专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2014150103A Wiring board and manufacturing method of the same 有权
标题翻译：接线板及其制造方法
公开(公告)号：JP2014150103A
公开(公告)日：2014-08-21
申请号：JP2013016678
申请日：2013-01-31
申请人： Shinko Electric Ind Co Ltd , 新光電気工業株式会社
发明人： KUBOTA KAZUYUKI , FUJII TOMOJI
IPC分类号： H05K3/46
CPC分类号： H01L23/50 , H01L23/58 , H01L25/105 , H01L2224/16237 , H01L2924/15321 , H05K1/0271 , H05K1/16 , H05K1/185 , H05K3/108 , H05K3/429 , H05K3/4602 , H05K3/462 , H05K3/4644 , H05K2201/0162 , H05K2201/0187 , H05K2201/0195 , H05K2201/0218 , H05K2201/0355 , H05K2201/09536 , H05K2201/10037 , H05K2201/10151 , H05K2203/1461 , H05K2203/1469
摘要： PROBLEM TO BE SOLVED: To reduce damages of a secondary battery incorporated in a wiring board.SOLUTION: A wiring board 10 includes a board body 20 and a secondary battery 30 is incorporated in the board body 20. The board body 20 includes insulation layers 21, 22, 23. The secondary buttery 30 is buried in the second insulation layer 22. The secondary battery 30 is fixed to one main surface of the first insulation layer 21 and is covered by the second insulation layer 22. The secondary battery 30 is a component in which the cubic volume is changed by its use. For example, an all-solid thin film secondary battery is used as the secondary battery 30. A material of the second insulation layer 22 is a resin (a low rigidity resin) having rigidity lower than those of the first and third insulation layers 21, 23.
摘要翻译：要解决的问题：减少包含在布线板中的二次电池的损坏。解决方案：布线板10包括板主体20，并且二次电池30被结合在板主体20中。板主体20包括绝缘层21 二次电池30被埋在第二绝缘层22中。二次电池30被固定到第一绝缘层21的一个主表面并被第二绝缘层22覆盖。二次电池30是其中三次体积通过其使用而改变的组分。例如，使用全固体薄膜二次电池作为二次电池30.第二绝缘层22的材料是刚性低于第一绝缘层21和第三绝缘层21的刚性的树脂（低刚性树脂） 23。

2. 发明专利

JP2013058710A Wiring board and semiconductor package 有权
标题翻译：接线板和半导体封装
公开(公告)号：JP2013058710A
公开(公告)日：2013-03-28
申请号：JP2011197644
申请日：2011-09-09
申请人： Shinko Electric Ind Co Ltd , 新光電気工業株式会社
发明人： FUJII TOMOJI
IPC分类号： H05K1/02 , H01L23/12 , H05K3/46
CPC分类号： H01L23/50 , H01L23/49827 , H01L2224/13111 , H01L2224/13116 , H01L2224/16237 , H01L2924/15311 , H05K1/0222 , H05K1/0251 , H05K1/162 , H05K3/4605 , H05K2201/09336 , H01L2924/00014 , H01L2924/01047 , H01L2924/01029
摘要： PROBLEM TO BE SOLVED: To provide a wiring board using an inorganic material easy to reduce source impedance and ensure impedance matching, and provide a semiconductor package in which a semiconductor chip is mounted on the wiring board.SOLUTION: A present wiring board comprises: a substrate body composed of an inorganic material; a tabular first electrode penetrating the substrate body in a thickness direction; and a tabular second electrode penetrating the substrate body in the thickness direction. The first electrode and the second electrode are arranged to be opposed to each other and at a predetermined distance from each other. The wiring board further comprises a signal electrode penetrating the substrate body in the thickness direction and provided between the first electrode and the second electrode. Either one of the first electrode and the second electrode serves as a ground electrode and the other serves as a power electrode.
摘要翻译：要解决的问题：提供一种使用易于降低源阻抗并确保阻抗匹配的无机材料的布线板，并提供半导体封装，其中半导体芯片安装在布线板上。解决方案：本发明的布线板包括：由无机材料构成的基板主体; 在厚度方向上穿透基板主体的片状第一电极; 以及在厚度方向上穿透基板主体的平板状的第二电极。第一电极和第二电极被布置成彼此相对并且彼此以预定的距离。布线基板还包括信号电极，该信号电极在厚度方向上穿透基板主体并设置在第一电极和第二电极之间。第一电极和第二电极中的任一个用作接地电极，另一个用作功率电极。版权所有（C）2013，JPO＆INPIT

