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    • 5. 发明专利
    • Light emitting element, light emitting device, and method of manufacturing light emitting element
    • 发光元件,发光装置及制造发光元件的方法
    • JP2011035315A
    • 2011-02-17
    • JP2009182615
    • 2009-08-05
    • Sharp Corpシャープ株式会社
    • ISHIDA SHINYATANI YOSHIHIKOMASAMURA NAOKIHANAOKA DAISUKE
    • H01S5/028H01S5/343
    • PROBLEM TO BE SOLVED: To provide a light emitting element wherein amounts of extension of end surface coat films, formed on a resonator end surface, extending around to a principal surface are controlled to a designed amount, to provide a method of manufacturing the light emitting element that can easily obtain the light emitting element, and to provide a light emitting device including the light emitting element. SOLUTION: When the end surface coat films 16a, 16b are formed of a dielectric on the resonator end surface of the light emitting element 1, they are formed to partially extend around to the principal surface. Further, markers 15a, 15b are formed of metal on the principal surface. When ends of the end surface coat films 16a, 16b are on the markers, the ends are visible. Consequently, the amounts of extension of the end surface coat films 16a, 16b can be confirmed by viewing the markers 15a, 15b. COPYRIGHT: (C)2011,JPO&INPIT
    • 要解决的问题:为了提供一种发光元件,其中形成在谐振器端面上的端面涂层膜的延伸量延伸到主表面,以提供制造方法 可以容易地获得发光元件的发光元件,以及提供包括该发光元件的发光器件。 解决方案:当端面涂层膜16a,16b由发光元件1的谐振器端面上的电介质形成时,它们形成为部分地延伸到主表面。 此外,标记物15a,15b由主表面上的金属形成。 当端面涂层膜16a,16b的端部在标记上时,端部是可见的。 因此,可以通过观察标记物15a,15b来确认端面涂层膜16a,16b的延伸量。 版权所有(C)2011,JPO&INPIT
    • 6. 发明专利
    • Nitride semiconductor light-emitting element
    • 氮化物半导体发光元件
    • JP2007305635A
    • 2007-11-22
    • JP2006129792
    • 2006-05-09
    • Sharp Corpシャープ株式会社
    • HANAOKA DAISUKE
    • H01S5/343
    • PROBLEM TO BE SOLVED: To provide an end face emitting nitride semiconductor light-emitting element capable of forming a high-dislocation density region and a low-dislocation density region without being affected by surface flatness in a nitride semiconductor growth layer, where a plurality of nitride semiconductor thin films are laminated on a wafer in a plane.
      SOLUTION: When manufacturing the nitride compound semiconductor light-emitting element by forming a layer by a nitride semiconductor on a substrate, where dislocation density is distributed in a plane, and a semiconductor layer that becomes a substrate, a stripe shape is formed so that the width of a resonator end face side becomes larger and the width of a center becomes narrower.
      COPYRIGHT: (C)2008,JPO&INPIT
    • 解决的问题:提供能够形成高位错密度区域和低位错密度区域的端面发光氮化物半导体发光元件,而不受氮化物半导体生长层中的表面平坦度的影响,其中 在平面中的晶片上层叠多个氮化物半导体薄膜。 解决方案:通过在基板上将位错密度分布在平面中的氮化物半导体形成层和形成基板的半导体层来制造氮化物化合物半导体发光元件时,形成条形 使得谐振器端面侧的宽度变大并且中心的宽度变窄。 版权所有(C)2008,JPO&INPIT
    • 7. 发明专利
    • Method and apparatus for manufacturing nitride semiconductor laser light source
    • 用于制造氮化物半导体激光光源的方法和装置
    • JP2006140441A
    • 2006-06-01
    • JP2005262785
    • 2005-09-09
    • Sharp Corpシャープ株式会社
    • HANAOKA DAISUKEISHIDA SHINYAOGAWA ATSUSHITANI YOSHIHIKOISHIKURA TAKURO
    • H01S5/022H01S5/323
    • PROBLEM TO BE SOLVED: To provide a method of manufacturing a nitride semiconductor laser light source which can emit light over a long term, even in an high-temperature atmosphere, and to provide a manufacturing apparatus for the nitride semiconductor laser light source.
      SOLUTION: In the manufacturing method of the nitride semiconductor laser light source, the nitride semiconductor laser light source has a nitride semiconductor laser chip, a stem for mounting the laser chip and a cap covering the laser chip. The laser chip is sealed in a closed vessel made up of the stem and the cap. The method comprises an ashing step of exposing the laser chip, the stem, or the surface of the cap to ozones or excited oxygen atoms to clean process the laser chip, the stem, or the surface of the cap; and a capping step of supplying first gas to the laser cap, the stem, and the surface of the cap, after the ashing step and sealing the laser chip in the vessel made up of the stem and the cap in an atmosphere of the first gas.
