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1. 发明专利

JP2013153069A Wiring board, light emitting device, and manufacturing method of wiring board 有权
标题翻译：接线板，发光装置和接线板的制造方法
公开(公告)号：JP2013153069A
公开(公告)日：2013-08-08
申请号：JP2012013243
申请日：2012-01-25
申请人： Shinko Electric Ind Co Ltd , 新光電気工業株式会社
发明人： MURAMATSU SHIGEJI , SHIMIZU HIROSHI , HORIKAWA YASUYOSHI
IPC分类号： H01L33/48
CPC分类号： H05K7/2039 , F21K9/90 , F21V7/00 , H01L2224/16225 , H05K1/0274 , H05K1/056 , H05K3/3452 , H05K3/46 , H05K2201/0191 , H05K2201/09409 , H05K2201/099 , H05K2201/10106 , H05K2201/2054
摘要： PROBLEM TO BE SOLVED: To provide a wiring board, a light emitting device, and a manufacturing method of the wiring board which inhibit the interference between a reflection layer and a light emitting element.SOLUTION: A wiring board 1 includes: a heat sink 10; an insulation layer 20 formed on the heat sink 10; multiple wiring patterns 30 formed on the insulation layer 20 so as to be separated therefrom; and a first reflection layer 50 formed on the wiring patterns 30, exposing parts of upper surfaces 30A of the wiring patterns 30 and the insulation layer 20, and having openings 50X that will become light emitting mounting regions. Further, the wiring board 1 has a second reflection layer 60 covering the insulation layer 20 exposed from the wiring patterns 30, which are formed separated from the insulation layer 20, in the light emitting element mounting regions. The second reflection layer 60 is formed so as to be thinner than the first reflection layer 50.
摘要翻译：要解决的问题：提供一种抑制反射层和发光元件之间的干扰的布线板，发光器件和布线板的制造方法。解决方案：布线板1包括：散热片10 ; 形成在散热片10上的绝缘层20; 形成在绝缘层20上以与之分离的多个布线图案30; 以及形成在布线图案30上的第一反射层50，暴露布线图案30的上表面30A和绝缘层20的部分，并且具有将成为发光安装区域的开口50X。此外，布线基板1具有覆盖从发光元件安装区域与绝缘层20分离的布线图案30露出的绝缘层20的第二反射层60。第二反射层60形成为比第一反射层50薄。

2. 发明专利

JP2005026313A Method of manufacturing wiring board 审中-公开
标题翻译：制造接线板的方法
公开(公告)号：JP2005026313A
公开(公告)日：2005-01-27
申请号：JP2003187669
申请日：2003-06-30
申请人： Shinko Electric Ind Co Ltd , 新光電気工業株式会社
发明人： HORIKAWA YASUYOSHI , MUTSUKAWA AKIO , IIJIMA TAKAHIRO
IPC分类号： H05K3/40 , H01L21/48 , H05K3/44 , H05K3/46
CPC分类号： H01L21/486 , H01L2224/16 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/3025 , H05K3/4046 , H05K3/445 , H05K3/4602 , H05K3/4608 , H05K2201/0195 , H05K2201/096 , H05K2201/09609 , H05K2201/10378 , H05K2201/10416 , H05K2203/025 , H01L2224/0401
摘要： PROBLEM TO BE SOLVED: To provide a method of flattening a level difference caused by the projection of a conductive part without any trouble, in a manufacturing method of a wiring board which has a structure wherein the conductive part is inserted into the through-hole of a core board while having the projection protruding from the core board. SOLUTION: The method of flattening a level difference comprises processes of preparing the core board 10 equipped with a through-hole 10a arranging the conductive part 20 in the through-hole 10a making the tips of the conductive part 20 serve as projections 20a and 20b protruding from the core board 10 by inserting the conductive part 20 longer than the thickness of the core board 10 into the through-hole 10a of the core board 10, forming insulating films 12a and 12b on the core board 10 so as to cover the projections 20a and 20b of the conductive part 20, and flattening the insulating films 12a and 12b by grinding them. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提供一种在没有任何问题的情况下平坦化由导电部件的突出引起的电平差的方法，在布线板的制造方法中，其具有将导电部插入到通孔同时具有从芯板突出的突出部的芯板的孔。解决方案：平坦化水平差的方法包括制备具有将导电部分20布置在通孔10a中的通孔10a的芯板10的工艺，使得导电部分20的末端用作突起20a 并且通过将比芯芯10的厚度长的导电部20插入到芯板10的通孔10a中，从芯板10突出，并且在芯板10上形成绝缘膜12a和12b以覆盖导电部20的突出部20a，20b，通过研磨绝缘膜12a，12b使其平坦化。版权所有（C）2005，JPO＆NCIPI