3. 发明专利

JP2009158744A Electronic apparatus and method of manufacturing the same, and wiring substrate and method of manufacturing the same 有权
标题翻译：电子装置及其制造方法以及配线基板及其制造方法
公开(公告)号：JP2009158744A
公开(公告)日：2009-07-16
申请号：JP2007335691
申请日：2007-12-27
申请人： Shinko Electric Ind Co Ltd , 新光電気工業株式会社
发明人： FUJII TOMOJI , TAKEUCHI YUKIHARU
IPC分类号： H05K3/46
CPC分类号： H05K1/0206 , H01L2223/6677 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/15321 , H01Q1/02 , H01Q9/16 , H05K1/056 , H05K1/16 , H05K3/06 , H05K3/4644 , H05K2201/096 , H05K2201/10098 , H05K2201/10674 , H05K2203/0323 , Y10T29/4913 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To improve heat dissipation efficiency while reducing manufacturing cost concerning an electronic apparatus having a passive component, and a method of manufacturing the electronic apparatus. SOLUTION: The electronic apparatus has: a multilayer wiring structure 13 having insulating layers 14, 24, 36 and wiring layers 16 to 18, 20 to 22, 27 to 29, 32 to 34, 39 to 41, 43 to 46 which are stacked and having a surface 13B on which an electronic component 12 is mounted; a diepole antenna 60 formed on a surface 13A of the multilayer wiring structure 13; a radiating plate 57 disposed on the surface 13 A together with the diepole antenna 60; and radiating paths (17, 21, 28, 33, 40, 45, 53) formed inside the multilayer wiring structure 13 for conducting heat generated in the electronic component 12 to the radiating plate 57. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提高散热效率，同时降低具有无源部件的电子设备的制造成本，以及制造电子设备的方法。解决方案：电子设备具有：多层布线结构13，其具有绝缘层14,24,36和布线层16至18,20至22,27至29,32至34,39至41,43至46，其中并且具有其上安装有电子部件12的表面13B; 形成在多层布线结构13的表面13A上的二极天线60; 与二极天线60一起设置在表面13A上的散热板57; 以及形成在多层布线结构13内部的辐射路径（17,21,28,33,40,45,53），用于将电子部件12中产生的热量传导到散热板57.版权所有（C）2009， JPO和INPIT

4. 发明专利

JP2009158743A Semiconductor device and method of manufacturing the same 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：JP2009158743A
公开(公告)日：2009-07-16
申请号：JP2007335690
申请日：2007-12-27
申请人： Shinko Electric Ind Co Ltd , 新光電気工業株式会社
发明人： FUJII TOMOJI
IPC分类号： H01L25/00 , G06K19/077 , H01L21/3205 , H01L21/822 , H01L23/12 , H01L23/52 , H01L27/04
CPC分类号： H01L21/76898 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/94 , H01L2224/02372 , H01L2224/0401 , H01L2224/05024 , H01L2224/05569 , H01L2224/05571 , H01L2224/94 , H01L2924/0002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/3011 , H01L2924/3025 , H01L2224/11 , H01L2924/00012 , H01L2224/05552
摘要： PROBLEM TO BE SOLVED: To reduce dielectric loss while achieving compaction of a semiconductor device having a passive element, and to provide a method of manufacturing the same.
SOLUTION: A semiconductor device includes a semiconductor chip 11, and through electrodes 15 and 16 made through the semiconductor chip 11, wherein a ground layer 28 connected with the through electrode 15 and a patch antenna 33 connected with the through electrode 16 are laminated on the second side 35B, i.e. the side opposite to the first side 35A (major surface), of the semiconductor chip 11 through an inorganic insulating layer 30 consisting of SiO
2 or SiN.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了降低介电损耗，同时实现具有无源元件的半导体器件的压实，并提供其制造方法。解决方案：半导体器件包括半导体芯片11和通过半导体芯片11制成的通过电极15和16，其中与通孔15连接的接地层28和与通孔16连接的贴片天线33是通过由SiO 2 或SiN组成的无机绝缘层30层叠在第二侧35B上，即半导体芯片11的与第一侧35A（主表面）相反的一侧。版权所有（C）2009，JPO＆INPIT

