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1. 发明专利

JPH02220857A THERMAL HEAD 失效
公开(公告)号：JPH02220857A
公开(公告)日：1990-09-04
申请号：JP4393589
申请日：1989-02-23
申请人： KOBE STEEL LTD , SHINKO ELECTRIC CO LTD
发明人： NAKAGAMI AKIMITSU , TACHIBANA HIROYUKI , KAJIKAWA HIROSHI , SUGIYAMA HAYAMI , KUBOTA TAKASHI , OGURA KENJI
IPC分类号： B41J2/345
摘要： PURPOSE:To improve printing quality by forming the thickness of a heat generating resistor disposed between one electrode and the other electrode in a recess state to a current passing direction. CONSTITUTION:In a resistor heat generator 3a disposed between one electrode 4a and the other electrode 4b, the thicknesses (t1+t2) of parts disposed in the vicinity of the electrodes 4a, 4b are thicker than the thickness t1 of a lower layer heat generating resistor 3b disposed therebetween, i.e., the thickness of the generator 3a is formed in a recess shape to a current passing direction. Thus, the electric resistance values of the parts disposed in the vicinity of the electrodes 4a, 4b are smaller than that of the part of the resistor 3b. Thus, heat generated from the parts disposed in the vicinity of the electrodes 4a, 4b is reduced as compared with the heat generated from the part of the resistor 3b. Accordingly, since the heats removed from the electrodes 4a, 4b can be reduced, an ink 18 on an ink film 16 is sufficiently melted to prevent insufficient density, blur of character, number, etc., from occurring to be transferred on an image receiving sheet 19, thereby improving printing quality.

2. 发明专利

JPH0393554A THERMAL HEAD AND ITS MANUFACTURE 失效
公开(公告)号：JPH0393554A
公开(公告)日：1991-04-18
申请号：JP23200889
申请日：1989-09-06
申请人： SHINKO ELECTRIC CO LTD , KOBE STEEL LTD
发明人： SUGIYAMA HAYAMI , KUBOTA TAKASHI , OGURA JOJI , NAKAGAMI AKIMITSU , TACHIBANA HIROYUKI , ONISHI YOSHIHIKO
IPC分类号： B41J2/335
摘要： PURPOSE:To obtain a thermal head which has excellent wear resistance and thermal shock resistance by a method wherein for a wear resistant layer, silicon carbide is used, and the component ratio between C and Si for the silicon carbide is continuously or discontinuously changed in the thickness direction of the wear resistant layer so that the component ratio at a heating resisting body side becomes minimum. CONSTITUTION:On an earthing electrode 12, a substrate 1 is placed, and from a gas inducing port 10a, a mixed gas which is composed of C2H4 as a hydrocarbon gas and SiH4 as a hydrogen silicide gas is induced in a decompression chamber 10 while the mixing ratio of the mixed gas is being changed. When a prescribed voltage is applied to an electrode 11, carbon C and silicon Si in the hydrocarbon gas and hydrogen silicide gas which have been excited by the applied voltage adhere to the substrate 1 in accordance with a mixed component ratio y/x, and on the surface of this substrate 1, a wear resistant layer 6, which is composed of SixCy, is formed. For example, the component ratio at a heating resisting body 3 side is taken as y/x=0.6, and the y/x value is gradually made larger in the thickness direction of the wear resistant layer 6, and at the surface, it is made to be y/x=2.8.

3. 发明专利

JPH0393553A THERMAL HEAD 失效
公开(公告)号：JPH0393553A
公开(公告)日：1991-04-18
申请号：JP23200789
申请日：1989-09-06
申请人： SHINKO ELECTRIC CO LTD , KOBE STEEL LTD
发明人： SUGIYAMA HAYAMI , KUBOTA TAKASHI , OGURA KENJI , NAKAGAMI AKIMITSU , TACHIBANA HIROYUKI , ONISHI YOSHIHIKO
IPC分类号： B41J2/335
摘要： PURPOSE:To equip an excellent durability against thermal shock by a method wherein between a heating resisting body layer, and a wear resistant layer, a thermal relaxation layer which has a hardness lower than the wear resistant layer and also has electric insulating property is provided. CONSTITUTION:On the upper surface of a substrate 1, a glazed glass layer 2, a heating resisting body layer 3 and electrode 4 are laminated in order, and at the same time, on the electrode 4, a thermal relaxation layer 6 is laminated. This thermal relaxation layer 6 is coated with a wear resistant layer 5 which makes contact with heat-sensitive paper. For example, the thermal relaxation layer 6 with a film thickness of 2mum is formed on the electrode 4 with silicon oxide with Knoop hardness 800, on this thermal relaxation layer 6, the wear resistant layer 5 which becomes AC with a film thickness of 2mum can be formed without trouble. Therefore, heat generated by the heating resisting body is transmitted to the wear resistant layer through this thermal relaxation layer 6. In the meantime, since this thermal relaxation layer 6 has an electric insulating property, the electrode does not short circuit, etc.

