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1. 发明专利

JP2728361B2 失效
公开(公告)号：JP2728361B2
公开(公告)日：1998-03-18
申请号：JP1505294
申请日：1994-02-09
申请人： SHOWA DENKO KK
发明人： WATANABE KAZUYUKI , TAKESHIMA KENJI , SAKAGUCHI FUMIO
IPC分类号： B65B55/16 , A23L3/26 , A61L2/08 , C08K3/22 , C08L101/00

2. 发明专利

JPH0142285B2 失效
公开(公告)号：JPH0142285B2
公开(公告)日：1989-09-12
申请号：JP13085581
申请日：1981-08-22
申请人： SHOWA DENKO KK
发明人： HIROTA KIWAMU , TAMANO HIDEKI , SAKAGUCHI FUMIO
IPC分类号： C08F8/00 , C08F2/00 , C08F8/50 , C08F210/00 , C08F210/06

3. 发明专利

JPS595031A T-die cast film 失效
标题翻译： T-DIE电影胶片
公开(公告)号：JPS595031A
公开(公告)日：1984-01-11
申请号：JP11405782
申请日：1982-07-02
申请人： Showa Denko Kk
发明人： HIROTA KIWAMU , SAKAGUCHI FUMIO , TAMANO HIDEKI
IPC分类号： B29C47/00 , B29B7/00 , B29C39/00 , B29C39/24 , B29K23/00 , B29L7/00 , C08F8/50 , C08F210/06 , C08F210/16
CPC分类号： C08F210/06 , B29C47/0004 , B29C47/0021 , B29C47/14 , B29C47/802 , B29C47/92 , B29C2947/92514 , B29C2947/92704 , C08F210/16 , C08F2810/10 , C08F8/50 , C08F210/08 , C08F2500/12 , C08F2500/26
摘要： PURPOSE:To improve a low temperature strength, transparency, etc., by molding a film with the polypropylene resin having the characteristics of an ethylene content 6-15mol%, a block index 1.1 and below, MFI 0.5-50g/min, etc. CONSTITUTION:The polypropylene resin composed of the propylene-ethylene random copolymer which has the characteristics of the ethylene content determined by a C -NMR method 6-15mol%, the block index calculated from the C -NMR method 1.1 and below, MFI 0.5-50g/min, MLMFI/MFI 10-16 is manufactured. The film of a thickness 60mum is molded by passing said polypropylene resin through the T-die of a slit clearance 0.7mm. from a 40mm. (screw diameter) extruder and melt extruding it on a 25 deg.C cooling roll at 250 deg.C. The film has excellent low temperature heat-sealing properties, a low temperature impact resistance and a transparency.
摘要翻译：目的：通过用具有乙烯含量6-15mol％，阻挡指数1.1及以下，MFI为0.5-50g / min的特性的聚丙烯树脂成型薄膜来提高低温强度，透明度等。构成：由丙烯 - 乙烯无规共聚物构成的聚丙烯树脂，其具有由C 13 NMR法测定的乙烯含量6-15mol％，由C 13 -NMR法1.1计算的嵌段指数以下，制造MFI为0.5-50g / min，MLMFI / MFI 10-16。厚度为60μm的薄膜通过所述聚丙烯树脂通过间隙为0.7mm的T形模而成型。从40mm。（螺杆直径）挤出机并在250℃的25℃冷却辊上熔融挤出。该膜具有优异的低温热封性，耐低温冲击性和透明性。

4. 发明专利

JPS5840336A TRANSPARENT AND IMPACT-RESISTANT PROPYLENE RESIN COMPOSITION 失效
公开(公告)号：JPS5840336A
公开(公告)日：1983-03-09
申请号：JP13831781
申请日：1981-09-04
申请人： SHOWA DENKO KK
发明人： HIROTA KIWAMU , TAMANO HIDEKI , SAKAGUCHI FUMIO
IPC分类号： C08L23/16 , C08L7/00 , C08L21/00 , C08L23/00 , C08L101/00
摘要： PURPOSE:To provide the titled resin compsn., by blending a propylene/ethylene random copolymer having specified physical properties with a propylene (co) polymer which may contain a small amount of an ethylene component. CONSTITUTION:20-90wt% propylene/ethylene (or other alpha-olefin) random copolymer (A) having a m.p. of 120-135 deg.C, an MFI (230 deg.C, 2,160g) of 0.3-60g/ 10min and a ratio of MLMFI (230 deg.C, 10kg)/MFI (230 deg.C, 2,160g) of 8-10, is blended with 80-10wt% propylene homopolymer (B) having an MFI of 0.5-60g/10min or ethylene/propylene random copolymer (B) having an ethylene content of 3% or lower to form a propylene resin compsn. having an MFI of 0.5-60g/10min. The copolymer A is formed by degrading in the presence of a free radical-generating agent a random copolymer obtd. by using a Ziegler catalyst.

5. 发明专利

JPH01272434A MANUFACTURE OF T-DIE CAST FILM 失效
公开(公告)号：JPH01272434A
公开(公告)日：1989-10-31
申请号：JP24453888
申请日：1988-09-30
申请人： SHOWA DENKO KK
发明人： HIROTA KIWAMU , SAKAGUCHI FUMIO , TAMANO HIDEKI
IPC分类号： B29C47/00 , B29K19/00 , B29K23/00 , B29L7/00
摘要： PURPOSE:To enhance not only the strength and transparency of a film at low temp. but also low temp. heat sealability, by reducing the MW of a propylene/ ethylene random copolymer whose melt flow index (MFI) is specified to prepare a resin having predetermined characteristics and processing said resin. CONSTITUTION:The MW of a propylene/ethylene random copolymer whose MFI (230 deg.C, load 2.16kg) of 0.01-0.3g/10min is reduced to prepare a resin. In this case, it is necessary to set the characteristics of the resin so that ethylene content calculated by a C -NMR method is 8.4-15mol%, a block index calculated by the C -NMR method is 1.1 or less, MFI (230 deg.C, load 2.16kg) is 0.5-50g/10min and the ratio of MLMFI (230 deg.C, load 10.0kg) and MFI (230 deg.C, load 2.16kg) is 10-16. This resin is extruded on a cooling roll through a T-die in a molten state. By this method, low temp. heat sealability, low temp. impact resistance and transparency can be enhanced.