5. 发明专利

JP2009117767A Manufacturing method of semiconductor device, and semiconductor device manufacture by same 审中-公开
标题翻译：半导体器件的制造方法及其半导体器件制造
公开(公告)号：JP2009117767A
公开(公告)日：2009-05-28
申请号：JP2007292142
申请日：2007-11-09
申请人： Shinko Electric Ind Co Ltd , 新光電気工業株式会社
发明人： OI ATSUSHI , HARUHARA MASAHIRO , FUJII TOMOJI
IPC分类号： H01L23/12
CPC分类号： H01L23/3128 , H01L21/563 , H01L21/6835 , H01L23/4334 , H01L23/49816 , H01L23/552 , H01L23/562 , H01L24/16 , H01L24/81 , H01L25/0655 , H01L2221/68345 , H01L2224/16 , H01L2224/73204 , H01L2224/73253 , H01L2224/81001 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/15311 , H01L2924/18161 , H01L2924/19041 , H01L2924/19043 , H01L2924/3025 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device, that can provide the semiconductor device having a semiconductor chip and a wiring substrate connected with solder at a pitch of ≤100 μm.
SOLUTION: A required number of wiring layers 32 are formed on a temporary substrate 31 of which the thermal expansion coefficient differs from that of a semiconductor chip 38 by 2×10
-6 /°C or less and a part of the wiring layer of the uppermost layer is exposed to an opening part of an insulating layer 36 of the uppermost layer as a pad 34 and a wiring substrate is fabricated and a solder bonding member of the semiconductor chip 38 is brought into contact with the pad 34 of the wiring substrate and reflow is performed and the semiconductor chip 38 is attached to the wiring substrate 36. Thereafter, an outer peripheral part of the attached semiconductor chip 38 is sealed while exposing an upper surface of the semiconductor chip and removing the temporary substrate 31 and then a terminal for external connection is formed on the wiring substrate. A heat spreader 41 may be fitted to the exposed surface of the semiconductor chip 38.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供半导体器件的制造方法，其可以以≤100μm的间距提供具有半导体芯片和与焊料连接的布线基板的半导体器件。解决方案：在半导体芯片38的热膨胀系数与半导体芯片38的热膨胀系数不同的临时基板31上形成所需数量的布线层32，2×10 -6 -6 /℃/℃，最上层的布线层的一部分暴露于作为焊盘34的最上层的绝缘层36的开口部，并且制造布线基板，并且将半导体芯片38的焊接部件进入与布线基板的焊盘34接触并进行回流，并且将半导体芯片38安装到布线基板36上。然后，将半导体芯片38的外周部分暴露于半导体芯片的上表面并密封，移除临时基板31，然后在布线基板上形成用于外部连接的端子。散热器41可以装配到半导体芯片38的暴露表面。版权所有：（C）2009，JPO＆INPIT

6. 发明专利

JP2010123879A Coil structure and method for manufacturing the same 有权
标题翻译：线圈结构及其制造方法
公开(公告)号：JP2010123879A
公开(公告)日：2010-06-03
申请号：JP2008298391
申请日：2008-11-21
申请人： Shinko Electric Ind Co Ltd , 新光電気工業株式会社
发明人： FUJII TOMOJI , KOBAYASHI KAZUKI , OI ATSUSHI
IPC分类号： H01L23/12 , H01F17/04 , H01F41/04 , H05K1/16
摘要： PROBLEM TO BE SOLVED: To provide a coil structure incorporated in an electronic circuit board, that is, a coil structure whose loss reduction and miniaturization is possible, and a method for manufacturing the coil structure.
SOLUTION: Disclosed is a coil structure 10 in which a magnetic core 11 divided into columnar sections 11a extending to a direction vertical to a wiring layer is arranged at the center of a coil 12A (12B) formed in the wiring layer of an electronic circuit board. Each columnar part 11a is formed like a column whose cross section parallel with the wiring layer is polygonal, and arranged so that the cross section (cross section parallel with the wiring layer) of the magnetic core 11 can be filled with clearances at fixed intervals. The magnetic core 11 and the coil 12A (12B) are multi-layered as necessary. In this case, the laminated coil 12A and the coil 12B are connected through a via 13 so that directions of the currents coincide with each other.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种结合在电子电路板中的线圈结构，即其损耗减小和小型化的线圈结构，以及用于制造线圈结构的方法。解决方案：公开了一种线圈结构10，其中分割成垂直于布线层的方向延伸的柱状部分11a的磁芯11布置在形成在布线层的线圈12A（12B）的中心电子电路板。每个柱状部分11a形成为与布线层平行的横截面为多边形的列，并且布置成可以以固定间隔填充有磁芯11的横截面（与布线层平行的截面）。磁芯11和线圈12A（12B）根据需要是多层的。在这种情况下，层叠线圈12A和线圈12B通过通孔13连接，使得电流方向彼此一致。版权所有（C）2010，JPO＆INPIT

