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    • 3. 发明专利
    • Vibration control pedestal and its installation method
    • 振动控制及其安装方法
    • JP2008175393A
    • 2008-07-31
    • JP2008010912
    • 2008-01-21
    • Samsung Electronics Co Ltd三星電子株式会社Samsung Electronics Co.,Ltd.
    • KIM SEOK-YOUNHWANG JUNG-SUNGLEE HO-YOUNGKWUN DO-HYUNHEO JUNG-SHIK
    • F16F15/02H01L21/02
    • F16F15/02H01L21/6719
    • PROBLEM TO BE SOLVED: To provide a vibration control pedestal for a semiconductor device and its installation method, which facilitates installation while reducing vibration and particles and allowing assembly and disassembly.
      SOLUTION: The vibration control pedestal includes a device support body comprising at least two device support cells. A cell connecting unit penetrates the side faces of the device support cells so that the device support cells are connected to each other. A bottom part structure is provided in the lower part of the device support body to support the device support body. The installation method of the vibration control pedestal includes reducing particles carried out by vibration and air while moving the semiconductor device from one vibration control pedestal to the other vibration control pedestal.
      COPYRIGHT: (C)2008,JPO&INPIT
    • 要解决的问题:提供一种用于半导体器件的振动控制基座及其安装方法,其有利于安装,同时减少振动和颗粒并允许组装和拆卸。 解决方案:振动控制基座包括装置支撑体,其包括至少两个装置支撑单元。 单元连接单元穿透设备支撑单元的侧面,使得设备支撑单元彼此连接。 底部结构设置在装置支撑体的下部以支撑装置支撑体。 振动控制基座的安装方法包括在将半导体器件从一个振动控制基座移动到另一个振动控制基座的同时,通过振动和空气进行的还原颗粒。 版权所有(C)2008,JPO&INPIT
    • 5. 发明专利
    • Wafer transport system and in-system pressure adjustment method
    • WAFER运输系统和系统内压力调整方法
    • JP2006019726A
    • 2006-01-19
    • JP2005182539
    • 2005-06-22
    • Samsung Electronics Co Ltd三星電子株式会社Samsung Electronics Co.,Ltd.
    • LEE SOO-WOONGCHOI HYUNG-SEOKHWANG JUNG-SUNGCHOI SUNG-HWAN
    • H01L21/677B65G49/00F24F7/06
    • PROBLEM TO BE SOLVED: To provide a wafer transport system that can decrease electric power consumption and eliminate nano-sized particles, and a method for adjusting pressure in the system. SOLUTION: A wafer transport system 40 includes a load port 100 for housing a wafer container 20, a housing 200 connected with the load port 100, a wafer transport 280 for transporting a wafer between the wafer container 20 and the housing 200, a wafer container sensor 330 for sense the presence of the wafer container 20 on the load port 100, a variable-speed fan 322 located in the first part of the housing 200, a variable exhaust unit 340 located in the second part facing the first part in the housing 200 which can change the evacuation rate of air evacuated from the housing 200, and a controller 360 that can operate the variable-speed fan 322 and the variable exhaust unit 340 in a variety manner, based on signals received from the wafer container sensor 330. COPYRIGHT: (C)2006,JPO&NCIPI
    • 要解决的问题:提供可以降低电力消耗并消除纳米尺寸颗粒的晶片传送系统,以及用于调节系统中的压力的​​方法。 解决方案:晶片传送系统40包括用于容纳晶片容器20的负载端口100,与负载端口100连接的壳体200,用于在晶片容器20和壳体200之间输送晶片的晶片传送器280, 用于感测负载端口100上的晶片容器20的存在的晶片容器传感器330,位于壳体200的第一部分中的变速风扇322,位于与第一部分相对的第二部分中的可变排气单元340 在能够改变从壳体200排出的空气的排出速度的壳体200中,以及能够以各种方式操作变速风扇322和可变排气单元340的控制器360,其基于从晶片容器 传感器330.版权所有(C)2006,JPO&NCIPI