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    • 5. 发明专利
    • Semiconductor device and semiconductor device manufacturing method
    • 半导体器件和半导体器件制造方法
    • JP2013084941A
    • 2013-05-09
    • JP2012210014
    • 2012-09-24
    • Semiconductor Energy Lab Co Ltd株式会社半導体エネルギー研究所
    • WATANABE MASAHIROMASUYAMA MITSUOHANDA TAKUYAOKAZAKI KENICHI
    • H01L21/336H01L21/316H01L29/786
    • H01L23/564H01L29/78606H01L29/7869H01L2924/0002H01L2924/00
    • PROBLEM TO BE SOLVED: To provide a semiconductor device which suppresses electric characteristic deterioration caused by moisture, and provide a semiconductor device manufacturing method.SOLUTION: A semiconductor device comprises a structure in which a metal oxide layer is positioned in contact with an interlayer insulation layer covering a transistor. The meta oxide layer is composed of a lamination structure including a first metal oxide layer having an amorphous structure, a second metal oxide layer having a polycrystalline structure. The first metal oxide layer having the amorphous structure has no crystal grain boundary and wider grid spacing compared with a crystalline metal oxide layer and likely to trap moisture between grids. The second metal oxide layer having the polycrystalline structure has a dense structure in a crystal part except a crystal grain boundary part and exhibits extremely low moisture permeability. Because of this, moisture invasion to a transistor can be effectively prevented by the structure in which the metal oxide layer including the first metal oxide layer and the second metal oxide layer contacts the interlayer insulation layer.
    • 要解决的问题:提供抑制由水分导致的电特性劣化的半导体器件,并提供半导体器件制造方法。 解决方案:半导体器件包括其中金属氧化物层定位成与覆盖晶体管的层间绝缘层接触的结构。 超氧化物层由包括具有非晶结构的第一金属氧化物层,具有多晶结构的第二金属氧化物层的层叠结构构成。 与结晶金属氧化物层相比,具有非晶结构的第一金属氧化物层不具有晶界和更宽的栅格间隔,并且可能捕获栅格之间的水分。 具有多晶结构的第二金属氧化物层在除了晶界部分以外的晶体部分中具有致密结构,并且具有极低的透湿性。 因此,通过包含第一金属氧化物层和第二金属氧化物层的金属氧化物层与层间绝缘层接触的结构,可以有效地防止对晶体管的水分侵入。 版权所有(C)2013,JPO&INPIT
    • 7. 发明专利
    • Semiconductor device
    • 半导体器件
    • JP2013058738A
    • 2013-03-28
    • JP2012165293
    • 2012-07-26
    • Semiconductor Energy Lab Co Ltd株式会社半導体エネルギー研究所
    • OKAZAKI KENICHIWATANABE MASAHIROMASUYAMA MITSUO
    • H01L29/786
    • H01L29/7869
    • PROBLEM TO BE SOLVED: To provide an oxide semiconductor transistor including an oxide semiconductor layer having high conductivity.SOLUTION: A semiconductor device comprises: an oxide semiconductor layer having an oxide (IGZO) containing indium, gallium, and zinc, and having particles of an indium oxide; a channel formation region in the oxide semiconductor layer; a gate electrode overlapped via a gate insulation film; a source electrode and a drain electrode which are overlapped on a source region and a drain region in the oxide semiconductor layer. The semiconductor device may be a top gate oxide semiconductor transistor or a bottom gate oxide semiconductor transistor. In addition, the oxide semiconductor layer may be formed on the source electrode and the drain electrode, or may be formed under the source electrode and the drain electrode.
    • 解决的问题:提供一种包括具有高导电性的氧化物半导体层的氧化物半导体晶体管。 解决方案:半导体器件包括:具有含有铟,镓和锌的氧化物(IGZO)并具有氧化铟颗粒的氧化物半导体层; 氧化物半导体层中的沟道形成区; 栅极通过栅极绝缘膜重叠; 源电极和漏电极,其重叠在氧化物半导体层中的源极区域和漏极区域上。 半导体器件可以是顶栅氧化物半导体晶体管或底栅氧化物半导体晶体管。 此外,氧化物半导体层可以形成在源电极和漏电极上,或者可以形成在源电极和漏电极之下。 版权所有(C)2013,JPO&INPIT