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1. 发明专利

JP2000294909A ELECTRONIC COMPONENT AND MOUNTING METHOD OF THE SAME 失效
公开(公告)号：JP2000294909A
公开(公告)日：2000-10-20
申请号：JP9684099
申请日：1999-04-02
申请人： SONY CORP
发明人： MURA MITSURU
IPC分类号： H05K3/28
摘要： PROBLEM TO BE SOLVED: To fix electronic components mounted on a printed wiring board part. SOLUTION: In this mounting method, flexible films 7, 8 and 17 are bonded to the face parts of electronic components 3,..., and 6 installed in a printed wiring board part 1, in a state where they protrude from the face parts. Parts protruding outside the film member are bonded to the printed wiring board part 1, in a state where the electronic components are loaded on the printed wiring board part 1, and the electronic components are fixed to the printed wiring board 1.

2. 发明专利

JP2000164774A SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF 失效
公开(公告)号：JP2000164774A
公开(公告)日：2000-06-16
申请号：JP33598098
申请日：1998-11-26
申请人： SONY CORP
发明人： SASAKI MASARU , MURA MITSURU , KATO MASUO , TSURUMI MASAMI , SAKURAI TSUTOMU
IPC分类号： H01L23/12 , H01L23/36
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device which is capable of sufficiently dissipating heat released from a semiconductor device which is set in operation, and a manufacturing method thereof. SOLUTION: A prescribed wiring pattern 5 is formed on a circuit board 6, and a heat dissipating pattern 9 is formed near the wiring pattern 5. It is preferable from the view point of a heat dissipation effect that the heat dissipating pattern 9 be formed in a solid pattern. A through-hole 10 is bored in the heat dissipating pattern 9. A semiconductor element 1 is mounted on the wiring pattern 5 through the intermediary of protrudent electrodes 3. A thermosetting resin 7 is fed to a region which includes joints between the protrudent electrodes 3 and the wiring pattern 5. A heat-dissipating layer 2 is formed on the top surface of the semiconductor element 2 opposite to the circuit surface.

3. 发明专利

JPH11204575A CIRCUIT BOARD, MOUNTING DEVICE, AND MOUNTING METHOD 失效
公开(公告)号：JPH11204575A
公开(公告)日：1999-07-30
申请号：JP677898
申请日：1998-01-16
申请人： SONY CORP
发明人： MURA MITSURU
IPC分类号： B23P21/00 , H01L21/60 , H01L23/12 , H05K1/18 , H05K3/32 , H05K13/04
摘要： PROBLEM TO BE SOLVED: To improve the reliability of the mounting of an electronic component by installing a high airtight hold-down means, which has a plurality of electrodes on an opposed surface with a wiring board and is arranged on a single surface of the wiring board so as to cover the electronic component positioned and mounted on one surface of the wiring board and the inside of which is decompressed. SOLUTION: A semiconductor element 4 is positioned and mounted on that bumps 6 on each pad are placed on the corresponding lands 2A of a wiring board 3 respectively. A hold-down cap 5 is constituted with high airtightness, by integrally molding an inverted triangular sectional peripheral sidewall 5B to the underside peripheral end section of a top-face wall 5A, and the inside is decompressed in an approximately vacuum state. Accordingly, the semiconductor element 4 is fixed, so as to be pushed against the wiring board 3 by the internal side face of the top face wall 5A of the hold-down cap 5 by contraction stresses generated by negative pressure in the hold-down cap 5, and no stress in the lateral direction will be applied, because sliding is conducted even if relative places among the bumps 6 and the corresponding lands 2A are displaced.

4. 发明专利

JPH11190995A VOICE INFORMATION STORAGE DEVICE, RECORDING DEVICE, AND REPRODUCING DEVICE 失效
公开(公告)号：JPH11190995A
公开(公告)日：1999-07-13
申请号：JP12153598
申请日：1998-04-30
申请人： SONY CORP
发明人： HONDA NORIYUKI , TANIGUCHI YOSHIKUNI , MURA MITSURU , YOSHINO KATSUTAKA , NISHITANI YUJI
IPC分类号： G10L19/00 , G10K15/04 , G10L9/18
摘要： PROBLEM TO BE SOLVED: To obtain a voice information storage device which can give a presence sufficiently and actually independently of magnitude of an object by constituting the device of a memory chip and a terminal for external connection, and using it so as to stick it onto a desired object, or stick the desired object onto it. SOLUTION: The voice information storage device is constituted of a memory chip and a terminal for external connection, and used sticking onto a desired object, or sticking the desired object. That is, in the voice information storage device 2, a memory IC chi 12 is mounted on a plane 10A of a flexible wiring board 10 on which a prescribed semiconductor pattern 11 is formed, is stuck onto a back surface of a photo-print 16 and used. In this flexible wiring board 10, its magnitude is selected to the same magnitude as that of the rear surface 16A of the photo-print 16 being an object of sticking. While adhesive is applied on the other surfaced 10B side.