3. 发明专利

JP2003045871A Method for forming wiring pattern 审中-公开
标题翻译：形成接线图的方法
公开(公告)号：JP2003045871A
公开(公告)日：2003-02-14
申请号：JP2001226405
申请日：2001-07-26
申请人： Shinko Electric Ind Co Ltd , 新光電気工業株式会社
发明人： HORIKAWA YASUYOSHI , MATSUDA YUICHI , ITO HITOSHI
IPC分类号： C25D5/02 , C25D7/00 , H01L21/027 , H01L21/302 , H01L21/3065 , H01L21/3205 , H01L23/52 , H05K3/18
摘要： PROBLEM TO BE SOLVED: To provide a method for forming a highly reliable wiring pattern through which a wiring board having an extremely high precision can be produced.
SOLUTION: A negative photosensitive resist is applied onto a board 10 and then exposed into a specified pattern and developed to form a plated resist pattern 14, and a conductor is formed to become a wiring pattern at the opening part of the plated resist pattern 14 which is then removed to form a wiring pattern 24. In such a method for forming the wiring pattern 24, an object to be machined on which the plated resist pattern 14 is formed by exposing and developing the photosensitive resist undergoes anisotropic plasma etching and then the plated resist pattern 14 is shaped to remove a skirt part 18a formed along the base part thereof thus forming a conductor part.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：提供一种用于形成高可靠性布线图案的方法，通过该方法可以产生具有极高精度的布线板。解决方案：将负光敏抗蚀剂施加到板10上，然后暴露于指定图案并显影以形成电镀抗蚀剂图案14，并且形成导体以在电镀抗蚀剂图案14的开口部分处形成布线图案，然后去除以形成布线图案24.在这种形成布线图案24的方法中，通过曝光和显影感光性抗蚀剂形成镀有抗蚀剂图案14的待加工物体经历各向异性等离子体蚀刻，然后镀覆抗蚀剂图案14被成形为去除沿其基部形成的裙部18a，从而形成导体部分。

4. 发明专利

JP2015050342A 配線基板、発光装置及び配線基板の製造方法有权
标题翻译：接线板，发光装置及制造接线板的方法
公开(公告)号：JP2015050342A
公开(公告)日：2015-03-16
申请号：JP2013181378
申请日：2013-09-02
申请人：新光電気工業株式会社 , Shinko Electric Ind Co Ltd
发明人： HORIKAWA YASUYOSHI
IPC分类号： H01L33/60 , H05K1/05 , H05K3/44
CPC分类号： H01L33/60 , H01L24/45 , H01L25/167 , H01L33/62 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48228 , H01L2224/73265 , H01L2924/181 , H01L2924/19107 , H05K1/0274 , H05K1/056 , H05K1/187 , H05K1/188 , H05K2201/0376 , H05K2201/10106 , H05K2201/10174 , H05K2201/10636 , Y02P70/611 , H01L2924/00014 , H01L2924/00
摘要：【課題】反射率の低下を抑制することができる配線基板を提供する。【解決手段】配線基板14は、絶縁層50と、絶縁層50の凹部50Xの底面上に形成され、互いに離間して形成された複数の配線31,32と、配線32の上面32A上に形成されためっき層40とを有する。また、配線基板14は、めっき層40の少なくとも一部を接続パッドP1として露出する開口部80Xを有する絶縁層80と、配線32の下面32Bに実装され、絶縁層50内に埋め込まれた電子部品60とを有する。【選択図】図2
摘要翻译：要解决的问题：提供能够抑制反射率降低的布线基板。解决方案：布线板14包括绝缘层50，多个导线31,32形成在绝缘层50的凹部50X的底面上，因此彼此分离，以及形成在导线32的上表面32A上的镀层40.布线板14还包括绝缘层80，绝缘层80具有用于暴露至少一部分镀层40的开口80X，作为连接焊盘P1和安装在导线32的下表面32B上并嵌入绝缘层50中的电子部件60。