4. 发明专利

JPH02205668A SPUTTERING TARGET 失效
公开(公告)号：JPH02205668A
公开(公告)日：1990-08-15
申请号：JP2335189
申请日：1989-01-31
申请人： KOBE STEEL LTD , SHINKO ELECTRIC CO LTD
发明人： NAKAGAMI AKIMITSU , TACHIBANA HIROYUKI , ONISHI YOSHIHIKO , KUBOTA TAKASHI , SUGIYAMA HAYAMI , OGURA KENJI
IPC分类号： C23C14/34
摘要： PURPOSE:To form a geometrically arranged target of micrometer order size by forming a film of a secondary material on the surface of a discoid target base material into a continuous-film state and then partially removing the above continuous film by means of etching work. CONSTITUTION:A disk 1 of a primary material, such as SiO2, is used as a base material, and a sputtered film of a secondary material, such as Cr, in a state of continuous film is formed on the above disk 1, which is then formed into a geometrically arranged Cr sputtered film target, e.g. of mosaic pattern 2 by means of ordinary photoetching using photoresist. By using this target, a microscopically uniform film having fixed composition ratio and stable properties can be obtained.

5. 发明专利

JP2001180026A THERMAL HEAD 失效
公开(公告)号：JP2001180026A
公开(公告)日：2001-07-03
申请号：JP37730799
申请日：1999-12-28
申请人： SHINKO ELECTRIC CO LTD
发明人： SUGIYAMA HAYAMI , KUBOTA TAKASHI , MATSUDA HIROSHI , MASUKAWA KAZUSHI , HANAKI ATSUSHI
IPC分类号： B41J2/345
摘要： PROBLEM TO BE SOLVED: To provide a thermal head capable of being hardly damaged and produced at a low cost. SOLUTION: Two rows of heating resistors 4, 5 are formed on a surface of a substrate 1, a common electrode 7 commonly connected to the heating resistors is formed at a portion between the heating resistors and individual electrodes 8, 9 respectively connected to the heating resistors are formed at a portion opposite to the common electrode 7 wit respect to the respective heating resistors. A common wiring pattern 10 connected to the common electrode 7 is formed on the rear of the substrate 1 and the common wiring pattern 10 and common electrode 7 are connected with a conductive layer 3 formed at an inner face of a through-hole 2 provided between the front face and rear face of the substrate.

6. 发明专利

JP2001121763A PRINTER AND SHEET CUTTING METHOD THEREFOR 失效
公开(公告)号：JP2001121763A
公开(公告)日：2001-05-08
申请号：JP30461499
申请日：1999-10-26
申请人： SHINKO ELECTRIC CO LTD
发明人： SUGIYAMA HAYAMI , KAWAHARA KENICHI
IPC分类号： B41J11/70 , B41J15/16
摘要： PROBLEM TO BE SOLVED: To ensure perpendicularlity at four corner cut parts and prevension of color shift without stopping carriage of sheet. SOLUTION: A sheet 3 imparted with a tension through tension rollers 23a-23d is printed with specified colors while being carried and a printed sheet 3 is discharged through a discharge roller 6 before being cut. In such a sheet cutting method for a printer 16, the sheet 3 is cut by stopping discharge of the sheet 3 through the discharge roller 6 while sustaining carriage of the sheet.

7. 发明专利

JPH0655754A THERMAL HEAD 失效
公开(公告)号：JPH0655754A
公开(公告)日：1994-03-01
申请号：JP21439592
申请日：1992-08-11
申请人： SHINKO ELECTRIC CO LTD , NIPPON KINZOKU CO LTD
发明人： SUGIYAMA HAYAMI , KUBOTA TAKASHI , KONISHI TAKEHISA
IPC分类号： B41J2/335
摘要： PURPOSE:To minimize the distortion of a dot to be printed without slowing the speed of printing. CONSTITUTION:If a voltage is applied to individual electrodes 20 by switching operation of a control IC 14, the individual electrodes 20, a thermal resistor part 18 and a common electrode 19 are energized and the thermal resistor part 18 becomes heated. The heat generated in the thermal resistor part 18 is conducted to the projecting part 21a of an adjacent protecting film 21, an adjacent common electrode 19 and the individual electrodes 20. The heat conducted to the projecting part 21a of the protecting film 21 is conducted to an ink film 10 containing ink, and the ink in the heated part is transferred to a sheet 11. On the other hand, the heat conducted to the common electrode 19 and the individual electrodes 20 is conducted to the recessed part 21b of the protecting film 21 laminated on the common electrode and the individual electrodes. However, the heat conducted to the recessed part 21b of the protecting film 21 is not conducted to the ink film 10 as the recessed part 21b of the protecting film 21 is not in contact with the ink film 10.

