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    • 3. 发明专利
    • MOLDING DIE
    • JPH0760806A
    • 1995-03-07
    • JP21451593
    • 1993-08-30
    • SONY CORP
    • TOMIYAMA HIROSHI
    • B29C45/02B29C45/26B29C45/40B29C45/80B29L31/34
    • PURPOSE:To prevent defective molding from developing by a method wherein whether an ejector device has come back from its mold release position to its normal retreated position or not is detected. CONSTITUTION:In the molding die 1A concerned, a position detecting device 20, which is installed near an ejector device 5, consists of a metal plate 22, which has the predetermined thickness and is fixed by a plurality of screws 21 at one end of the ejector device 5 so as to be flush with the counter surface 6A of an ejector plate 6, a magnetic sensor 23, which is arranged beneath the metal plate 22 under the condition that the predetermined minute gap Ga between the metal plate and the magnetic sensor, and a display device 24 having an upper displaying part 24A and a lower displaying part 24B. The displaying part 24A numerically displays the position of the ejector device 5 in its normal retreat position, while the displaying part 24B numerically displays the actual returned position of the ejector device 5 by the magnetic sensor 23. Thus, when an ejector pin goes out of the standard set point, the position detecting device 20 issues stop signal.