5. 发明专利

JP2014179457A Wiring board for mounting light-emitting element, light-emitting device, method of manufacturing wiring board for mounting light-emitting element, and method of manufacturing light-emitting device 有权
标题翻译：用于安装发光元件的接线板，发光装置，用于安装发光元件的布线板的制造方法，以及制造发光装置的方法
公开(公告)号：JP2014179457A
公开(公告)日：2014-09-25
申请号：JP2013052293
申请日：2013-03-14
申请人： Shinko Electric Ind Co Ltd , 新光電気工業株式会社
发明人： KOBAYASHI KAZUKI , HORIKAWA YASUYOSHI , AIZAWA MITSUHIRO , HARA KOJI
IPC分类号： H01L33/60 , H01L23/12 , H01L23/14
CPC分类号： H01L33/60 , H01L24/45 , H01L25/0753 , H01L33/62 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48137 , H01L2224/73265 , H01L2924/0002 , H01L2924/181 , H05K1/0201 , H05K3/28 , H05K2201/0179 , H05K2201/099 , H05K2201/2054 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a wiring board for mounting a light-emitting element, capable of improving adhesion strength between a reflection layer and an adhesive when bonding a light-emitting element to the reflection layer using the adhesive, and to provide a light-emitting device.SOLUTION: A light-emitting device 50 includes: a wiring board 10 which has an insulating layer 12, a wiring pattern 22 formed on the insulating layer 12, an insulating layer 30 formed to cover the wiring pattern 22, and a light-emitting element mounting region provided on an upper surface 30A of the insulating layer 30; and a light-emitting element 51 bonded to the upper surface 30A of the insulating layer 30 with an adhesive 52. A silica film S1 is formed on a part of the upper surface 30A of the insulating layer 30.
摘要翻译：要解决的问题：为了提供一种用于安装发光元件的布线板，当使用粘合剂将发光元件接合到反射层时，能够提高反射层和粘合剂之间的粘合强度，并提供光发光装置50包括：布线基板10，其具有绝缘层12，形成在绝缘层12上的布线图案22，形成为覆盖布线图案22的绝缘层30和设置在绝缘层30的上表面30A上的发光元件安装区域; 以及利用粘合剂52与绝缘层30的上表面30A接合的发光元件51.在绝缘层30的上表面30A的一部分上形成二氧化硅膜S1。

6. 发明专利

JP2013109905A Wiring board for light-emitting device and method for manufacturing light-emitting device as well as wiring board 审中-公开
标题翻译：用于发光装置的接线板和用于制造发光装置的方法作为布线板
公开(公告)号：JP2013109905A
公开(公告)日：2013-06-06
申请号：JP2011252815
申请日：2011-11-18
申请人： Shinko Electric Ind Co Ltd , 新光電気工業株式会社
发明人： KOBAYASHI KAZUKI , HORIKAWA YASUYOSHI , SHIMIZU HIROSHI , AIZAWA MITSUHIRO
IPC分类号： F21S2/00 , F21Y101/02 , H01L33/48
CPC分类号： H01L2224/16225 , H01L2224/32225 , H01L2224/45 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To bring forth an effect of restraining degradation of recognition of a recognition mark, even in case an opening is formed by a screen printing method.SOLUTION: The wiring board 1 includes a board 10, a plurality of wiring patterns 20 formed on a first main face R1 of the board 10, an insulating layer 50 formed on the first main face R1 of the board 10 to expose parts of the wiring patterns 20, and a metal layer 30 formed on the wiring patterns 20 exposed from the insulating layer 50. The insulating layer 50 includes an opening 50Y formed for exposing a whole top face of the metal layer 30 as well as a top face 20A of the wiring patterns 20 around the metal layer 30. The metal layer 30 formed on the wiring patterns 20 exposed from the opening 50Y is to be a recognition mark 40, as a whole of the top face is exposed from the insulating layer 50.
摘要翻译：要解决的问题：即使在通过丝网印刷方法形成开口的情况下，出现抑制识别标记的识别劣化的效果。布线基板1包括基板10，形成在基板10的第一主面R1上的多个布线图案20，形成在基板10的第一主面R1上的绝缘层50，以露出部件的布线图案20以及形成在从绝缘层50露出的布线图案20上的金属层30.绝缘层50包括形成用于暴露金属层30的整个顶面的开口50Y以及顶面在金属层30周围的布线图案20.形成在从开口50Y露出的布线图案20上的金属层30作为识别标记40，整个顶面从绝缘层50露出。版权所有（C）2013，JPO＆INPIT

