air path 42 by the drive of a fan 50, and outside air flows in a second air path 44 by the drive of a fan 52. The flow of air circulating in the first air path 42 is separated into a cooling path 46 for illuminating optical part and three cooling paths 48A, 48B, and 48C, via four blowing ports 5,602, 5,604, 5,606, and 5,608, from a forward path 42A. Accordingly, a polarization conversion element 22D, first to third image modulation elements 30R, 30G, and 30B and an image synthesizing section 32 are cooled by corresponding separate currents of air. COPYRIGHT: (C)2008,JPO&INPIT
    • 解决的问题:提供有利于有效地冷却照明光学部分和图像形成部分的投影型显示装置,并提供背投电视。 解决方案:空气通过风扇50的驱动在第一空气路径42内循环,外部空气通过风扇52的驱动在第二空气路径44中流动。在第一空气路径42中循环的空气流 通过四个吹出口5,602,5,604,5,606和5,608从前向通路42A分离成用于照射光学部件和三个冷却通路48A,48B和48C的冷却通路46。 因此,偏振转换元件22D,第一至第三图像调制元件30R,30G,30B和图像合成部32被相应的分开的空气流冷却。 版权所有(C)2008,JPO&INPIT
    • 2. 发明专利
    • Liquid-cooing system and electronic device having the same
    • 液体加料系统和具有该液体系统的电子设备
    • JP2006216906A
    • 2006-08-17
    • JP2005030793
    • 2005-02-07
    • Sony Corpソニー株式会社
    • TERASAKI KAZUYAITO YUKIOHAGA MOTOHISAMIWA SATORUNAKAGAWA SHIGEYASU
    • H05K7/20H01L23/473
    • PROBLEM TO BE SOLVED: To provide a liquid-cooling system capable of efficiently liquid-cooling a plurality of heat-generating elements in a chassis and an electronic device having the liquid-cooling system.
      SOLUTION: A plurality of heat-receiving elements 3, fixed in close connection with a plurality of heat-generating elements 2, are connected to a heat-radiating unit 4 and a circulating pump 5 through pipes 6 and tubes 7. A piping system is constructed, such that at least one heat-receiving element 3 is connected in parallel to the other heat-receiving elements or elements 3, so that pipe resistance is reduced to allow the cooling medium, filled in the piping to fully circulate, even if a small circulating pump 5 is employed.
      COPYRIGHT: (C)2006,JPO&NCIPI
    • 要解决的问题:提供一种液体冷却系统,其能够有效地冷却底盘中的多个发热元件和具有液体冷却系统的电子设备。 解决方案:多个与多个发热元件2紧密连接的受热元件3通过管6和管7连接到散热单元4和循环泵5。 管道系统被构造成使得至少一个热接收元件3与其它受热元件3并联连接,使得管阻力减小,以使填充在管道中的冷却介质完全循环, 即使使用小循环泵5。 版权所有(C)2006,JPO&NCIPI
    • 3. 发明专利
    • Cooling module
    • 冷却模块
    • JP2009094130A
    • 2009-04-30
    • JP2007260842
    • 2007-10-04
    • Sony Corpソニー株式会社
    • TERASAKI KAZUYAMIWA SATORUMIIKE MASAMIYAMAOKA KEI
    • H01L23/34H01L23/36H01L35/30
    • H01L2924/0002H01L2924/00
    • PROBLEM TO BE SOLVED: To perform temperature measurement exactly while controlling thermal resistance. SOLUTION: A thin film temperature measurement element 34 is formed on the ceramic substrate 31 of a thermoelectric conversion module 12 by sputtering. The thin film temperature measurement element 34 is arranged on the main heat dissipation passage of a heating element, i.e. a function component, immediately thereunder and delivers information about the temperature of the thermoelectric conversion module 12 to an electric connection 36 which is connected with an external substrate through a flexible cable, for example. Electrical characteristics, such as the voltage value, current value and electric resistance value, of the thin film temperature measurement element 34 are measured based on a signal from the external substrate and the temperature on the upper surface of a present ceramic substrate 31 in the drawing can be measured based on the electrical characteristics of the thin film temperature measurement element 34 obtained based on a signal from the external substrate. COPYRIGHT: (C)2009,JPO&INPIT
    • 要解决的问题:在控制热阻时精确地进行温度测量。 解决方案:通过溅射在热电转换模块12的陶瓷基板31上形成薄膜温度测量元件34。 薄膜温度测量元件34布置在加热元件的主散热通道上,即功能部件,紧接其后,将关于热电转换模块12的温度的信息传送到与外部连接的电连接器36 基板通过柔性电缆。 基于来自外部基板的信号和图中的本陶瓷基板31的上表面的温度来测量薄膜温度测量元件34的电特性,例如电压值,电流值和电阻值 可以基于基于来自外部基板的信号获得的薄膜温度测量元件34的电特性来测量。 版权所有(C)2009,JPO&INPIT