5. 发明专利

JPH06216508A PRINTED BOARD 失效
公开(公告)号：JPH06216508A
公开(公告)日：1994-08-05
申请号：JP2380493
申请日：1993-01-19
申请人： SONY CORP
发明人： MURA MITSURU
IPC分类号： H05K3/34 , H05K3/30 , H05K3/32
摘要： PURPOSE:To provide a printed board which prevents conductive material from protruding when a chip component is mounted. CONSTITUTION:A plurality of electrode pads 3 whereupon a chip component 10 is to be connected through conductive material 4 are provided on a substrate 2, an opening is provided at least on the connecting part on the front plane of the electrode pad 3 with the chip component 10 and a substrate 2 is coated with a nonconductive protecting film 5. A printed board 1 permits the chip component 10 to be connected over the two electrode pads 3 and the protecting film 5 between the two electrode pads 3 is permitted to be higher than at least two electrode pads 3. The bank of the conductive material 4 which is not covered with the protecting film 5 is provided outside of the chip component 10 in the vicinity of the opening on the circumference of the two electrode pads 3.

6. 发明专利

JP2006157897A Imaging system, mainly imaging device and mainly imaging method 有权
标题翻译：成像系统，主要成像设备和主要成像方法
公开(公告)号：JP2006157897A
公开(公告)日：2006-06-15
申请号：JP2005318191
申请日：2005-11-01
申请人： Sony Corp , ソニー株式会社
发明人： KANAI FUJIO , MURA MITSURU , UEDA TOSHIAKI
IPC分类号： H04N5/232 , H04N5/225 , H04N5/91 , H04N101/00
摘要： PROBLEM TO BE SOLVED: To provide an imaging system, a mainly imaging device and a mainly imaging method, wherein in an imaging device which takes an object subordinately also, taken image data produced by taking the object from a plurality of imaging directions can be stored. SOLUTION: The mainly imaging device takes the object depending on a taking instruction and records mainly taken image data, and also, transmits a taking instruction signal to a plurality of imaging devices to take the object for recording subordinately taken image data. The mainly imaging device transmits a taking image request signal to the plurality of imaging devices to obtain the subordinately taken image data, and transmits and records the subordinately taken image data produced by the other imaging devices except for the subordinately taken image data produced by a transmitting destination with resepct to the plurality of imaging devices as mainly taken image data and a sharing taken image data group. Thus, the mainly imaging device and the plurality of imaging devices can easily obtain the mainly taken image data and the subordinately taken image data, and the imaging device can also store the taken image data produced by taking the object from the plurality of imaging directions. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种成像系统，主要是成像装置和主要的成像方法，其中在从根本上取下物体的成像装置中，摄取通过从多个成像方向拍摄物体而产生的图像数据可以存储。解决方案：主要成像装置根据拍摄指令拍摄对象，并记录主要拍摄的图像数据，并且还将拍摄指示信号发送到多个成像装置，以拍摄被摄体记录从属拍摄的图像数据。主要成像装置向多个成像装置发送拍摄图像请求信号以获得次要拍摄的图像数据，并且发送和记录由其他成像装置产生的从属拍摄图像数据，除了由传送产生的从属拍摄图像数据目的地与多个成像装置重新配置为主要拍摄的图像数据和共享拍摄图像数据组。因此，主要成像装置和多个成像装置可以容易地获得主要拍摄的图像数据和从属拍摄图像数据，并且成像装置还可以存储通过从多个成像方向拍摄对象而产生的拍摄图像数据。版权所有（C）2006，JPO＆NCIPI