7. 发明专利

JP2012099352A Connection terminal structure, manufacturing method therefor and socket 有权
标题翻译：连接端子结构及其制造方法及插座
公开(公告)号：JP2012099352A
公开(公告)日：2012-05-24
申请号：JP2010246400
申请日：2010-11-02
申请人： Shinko Electric Ind Co Ltd , 新光電気工業株式会社
发明人： HORIKAWA YASUYOSHI
IPC分类号： H01R33/76
CPC分类号： H01R12/716 , H01R13/2442
摘要： PROBLEM TO BE SOLVED: To provide a connection terminal structure and a manufacturing method therefor, capable of reducing wiring impedance through the connection terminal with a simple structure, and a socket having the connection terminal structure, for electrically connecting a connection object such as a semiconductor package to a mounting substrate etc.SOLUTION: The connection terminal structure includes: a substrate having a plurality of pads formed on the surface; a plurality of connection terminals each having a connection portion to be in contact with the connection object on one end and a plate-like fixation portion on another end, in which a first surface of the fixation portion is bonded to each pad; and an electronic component having two electrode terminals. The electronic component is mounted in such a manner that each electrode terminal is disposed on a surface opposite to the first surface of each fixation portion of mutually adjacent connection terminals.
摘要翻译：要解决的问题：为了提供一种能够以简单的结构减少通过连接端子的布线阻抗的连接端子结构及其制造方法，以及具有连接端子结构的插座，用于将连接对象电连接作为到安装基板等的半导体封装。解决方案：连接端子结构包括：具有形成在表面上的多个焊盘的基板; 多个连接端子，每个连接端子具有与一端上的连接对象接触的连接部分和另一端的板状固定部分，其中固定部分的第一表面接合到每个焊盘; 以及具有两个电极端子的电子部件。电子部件以这样的方式安装，使得每个电极端子设置在与相互相邻的连接端子的每个固定部分的第一表面相对的表面上。版权所有（C）2012，JPO＆INPIT

8. 发明专利

JP2007012746A Wiring board, its manufacturing method, and semiconductor device 审中-公开
标题翻译：接线板及其制造方法和半导体器件
公开(公告)号：JP2007012746A
公开(公告)日：2007-01-18
申请号：JP2005189394
申请日：2005-06-29
申请人： Shinko Electric Ind Co Ltd , 新光電気工業株式会社
发明人： HORIKAWA YASUYOSHI
IPC分类号： H05K3/40 , H01L23/12 , H05K1/02 , H05K3/46
CPC分类号： H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/15192 , H01L2924/15311 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring board by which two independent conductivity paths with a high reliability can be formed inside a through-hole of a substrate without causing any troubles to establish continuity between both faces of the substrate. SOLUTION: A coaxial conductive component 20 is filled with a fluorine-containing resin 20b between an outside conductive portion 20a and an inside conductive portion 20c, and is inserted into the through-hole 10a of the substrate 10. By selectively applying metal plating to a region of the fluorine-containing resin 20b except for the top and bottom faces thereof, a first interconnection layer 12 electrically connected to the outside conductive portion 20a of the conductive component 20 is formed on each face of the substrate. Furthermore, a second interconnection layer 16 electrically connected to the inside conductive portion 20c of the conductive component 20 is formed on the insulation layer 14 on each face sides of the substrate 10 through a via hole 14x formed in each insulation layer 14 which covers the first interconnection layer 12. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种制造布线板的方法，通过该布线板可以在基板的通孔内形成具有高可靠性的两个独立的导电路径，而不会产生任何麻烦来建立两个面之间的连续性基质。解决方案：同轴导电部件20在外部导电部分20a和内部导电部分20c之间填充含氟树脂20b，并插入到基板10的通孔10a中。通过选择性地施加金属电镀到除了上表面和下表面之外的含氟树脂20b的区域，在基板的每个表面上形成电连接到导电部件20的外部导电部分20a的第一互连层12。此外，通过形成在每个绝缘层14中的通孔14x，在基板10的每个正面上的绝缘层14上形成电连接到导电部件20的内部导电部分20c的第二互连层16，互连层12.版权所有（C）2007，JPO＆INPIT

