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1. 发明专利

JPH0655754A THERMAL HEAD 失效
公开(公告)号：JPH0655754A
公开(公告)日：1994-03-01
申请号：JP21439592
申请日：1992-08-11
申请人： SHINKO ELECTRIC CO LTD , NIPPON KINZOKU CO LTD
发明人： SUGIYAMA HAYAMI , KUBOTA TAKASHI , KONISHI TAKEHISA
IPC分类号： B41J2/335
摘要： PURPOSE:To minimize the distortion of a dot to be printed without slowing the speed of printing. CONSTITUTION:If a voltage is applied to individual electrodes 20 by switching operation of a control IC 14, the individual electrodes 20, a thermal resistor part 18 and a common electrode 19 are energized and the thermal resistor part 18 becomes heated. The heat generated in the thermal resistor part 18 is conducted to the projecting part 21a of an adjacent protecting film 21, an adjacent common electrode 19 and the individual electrodes 20. The heat conducted to the projecting part 21a of the protecting film 21 is conducted to an ink film 10 containing ink, and the ink in the heated part is transferred to a sheet 11. On the other hand, the heat conducted to the common electrode 19 and the individual electrodes 20 is conducted to the recessed part 21b of the protecting film 21 laminated on the common electrode and the individual electrodes. However, the heat conducted to the recessed part 21b of the protecting film 21 is not conducted to the ink film 10 as the recessed part 21b of the protecting film 21 is not in contact with the ink film 10.

2. 发明专利

JP2001267051A HEATING ELEMENT FOR ELECTROMAGNETIC INDUCTION HEATING 失效
公开(公告)号：JP2001267051A
公开(公告)日：2001-09-28
申请号：JP2000083261
申请日：2000-03-21
申请人： NIPPON KINZOKU CO LTD , NISSEN CORP , SETA GIKEN KK
发明人： OGUSHI TETSUTARO , KONISHI TAKEHISA , YAMADA KAZUO , HIOKI TOSHIMI , KAWAMURA TAIZO
IPC分类号： H05B6/10
摘要： PROBLEM TO BE SOLVED: To provide a heating element for electromagnetic induction heating with high heating efficiency. SOLUTION: The heating element 1 generates heat by electromagnetic induction. The heating element 1 is provided with several conductive pipes 2 to 4 and fixing means 5 fixing each conductive pipe with the other. The heating element for electromagnetic induction heating 1 is structured in a stable connected condition of respective conductive pipes 2 to 4. Thus fixing each conductive pipe with the other with the fixing means, the conductive pipes 2 to 4 are all connected stably, then an electrical load of the heating element for electromagnetic induction heating 1 becomes stable, and, therefore, the matching of electrical load with each characteristic value is in the best and most stable condition, and the maximum high heating efficiency is provided.

3. 发明专利

JPH09158408A BUILDING STRUCTURE 失效
公开(公告)号：JPH09158408A
公开(公告)日：1997-06-17
申请号：JP31555795
申请日：1995-12-04
申请人： NIPPON KINZOKU CO LTD , YAMADE KK
发明人： OSUMI HIROAKI , SAWADA SHOHEI , KONISHI TAKEHISA , SAWANISHI RYOZO , INOUE SHU , KATSUMA YASUHARU
IPC分类号： E04D5/14
摘要： PROBLEM TO BE SOLVED: To shorten heating time at the time of fixing a sheet on a base 1 by electromagnetic induction heating. SOLUTION: A sheet 2 to cover the whole of a base 1 is spread over an upper surface of the base 1 through a fixing piece 3. The sheet 2 is fixed on the base 1 through the fixing piece 3 and an anchor nail 4 as a heat welding material layer 5 melts by electromagnetic induction heating. The heat welding material layer 5 has aluminium foil interposed in it, the fixing piece 3 is of a stainless steel sheet, its most part is made to work on the thin aluminium foil by converging a magnetic line of force, the foil smoothly generates heat, and the heat welding material layer 5 is smoothly melt. After melting, the melted part is taken heat away from it by the fixing piece 3, smoothly cooled and solidified, and solid adhesion is realized.

4. 发明专利

JPH0718325A ELECTRIC RESISTIVITY OF METALLIC MATERIAL AND ADJUSTING METHOD OF ELECTRIC RESISTIVITY TEMPERATURE COEFFICIENT 失效
公开(公告)号：JPH0718325A
公开(公告)日：1995-01-20
申请号：JP16074693
申请日：1993-06-30
申请人： NIPPON KINZOKU CO LTD
发明人： SAWADA SHOHEI , KONISHI TAKEHISA , KOBAYASHI MITSUO
IPC分类号： C21D8/00
摘要： PURPOSE:To adjust the electric resistivity of a metallic material and to give relatively high electric resistivity temperature coefficient by heat treating the metallic material at a specific temperature after adjusting the hardness of metallic by rolling, etc. CONSTITUTION:The hardness of metallic material is adjusted by rolling method or the like. Then, the metallic material is heat treated from the temperature of 200 deg.C lower than the recrystallization starting temperature up to the solid solution temperature. When the metallic material is stainless steel, it is preferable to adjust the hardness by rolling it with draft equal to or more than 40%. Further, it is preferable to roll the hardened stainless steel with draft equal to or less than 50%, after it is heat treated at the temperature of 700 to 1000 deg.C, and then, it is treated again at the same range of temperature if necessary.