7. 发明专利

JP2003204140A MANUFACTURING METHOD FOR WIRING BOARD AND MULTILAYERED WIRING BOARD, AND MULTILAYFRED WIRING BOARD 审中-公开
公开(公告)号：JP2003204140A
公开(公告)日：2003-07-18
申请号：JP2002003794
申请日：2002-01-10
申请人： SONY CORP
发明人： MURA MITSURU , OGAWA MINORU , ITO SHIGEYASU , IZUMI MASAHIRO
IPC分类号： H05K3/40 , H05K1/18 , H05K3/10 , H05K3/20 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method for a wiring board and a multilayered wiring board using thermoplastic resin, and to provide the multilayered wiring board manufactured by the manufacturing method. SOLUTION: The manufacturing method for the wiring board that forms a wiring patterns on a board 21 containing the thermoplastic resin comprises a groove formation process forming a groove 24 corresponding to the wiring pattern on the board 21, and a filling process filling a conductive paste in the groove 24. COPYRIGHT: (C)2003,JPO

8. 发明专利

JP2001060747A METHOD FOR PRODUCTION OF PRINTED WIRING BOARD AND INTERLAYER SHEET 失效
公开(公告)号：JP2001060747A
公开(公告)日：2001-03-06
申请号：JP23575399
申请日：1999-08-23
申请人： SONY CORP
发明人： MURA MITSURU , SHINOHARA KAZUO
IPC分类号： H05K1/03 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To make the thickness of an insulation layer invariant by providing an interlayer sheet for integrating an insulating rigid filler having the same height as an insulation layer and a conductive layer being formed on the oppo site sides of the interlayer sheet in the insulation layer thereby making uniform the thickness of the insulation layer. SOLUTION: An interlayer sheet 40 comprises an insulating rigid filler, i.e., insulating rigid balls 2, integrated in an insulation layer 1 at a predetermined interval wherein the outside diameter of the insulating rigid ball 2 is equal to the thickness of the insulation layer 1. The insulating rigid ball 2 is made by sintering powder of a material having a glass transition point higher than that of the insulation layer 1, e.g. silica or alumina. Alternatively, the insulating rigid ball 2 is made by coating the surface of an aluminum ball with an insulator layer of ceramic.

9. 发明专利

JP2000183237A SEMICONDUCTOR DEVICE, PRINTED WIRING BOARD, AND MANUFACTURE THEREOF 失效
公开(公告)号：JP2000183237A
公开(公告)日：2000-06-30
申请号：JP35160198
申请日：1998-12-10
申请人： SONY CORP
发明人： MURA MITSURU , KATO MASUO , SASAKI MASARU , TSURUMI MASAMI , SAKURAI TSUTOMU
IPC分类号： H01L23/28
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device of higher-density mounting by preventing an adhesive resin from spreading from around a semiconductor chip. SOLUTION: A prescribed wiring pattern 3 is formed on a printed wiring board 5. A groove part 6 for adhesive resin flow is formed near the mounting region of a semiconductor chip 1 in the wiring pattern 3. The groove part 6 comprises an extension part 8 which radially extends from the mounting region of the semiconductor chip, and a through-hole 7 which penetrates the printed wiring board 5 is formed at the bottom part of groove of the extension part 8. The semiconductor chip 1 is mounted on the wiring pattern 3 through a bump 2 of a protruding electrode. An insulating adhesive resin 4 is supplied to a region comprising a connection part between the bump 2 and the wiring pattern 3. The insulating adhesive resin 4 flows into the groove part 6 and the through-hole 7.

10. 发明专利

JPH07302860A MOUNTING STRUCTURE AND MOUNTING METHOD FOR SEMICONDUCTOR PACKAGE 失效
公开(公告)号：JPH07302860A
公开(公告)日：1995-11-14
申请号：JP11436194
申请日：1994-04-28
申请人： SONY CORP
发明人： MURA MITSURU
IPC分类号： H05K1/18 , H01L23/12 , H05K3/30 , H05K3/34
摘要： PURPOSE:To joint a solder bump and an electrode pad easily and besides securely. CONSTITUTION:At least two pieces among at least three pieces of pins 14 attached to the base 11 of a semiconductor package 1 are provided with position regulators for aligning electrode pads 21 and solder bumps 13, and at least three pieces are provided with height regulators for regulating the interval between the semiconductor package 1 and a board 2, and the board 2 is provided with a hole for inserting the position regulator. To perform mounting, the interval between the semiconductor package 1 and the board 2 is kept at a specified quantity with the regulator by fusing the solder bump 13 after inserting the position regulator into the hole 22, and aligning the solder bump 13 and the electrode pad 21.

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