7. 发明专利

JP2009266979A Semiconductor device 审中-公开
标题翻译：半导体器件
公开(公告)号：JP2009266979A
公开(公告)日：2009-11-12
申请号：JP2008113333
申请日：2008-04-24
申请人： Shinko Electric Ind Co Ltd , 新光電気工業株式会社
发明人： FUJII TOMOJI
IPC分类号： H01L23/12 , H01L23/14 , H01Q13/08 , H01Q23/00
CPC分类号： H01L23/49833 , H01L21/56 , H01L23/147 , H01L23/3128 , H01L23/49816 , H01L23/66 , H01L24/48 , H01L25/162 , H01L2223/6677 , H01L2224/16225 , H01L2224/16235 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , H01L2924/15311 , H01L2924/1532 , H01L2924/19041 , H01L2924/19105 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： PROBLEM TO BE SOLVED: To solve the problem, wherein the conventional semiconductor device with an antenna mounted has a possibility of being short in the heat which dissipates from the mounted semiconductor element. SOLUTION: An antenna 24 formed on one surface side of a silicon substrate 18 and a semiconductor element 20 mounted to the other surface side of the silicon substrate 18 are electrically connected to each other via a through-via 26 penetrating the silicon substrate 18, while being formed on a separate body from the silicon substrate 18. A wiring substrate 10, to which one suface side a passive element is mounted and the silicon substrate 18 are electrically connected to each other via a copper core solder ball 34, which is provided between one surface side of the wiring substrate 10 and the other surface side of the silicon substrate 18. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：解决的问题为了解决这样的问题，其中安装有天线的常规半导体器件具有从安装的半导体元件散失的热量短的可能性。解决方案：形成在硅衬底18的一个表面侧的天线24和安装到硅衬底18的另一表面侧的半导体元件20通过穿透硅衬底的通孔26彼此电连接同时形成在与硅基板18分开的主体上。布线基板10，一个表面侧安装无源元件，硅基板18经由铜芯焊球34彼此电连接，设置在布线基板10的一个表面侧和硅基板18的另一表面侧之间。（C）2010，JPO＆INPIT

8. 发明专利

JP2009043777A Inductor element and manufacturing method thereof 有权
标题翻译：电感元件及其制造方法
公开(公告)号：JP2009043777A
公开(公告)日：2009-02-26
申请号：JP2007204325
申请日：2007-08-06
申请人： Shinko Electric Ind Co Ltd , 新光電気工業株式会社
发明人： FUJII TOMOJI , HARUHARA MASAHIRO , NAKAMURA MANABU
IPC分类号： H01L21/822 , H01F17/00 , H01F17/04 , H01F27/00 , H01F27/06 , H01F27/28 , H01L23/12 , H01L27/04
CPC分类号： H01F17/0006 , H01F27/323 , H01F41/041 , H01F41/122 , H01F2017/0046 , H01L23/49822 , H01L23/49838 , H01L23/645 , H01L28/10 , H01L2224/16225 , H01L2924/19105 , H01L2924/3011 , Y10T29/4902
摘要： PROBLEM TO BE SOLVED: To provide an inductor element formed on a semiconductor substrate, which is applicable in particular to a high-frequency module or a voltage conversion module used for a portable information communication device, wireless LAN (local area network), or the like, can be miniaturized and suppress an increase in resistance loss, and to provide a manufacturing method thereof. SOLUTION: The inductor element 20 formed on the semiconductor substrate 11 is provided with: an inductor body 61 penetrating through the semiconductor substrate 11, spirally formed and having conductivity; and an insulating film 12 provided between the side surface of the inductor body 61 and the semiconductor substrate 11. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供形成在半导体衬底上的电感器元件，其特别适用于用于便携式信息通信设备的高频模块或电压转换模块，无线LAN（局域网）等等，可以小型化并且抑制电阻损耗的增加，并提供其制造方法。解决方案：形成在半导体基板11上的电感器元件20设置有：穿过半导体基板11的电感体61，螺旋状地形成并具有导电性; 以及设置在电感器主体61的侧表面和半导体基板11之间的绝缘膜12.版权所有（C）2009，JPO＆INPIT