      COPYRIGHT: (C)2006,JPO&NCIPI
    • 解决的问题:为了提供即使在高温环境下长时间发光的氮化物半导体激光光源的制造方法,也可以提供氮化物半导体激光光源的制造装置 。 解决方案:在氮化物半导体激光源的制造方法中,氮化物半导体激光光源具有氮化物半导体激光芯片,用于安装激光芯片的杆和覆盖激光芯片的盖。 激光芯片密封在由阀杆和盖子组成的密闭容器中。 该方法包括将激光器芯片,杆或表面暴露于臭氧或激发的氧原子以清洁处理激光芯片,杆或盖的表面的灰化步骤; 以及在灰化步骤之后,在第一气体的气氛中将激光芯片密封在由杆和盖组成的容器中的激光器芯片的第一气体供应到激光器盖,杆和盖的表面的封盖步骤 。 版权所有(C)2006,JPO&NCIPI
    • 9. 发明专利
    • Assembly apparatus
    • 装配装置
    • JP2012094922A
    • 2012-05-17
    • JP2012030420
    • 2012-02-15
    • Sharp Corpシャープ株式会社
    • ITO SHIGETOSHITAKATANI KUNIHIROHANAOKA DAISUKETSUDA YUZO
    • H01S5/022
    • PROBLEM TO BE SOLVED: To provide an assembly apparatus capable of assembling a semiconductor laser device having a semiconductor laser element whose stability of lifetime is made satisfactory by restricting the HO concentration in enclosure atmosphere closed by using a cap.SOLUTION: The assembly apparatus comprises: an assembling chamber which can be sealed from the outside, and where an assembly process is performed in which a cap for sealing a nitride semiconductor laser element with a gas is bonded on a stem in which the nitride semiconductor laser element comprising nitride semiconductor layers stacked are laminated; a moisture concentration control part for controlling the moisture concentration in gas atmosphere in the assembling chamber to be equal to or less than 400 ppm; a first pressure adjustment part for adjusting the pressure in the assembling chamber; a load lock chamber capable of being sealed from ambient air and adjacent to the assembling chamber; and a second pressure adjustment part for adjusting the pressure in the load lock chamber. The second pressure adjustment part is a vacuum pump.
    • 解决的问题:提供一种组装装置,其能够组装具有半导体激光元件的半导体激光元件,其半导体激光元件的寿命稳定性通过限制H 2 < 通过使用盖封闭封闭气氛中的浓度。 组装装置包括:可从外部密封的组装室,并且在其上进行组装过程,其中用于将氮气半导体激光元件与气体密封的盖接合在杆上,其中 层叠由氮化物半导体层构成的氮化物半导体激光元件, 用于将组装室内的气体气氛中的水分浓度控制为等于或小于400ppm的水分浓度控制部; 用于调节组装室中的压力的​​第一压力调节部件; 能够与环境空气密封并且靠近组装室的装载锁定室; 以及用于调节负载锁定室中的压力的​​第二压力调节部件。 第二压力调节部是真空泵。 版权所有(C)2012,JPO&INPIT
    • 10. 发明专利
    • Cap member and semiconductor device using the same
    • CAP会员和使用它的半导体器件
    • JP2009135235A
    • 2009-06-18
    • JP2007309425
    • 2007-11-29
    • Sharp Corpシャープ株式会社
    • ISHIDA SHINYAHANAOKA DAISUKEHORIGUCHI TAKESHI
    • H01S5/022
    • H01S5/02212H01L2224/48091H01L2924/19107H01S5/02296H01L2924/00014
    • PROBLEM TO BE SOLVED: To provide a cap member that achieves improvement of manufacturing yields while alleviating degradation of reliability. SOLUTION: The cap member 100 has a cylindrical sidewall portion 101, a top face portion 102 that closes one end of the sidewall portion 101 and has a light-exit hole 102a formed therein to allow extraction of laser light emitted from a semiconductor laser device 30 to the outside, a light transmissive window 104 attached to the top face portion 102 such that the light-exit hole 102a is closed, and a flange 103 arranged at the other end of the sidewall portion 101 and welded on the upper face of a stem 1 on which the semiconductor laser device 30 is mounted. A groove 111 is formed in an inner surface of the top face portion 102, and this groove 111 forms a part 110, whose thickness is smaller than that of the other part, in a prescribed region of the top face portion 102. COPYRIGHT: (C)2009,JPO&INPIT
    • 要解决的问题:提供一种在减轻可靠性降低的同时实现制造成品率的提高的盖部件。 解决方案:盖构件100具有圆筒形侧壁部分101,封闭侧壁部分101的一端并具有形成在其中的出光孔102a的顶面部分102,以允许从半导体发射的激光的提取 激光装置30到外部,附接到顶面部分102的光透射窗口104,使得出射孔102a关闭;以及凸缘103,凸缘103布置在侧壁部分101的另一端并焊接在上表面 其上安装有半导体激光装置30的杆1。 在顶面部102的内表面形成有槽111,该沟槽111在顶面部102的规定区域中形成厚度小于另一部分的部分110。 版权所有(C)2009,JPO&INPIT