9. 发明专利

JP2004104017A Wiring board and semiconductor device having the wiring board 审中-公开
公开(公告)号：JP2004104017A
公开(公告)日：2004-04-02
申请号：JP2002267074
申请日：2002-09-12
申请人： Shinko Electric Ind Co Ltd , 新光電気工業株式会社
发明人： OI ATSUSHI , HORIKAWA YASUYOSHI
IPC分类号： H01L23/12
CPC分类号： H01L2224/16225 , H01L2224/73204
摘要： PROBLEM TO BE SOLVED: To improve electric characteristics and electromigration when fine wiring patterns are formed on a wiring board for a semiconductor device.
SOLUTION: An insulating layer 23, an inter-layer insulating layer 24 and an outer layer insulating layer 25 are laminated on the upper surface of a resin-made core plate 22 through which vias 21 are formed and the wiring board is provided also with inner wiring patterns 26, vias 27, surface wiring patterns 28, and pads 29. The outer layer insulating layer 25 is made of polymethyl phenyl silane and has a low dielectric constant, a low dielectric tangent and high insulation.
COPYRIGHT: (C)2004,JPO

10. 发明专利

JP2014022465A Wiring board and method of manufacturing the same 有权
标题翻译：接线板及其制造方法
公开(公告)号：JP2014022465A
公开(公告)日：2014-02-03
申请号：JP2012157907
申请日：2012-07-13
申请人： Shinko Electric Ind Co Ltd , 新光電気工業株式会社
发明人： KOIZUMI NAOYUKI , FURUICHI JUN , HORIKAWA YASUYOSHI
IPC分类号： H05K3/46 , H05K1/03 , H05K3/00 , H05K3/28
CPC分类号： H01L23/48 , H01L21/486 , H01L23/13 , H01L23/15 , H01L23/49822 , H01L23/49827 , H01L24/81 , H01L2224/131 , H01L2224/16237 , H01L2224/32225 , H01L2224/73204 , H01L2224/81192 , H01L2924/12042 , H01L2924/15311 , H05K1/0271 , H05K3/0047 , H05K3/0052 , H05K3/4605 , H05K2201/0187 , H05K2201/068 , H05K2201/09145 , H01L2224/16225 , H01L2924/00 , H01L2924/014
摘要： PROBLEM TO BE SOLVED: To provide a wiring board capable of satisfying various conditions as a product in terms of durability, manufacturing yield, productivity, and the like, and to provide a method of manufacturing the same.SOLUTION: In a wiring board 10, an insulating layer 16 and a wiring layer 18 are laminated on a core substrate 12. The core substrate 12 is formed of glass, and part of a side surface of the core substrate 12 is covered with a resin 12a. A bump (connection terminal) 22 for connecting to a semiconductor chip 28 is formed at an opening of a solder resist layer 20 on an upper surface of the wiring board 10. A bump (connection terminal) 24 for connecting to another wiring board is formed at an opening of a solder resist layer 20 on a lower surface of the wiring board 10.
摘要翻译：要解决的问题：提供一种能够在耐久性，制造成品率，生产率等方面满足作为产品的各种条件的布线板，并提供其制造方法。解决方案：在布线板10中，绝缘层16和布线层18层叠在芯基板12上。芯基板12由玻璃形成，芯基板12的一部分侧面被树脂12a覆盖。在布线板10的上表面的阻焊层20的开口处形成用于连接到半导体芯片28的凸块（连接端子）22。形成用于连接到另一布线板的凸块（连接端子）24 在布线板10的下表面上的阻焊层20的开口处。

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