9. 发明专利

JP2008226894A Illuminance detector and sensor module 审中-公开
标题翻译：照明检测器和传感器模块
公开(公告)号：JP2008226894A
公开(公告)日：2008-09-25
申请号：JP2007058683
申请日：2007-03-08
申请人： Shinko Electric Ind Co Ltd , 新光電気工業株式会社
发明人： FUJII TOMOJI
IPC分类号： H01L25/04 , H01L25/18 , H01L31/02
CPC分类号： G01J1/4228 , G01J1/02 , G01J1/0204 , G01J1/46 , H01L2224/48091 , H01L2224/48227 , H01L2924/15311 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an illuminance detector, which is provided with a plurality of light-receiving elements, an amplification circuit element for amplifying detection signals of the light-receiving element, a change-over switch element to change over electrical connection between the light-receiving elements and the amplification circuit element, and a passive element connected electrically to the amplification circuit element, and to provide a sensor module, which can be made compact.
SOLUTION: The illuminance detector uses a silicon substrate for the main body 31 of a wiring substrate 11, and it is provided with a plurality of light-receiving elements 13 on the wiring substrate 11 that output detection signals in accordance with the illuminance of a light when receiving the light emitted from the outside, an amplification circuit element 14 to amplify the detection signals output from the light-receiving element 13, a change-over switch element 15 to change over electrical connection between the light-receiving elements 13 and the amplification circuit element 14, and a resistor 17 and a capacitor 18 that are electrically connected with the amplification circuit element 14.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供设置有多个光接收元件的照度检测器，用于放大光接收元件的检测信号的放大电路元件，用于切换的转换开关元件光接收元件和放大电路元件之间的电连接以及与放大电路元件电连接的无源元件，并且提供可以被制造成紧凑的传感器模块。解决方案：照度检测器使用用于布线基板11的主体31的硅基板，并且在布线基板11上设置有多个受光元件13，该多个受光元件13根据照度输出检测信号当从外部接收到光时，放大电路元件14放大从光接收元件13输出的检测信号，切换开关元件15以转换光接收元件13之间的电连接和放大电路元件14以及与放大电路元件14电连接的电阻器17和电容器18.版权所有（C）2008，JPO＆INPIT

10. 发明专利

JP2008034534A Stack package structure and unitized package used in manufacturing it, and manufacturing method for them 有权
标题翻译：堆栈包装结构和制造中使用的单位包装及其制造方法
公开(公告)号：JP2008034534A
公开(公告)日：2008-02-14
申请号：JP2006204949
申请日：2006-07-27
申请人： Shinko Electric Ind Co Ltd , 新光電気工業株式会社
发明人： OI ATSUSHI , FUJII TOMOJI
IPC分类号： H01L25/065 , H01L23/12 , H01L25/07 , H01L25/18
CPC分类号： H01L2224/48091 , H01L2224/48227 , H01L2224/92247 , H01L2924/15311 , H01L2924/15331 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a unitized package capable of achieving the thinning of a stacked package, and a stack package structure which can be obtained using such a unitized package.
SOLUTION: The unitized package comprises at least one semiconductor device 1 sealed with a sealant 3, bump electrodes 5 projected from one surface of the sealant 3, wires 6 connected to at least some of the bump electrodes 5, and partially through-electrodes 9 located in the through-holes passing through the sealant 3 from the other surface of the sealant to the bump electrodes 5, connected to the bump electrodes 5, and having their upper parts exposed within the through-holes.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供能够实现层叠包装的薄化的单元包装，以及可以使用这种组合包装获得的堆叠包装结构。解决方案：组合包装包括至少一个用密封剂3密封的半导体器件1，从密封剂3的一个表面突出的凸起电极5，连接到至少一些凸块电极5的电线6和部分通孔位于穿过密封剂3的通孔中的电极9从密封剂的另一表面到凸起电极5，凸起电极5连接到凸起电极5，并且其上部暴露在通孔内。版权所有（C）2008，JPO＆INPIT

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式