8. 发明专利

JPH04369561A THERMAL HEAD 失效
公开(公告)号：JPH04369561A
公开(公告)日：1992-12-22
申请号：JP17334791
申请日：1991-06-19
申请人： SHINKO ELECTRIC CO LTD
发明人： SUGIYAMA HAYAMI , TOIDA AKIKAZU
IPC分类号： B41J2/335
摘要： PURPOSE:To remove common irregularity by relaxing heat accumulation by enabling heat insulation to be realized to an extent that heat interference between heating elements can be neglected by a method wherein a groove for heat insulation is provided to a glazed glass layer between the adjacent heating elements and outside the heating elements of left and right both end parts. CONSTITUTION:A groove 20 is provided between mutual glazed glass layers 16 existing under each heating element 12 of an individual electrode 14 and further a groove 20a is provided to a mid way between an individual electrode 14a existing at left and right both ends and the glazed glass layer 16 existing under an extended part 13a of a common electrode 13 existing at left and right both ends. A width of the grooves 20 and 20a is as broad as possible within a gap of the individual electrodes 14 placed in an array, and its length is made slightly longer than a length L of a heating part of the heating element 12.

9. 发明专利

JPH04347660A THERMAL HEAD OF THERMAL PRINTER AND PRINTING METHOD 失效
公开(公告)号：JPH04347660A
公开(公告)日：1992-12-02
申请号：JP14931791
申请日：1991-05-27
申请人： SHINKO ELECTRIC CO LTD
发明人： SUGIYAMA HAYAMI , KUBOTA TAKASHI
IPC分类号： B41J2/32 , B41J2/325 , B41J29/00 , B41J35/16
摘要： PURPOSE:To turn the rough surface to be smooth thereby to increase the fixing efficiency of dye and improve the stability of images for a long time by pressing a sublimating recording receiving layer on the surface of the paper by means of a fixing heater provided on the base of a thermal head. CONSTITUTION:A fixing heater 17 is formed on a glaze glass layer along a front edge of a base 1 of the thermal head by the thin film or thick film forming technique. The length La of a part 25a where ink is not applied between a cyan part 24 and a yellow part 22 in a sublimating ink film is set slightly longer than the length L of a part 25 where no ink is applied between the other color parts. Printing is conducted sequentially from yellow 22, magenta 23 and cyan 24. When the cyan part 24 is completely printed, the part 25a is adjusted to come close to the fixing heater 17 and the printing paper is forwarded once. During this time, the receiving layer on the surface of the paper is pressed with heat and softened, and accordingly the recessed part and projecting part formed on the surface of the paper at the time of the thermal transfer are smoothed. At the same time, the transferred dye is dispersed into the depth of the receiving layer, thus increasing the fixing efficiency of the dye and stabilizing the image for a long time.

10. 发明专利

JPH03171745A MOUNT STRUCTURE OF HYBRID INTEGRATED CIRCUIT 失效
公开(公告)号：JPH03171745A
公开(公告)日：1991-07-25
申请号：JP30895589
申请日：1989-11-30
申请人： SHINKO ELECTRIC CO LTD
发明人： SUGIYAMA HAYAMI
IPC分类号： H05K3/34 , H01L21/60 , H01L27/01 , H05K1/09 , H05K3/40
摘要： PURPOSE:To improve electrical connection between a gold conductor and chip parts without causing the gold of the gold conductor to be absorbed into solder by forming a conductor pad which can be soldered onto the gold conductor without directly forming solder on the gold conductor. CONSTITUTION:A conductor pad 10 consisting of gold which can be soldered is formed on a gold conductor 5 through a barrier layer 11. Then, a lead frame 2 is fixed onto this conductor pad 10 by a solder 9. The material of the barrier layer 11 may be or may not be equal to that of a barrier layer 4, namely chrome, titanium, nickel, etc. In this manner, presence of the barrier layer 11 prevents gold of the gold conductor 5 from being absorbed into the solder 9, thus achieving a mount structure of a hybrid integrated circuit where adhesion of the chip parts to the substrate is large and electrical connection to the gold conductor is also stable.

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