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    • 1. 发明专利
    • Write-once type optical recording medium and its manufacturing method
    • 写入式光学记录介质及其制造方法
    • JP2007141420A
    • 2007-06-07
    • JP2005337816
    • 2005-11-22
    • Sony Corpソニー株式会社
    • SATOBI YUUICHIIKEDA ETSUROTAKASE FUMINORI
    • G11B7/24G11B7/0045G11B7/243G11B7/26
    • PROBLEM TO BE SOLVED: To reduce the total number of films of an inorganic recording film and to enhance recording sensitivity in a write-once type recording medium having the inorganic recording film. SOLUTION: The write-once type optical recording medium 10 has the inorganic recording film 6 and the inorganic recording film 6 is provided with an oxide film 3 made of an oxide of germanium and a metallic film 2 adjacent to the oxide film. The metallic film 2 is provided with a first metallic film 2a comprising titanium and silicon and a second metallic film 2b comprising titanium and silicon and having a composition different from that of the first metallic film 2a and the second metallic film 2b of the metallic films is provided so as to be positioned on the oxide film 3 side. When the compositions of the first and the second metallic films 2a and 2b are defined as TiSi x and TiSi y , respectively, TiSi x and TiSi y satisfy a relation of x COPYRIGHT: (C)2007,JPO&INPIT
    • 要解决的问题:为了减少无机记录膜的膜的总数,并提高具有无机记录膜的一次写入型记录介质中的记录灵敏度。 解决方案:一次写入型光学记录介质10具有无机记录膜6,无机记录膜6设置有由氧化物形成的氧化膜3和与氧化物膜相邻的金属膜2。 金属膜2设置有包括钛和硅的第一金属膜2a和包含钛和硅的第二金属膜2b,其组成不同于金属膜的第一金属膜2a和第二金属膜2b的组成不同 被设置成位于氧化膜3侧。 当第一和第二金属膜2a和2b的组成分别被定义为TiSi x 和TiSi y 时,TiSi x 和TiSi y 满足x
    • 2. 发明专利
    • PRODUCTION OF OPTICAL DISK
    • JPH1186356A
    • 1999-03-30
    • JP23842797
    • 1997-09-03
    • SONY CORP
    • TAKASE FUMINORINAKANO ATSUSHI
    • G11B7/26
    • PROBLEM TO BE SOLVED: To easily remove the build-up part formed at the outer peripheral edge of a substrate having the outside diameter larger than the outside diameter of an optical disk of a final product by applying a UV curing resin by spin coating on this substrate, curing this UV curing resin by irradiation with UV rays to form a light transparent layer on the substrate and removing the built-up part by a cutting treatment. SOLUTION: The UV curing resin 24 is applied on the signal surface of the substrate 20 by the spin coating method and is cured by irradiation with the UV rays. The built-up part 34A is formed at the outer periphery edge of the formed disk 30. Next, a tool 54 is pressed to the outer periphery of the disk 30 while the disk 30 is rotated, by which the cutting is executed and the built-up part 34A is removed. The outer periphery of the disk 30 subjected to the cutting is free of the built-up part 34A. More preferably, a chamfered part 24B is formed at the outer periphery edge of the disk 30 subjected to the cutting.