5. 发明专利

JPH01145887A INSULATING SUBSTRATE FOR ELECTRIC DEVICE AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH01145887A
公开(公告)日：1989-06-07
申请号：JP30375687
申请日：1987-12-01
申请人： NIPPON KINZOKU CO LTD
发明人： KONISHI TAKEHISA , OHASHI NOBUAKI
IPC分类号： C22C38/00 , C22C38/18 , C22C38/50 , C23D3/00 , H01L27/13 , H05K1/05 , H05K3/44
摘要： PURPOSE:To obtain an insulation substrate for an electric device in which the adhesive properties of an insulating layer to a whole metal substrate do not decrease even if an electronic circuit for a thick film is repeatedly baked by heat treatment of the metal substrate made of iron alloy containing chromium in a reducing atmosphere containing hydrogen, and then forming a glass insulating layer on partial or all surface of the substrate. CONSTITUTION:A metal substrate 1 is made fundamentally of iron alloy containing 10-30wt.% of chromium, which may contain 0.055-5wt.% of aluminum or 0.05-5% of silicon. Further, iron alloy containing 10-30wt.% of chromium, 0.05-7wt.% of aluminum and 0.1-3wt.% of titanium may be used. Then, the substrate is heat treated at a dew point or lower for decomposing iron oxide into iron and oxygen in an atmosphere containing hydrogen, such as a mixture atmosphere of hydrogen and nitrogen formed by decomposing ammonium thereby to form a film on the substrate. Thereafter, the film is coated with vitreous substance made in paste or slurry thereby to form a vitreous insulator layer 2. Then, it is dried and then baked.

6. 发明专利

JPS62198187A INSULATING BOARD FOR ELECTRIC APPARATUS 失效
公开(公告)号：JPS62198187A
公开(公告)日：1987-09-01
申请号：JP4072086
申请日：1986-02-26
申请人： NIPPON KINZOKU CO LTD
发明人： OHASHI NOBUAKI , KASAHARA AKIHIKO , KONISHI TAKEHISA , YASHIRO TOSHIYUKI
IPC分类号： B32B9/00 , B32B7/02 , B32B15/04 , H05K1/05

7. 发明专利

JPS5912755B2 JPS5912755B2 - 失效
公开(公告)号：JPS5912755B2
公开(公告)日：1984-03-26
申请号：JP8595281
申请日：1981-06-04
申请人： Nippon Kinzoku Co Ltd
发明人： HITOMI TOMOJI , KONISHI TAKEHISA , OOGUSHI TETSUTARO , HATAKEYAMA KAZUAKI
IPC分类号： C25D11/38 , C25D9/10
CPC分类号： C25D9/10

8. 发明专利

JP2002013110A SOUND ABSORBING BOX 失效
公开(公告)号：JP2002013110A
公开(公告)日：2002-01-18
申请号：JP2000192925
申请日：2000-06-27
申请人： DAITO KINZOKU KK , NIPPON KINZOKU CO LTD
发明人： KODAMA TERUAKI , MATSUMURA TERUHISA , KIMURA TAIZO , OKADA MITSUHIRO , HINO SHINJIRO , KURAMOCHI HIROHISA , KONISHI TAKEHISA
IPC分类号： E01F8/00 , E01F8/02 , E04B1/82 , G10K11/16
摘要： PROBLEM TO BE SOLVED: To provide a sound absorbing box capable of improving a sound absorbing effect by covering almost the whole surface of a support of a sound insulating wall and also improving outer appearance of the sound insulating wall. SOLUTION: This sound absorbing box is constituted by installing a sound absorbing plate 40 through support members 20, 30 with specified intervals from side plates 12, 13 of a case body 10, devised to fit a flange 2 of a support 1 in the support members 20, 30 and devised to cover a front surface of the support 1 with the sound absorbing plate 40.

9. 发明专利

JPH05318691A PROCESSING METHOD OF METAL AND RESIN LAMINATED PLATE 失效
公开(公告)号：JPH05318691A
公开(公告)日：1993-12-03
申请号：JP12349592
申请日：1992-05-15
申请人： NIPPON KINZOKU CO LTD
发明人： INOUE KAZUO , SAWADA SHOHEI , KONISHI TAKEHISA , KOBAYASHI MITSUO
IPC分类号： B32B3/14 , B32B15/08 , B32B37/00 , C23F1/02 , B32B31/18 , B32B31/24
摘要： PURPOSE:To blank easily and precisely by etching, by a method wherein two metallic thin plates are stuck and laminated to each other through a resin layer, the two metallic thin plates are etched and cutting grooves are formed respectively in scheduled cutting parts. CONSTITUTION:After a resist layer is clad to both the surfaces of this metal and resin laminated plate 11, that is, the surfaces of two metallic thin plates 12, 13 and exposed, a fixed part is removed and then the thin plates 12, 1 3 are etched. Then cutting grooves 16 are formed into the two thin plates by this processing. The cutting groove 16 is formed along scheduled cutting line for separation of a product from the laminated body 11 and formed continuously extending over the whole circumference of the product 15 and such a part as to correspond to a bridge part of a conventional etching method is not formed. Although in the thin plates 12, 13, a part of the product 15 is cut off completely from them by forming the groove 16 like this, since a resin layer 14 is left behind, the part of the product 15 is connected with the laminated plate 11 by the resin layer 14 and ball-off does not happen.

10. 发明专利

JPS60214583A Hybrid integrated circuit substrate 失效
标题翻译：混合集成电路基板
公开(公告)号：JPS60214583A
公开(公告)日：1985-10-26
申请号：JP7138784
申请日：1984-04-10
申请人： Nippon Kinzoku Co Ltd , Shoei Chemical Ind Co
发明人： NAKAMURA GIICHI , IGUMA TOSHIO , OOHASHI NOBUAKI , KONISHI TAKEHISA
IPC分类号： H05K1/05 , C03C8/02 , H05K1/03

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