6. 发明专利

JPH0134522B2 失效
公开(公告)号：JPH0134522B2
公开(公告)日：1989-07-19
申请号：JP8908480
申请日：1980-07-02
申请人： SHOWA DENKO KK
发明人： SAKAGUCHI FUMIO
IPC分类号： C08F8/00 , B32B27/16 , B32B27/32 , C08F8/50

7. 发明专利

JPS6363724A THERMOPLASTIC RESIN MOLDING FOR RADIATION STERILIZATION 失效
公开(公告)号：JPS6363724A
公开(公告)日：1988-03-22
申请号：JP20772986
申请日：1986-09-05
申请人： SHOWA DENKO KK
发明人： WATANABE KAZUYUKI , TAKESHIMA KENJI , SAKAGUCHI FUMIO
IPC分类号： C08J5/00 , B65D65/40 , C08K3/24 , C08K3/26 , C08K3/28 , C08K3/32 , C08K3/34 , C08L23/00 , C08L101/00
摘要： PURPOSE:To surely prevent the obtained molding from emitting a foreign ordor when irradiated, by adding a specified amount of at least one inorganic compound selected from among silicates, oxides and carbonates of metals, etc. to a thermoplastic resin. CONSTITUTION:This thermoplastic resin molding for radiation sterilization can be obtained by molding a resin composition prepared by adding 0.001-1wt% at least one inorganic compound selected from among silicates, mixture thereof, oxides, phosphates and carbonates of metals to a thermoplastic resin. Examples of the thermoplastic resins include olefin resins, polyvinyl chloride and polyvinylidene chloride. As said metal, a Group I-V metal of the periodic table is desirable.

8. 发明专利

JPS62271721A MANUFACTURE OF LAMINATED 失效
公开(公告)号：JPS62271721A
公开(公告)日：1987-11-26
申请号：JP11470286
申请日：1986-05-21
申请人： SHOWA DENKO KK
发明人： GOTO SUMIO , WATANABE KAZUYUKI , SAKAGUCHI FUMIO
IPC分类号： B29C47/04 , B29K23/00 , B29K29/00 , B32B27/28
摘要： PURPOSE:To obtain a laminated whose each resin can be stripped and trimmed product possesses expected characteristics such as adhesion, by a method wherein three kinds of coextruded resin are molded on both trimmed edges, to which trimming is applied and the remainder to which the trimming has been applied is made into a product. CONSTITUTION:A laminated having a resin (resin C) layer composed of polyolefin or its copolymer obtained by grafting acrylic acid or dibasic unsaturated carboxylic acid between resin (resin A) layer composed of ethylene-vinyl acetate copolymer and resin (resin B) layer composed of the polyolefin is manufactured. In this instance, the resin A, B layers between which the resin C layer has been interposed is extruded at the temperature of less than the die temperature of 220 deg.C. The resin A layer (or the resin B layer) and resin C layer are extruded at a time and at the temperature of less than the die temperature of 220 deg.C and the molten resin B layer (or the molten resin A layer) is piled up on the surface of the resin C layer at the temperature of less than 220 deg.C and linear pressure of less than 1kg/m. After removal of an edge part by cutting off the obtained laminate in desired width, the linear pressure of 2kg/m or more is applied to the laminated thing in the desired length under the temperature of 240 deg.C or more.

9. 发明专利

JPS6140535B2 失效
公开(公告)号：JPS6140535B2
公开(公告)日：1986-09-10
申请号：JP11405782
申请日：1982-07-02
申请人： SHOWA DENKO KK
发明人： HIROTA KIWAMU , SAKAGUCHI FUMIO , TAMANO HIDEKI
IPC分类号： B29C47/00 , B29B7/00 , B29C39/00 , B29C39/24 , B29K23/00 , B29L7/00 , C08F8/50 , C08F210/06 , C08F210/16

10. 发明专利

JPS5714605A EASILY HEAT-SEALABLE RESIN COMPOSITION AND POLYPROPYLENE COMPOSITE FILM OF HIGH TRANPARENCY 失效
公开(公告)号：JPS5714605A
公开(公告)日：1982-01-25
申请号：JP8908480
申请日：1980-07-02
申请人： SHOWA DENKO KK
发明人： SAKAGUCHI FUMIO
IPC分类号： C08F8/00 , B32B27/16 , B32B27/32 , C08F8/50
摘要： PURPOSE:The titled film that is composed of an easily heat-sealable composition layer resulting from depolymerization of a proplyene polymer and a butene-1 polymer in the presence of a radical initiator and of a crylstalline polypropylene layer, thus being suitably used for wrapping food products because of its high transparency. CONSTITUTION:(A) A polymer of propylene and/or a copolymer of propylene and an alpha-olefin such as ethylene and (B) a polymer of butene-1 and/or copolymer of butene-1 and an alpha-olefin such as ethylene are depolymerized together in the presence of a radical initiator to give an easily heat-sealable resin composition. Then, the resultant resin composition is laminated on at least one side of a crystalline polypropylene sheet to produce the objective composite film. Preferably, the amount of component A is 40-95pts.wt. and component B, 5-60pts.

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