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    • 1. 发明专利
    • SILICON CARBIDE MEMBER
    • JPH03153876A
    • 1991-07-01
    • JP29306689
    • 1989-11-10
    • SHINETSU CHEMICAL CO
    • MADONO TAKATSUGUHAYASHI NORIOMATSUMOTO FUKUJI
    • C04B35/565C04B41/52C04B41/89C23C16/32C23C16/34H01L21/22H01L21/477
    • PURPOSE:To improve the adhesion of a base body and an SiC film at the time of forming the SiC films on the surface of parts contg. free Si and consisting of SiC as a base body at the time of a heat treatment of semiconductors by forming the SiC films in which the free Si content decreases gradually toward the surface by a CVD method between the surface of the above-mentioned parts and the SiC film. CONSTITUTION:The SiC-Si layer 2 contg. 10% free Si is formed by the CVD method on the surface of the SiC base body 1 contg. 20% free Si as the parts for treating the semiconductors at 10 to l00mum thickness, then the SiC-Si layer 3 contg. 5% free Si is formed thereon at 10 to 100mum thickness and further, the SiC layer 4 contg. no free Si at all is formed on the extreme surface at 10 to 300mum thickness, by which the SiC layers of 100 to 300mum total thickness are provided thereon in order to prevent the contamination of the semiconductors by the diffusion of impurities from the inside of the parts at the time of using the SiC to produce the parts, such as wafer boats, to be used when the semiconductor is heat treated at a high temp. The SiC parts having the SiC films which do not peel from the base material 1 or crack and having a long life are produced.
    • 2. 发明专利
    • SILICON CARBIDE-BASED REACTION TUBE
    • JPH01282153A
    • 1989-11-14
    • JP10921288
    • 1988-05-06
    • SHINETSU CHEMICAL CO
    • MATSUMOTO FUKUJIHAYASHI NORIOTAWARA YOSHIO
    • C04B35/565C04B35/56C04B41/87H01L21/22
    • PURPOSE:To provide the title reaction tube for a diffusion furnace for the heat treatment of a semiconductor without causing defects due to impurities in the semiconductor by forming the layer of high-purity silicon carbide having a specified thickness on the whole inner surface of the reaction tube consisting of reaction-sintered silicon carbide. CONSTITUTION:A silicon carbide coating film is deposited by vapor-phase synthesis, etc., on the whole inner surface of the reaction tube consisting of reaction sintered silicon carbide, and the layer of high purity silicon carbide having 0.5-2mm thickness is formed. In addition, when the silicon carbide layer is formed by vapor-phase synthesis, Si is previously removed from the inner surface of the reaction tube, and an Si-free layer is preferably formed. The obtained silicon carbide-based reaction tube is not deformed or devitrified even under high-temp. conditions. When a semiconductor is heat-treated in a diffusion furnace by using the reaction tube, the yield in the production of semiconductors can be improved without causing defects due to the presence of impurities in a silicon wafer.
    • 5. 发明专利
    • WASHING METHOD FOR SILICON CARBIDE MEMBER
    • JPH0677310A
    • 1994-03-18
    • JP25207692
    • 1992-08-27
    • SHINETSU CHEMICAL CO
    • MATSUMOTO FUKUJIFUJIMA YOSHIHIKO
    • B08B5/00H01L21/22H01L21/673H01L21/68
    • PURPOSE:To make it possible to wash in a short time and with a high washing degree by performing dry type hydrochloride gas washing for a silicon carbide member for producing semiconductors, then reducing pressure, removing a residual gas in the system, and performing oxygen gas flow washing. CONSTITUTION:Wet washing is performed by immersing a silicon carbide member into a 5 to 10% hydrofluoric acid solution for 60 to 120 minutes. Then, it is taken out from said solution and acid is fully removed by fully rinsing it with pure water, and natural drying is performed. When performing dry type washing for a dried silicon carbide member, the silicon carbide member is set in a diffusion furnace and heating is started. Then, after reaching a predetermined temperature, dry hydrochloride gas washing is performed in which oxygen gas and hydrochloride gas flow. Thereafter, the pressure is reduced in the system, hydrochloride gas is applied, the pressure is reduced again and the residual gas in the system is removed. Then, oxygen gas flow washing is performed and dry washing is completed. By doing this, the washing can be performed in a short time with a high degree of washing.
    • 6. 发明专利
    • MANUFACTURE OF CERAMIC TUBE
    • JPH04169203A
    • 1992-06-17
    • JP29647690
    • 1990-11-01
    • SHINETSU CHEMICAL CO
    • MATSUMOTO FUKUJIYAMADA TORUHAMAYA NORIAKI
    • C04B35/00B28B11/12B28B21/00
    • PURPOSE:To suppress the generation of deformation in a baking process and a sintering process by forming ring-shape thick-walled parts to both end parts in the axial direction of the outer peripheral surface of a cylindrical molded body along the peripheral direction at the time of molding. CONSTITUTION:A raw material powder with which a binder is mixed if necessary is molded to form a cylindrical molded body 1 having ring-shape thick- walled parts 22 formed to both end parts in the axial direction of the outer peripheral surface thereof. At this time, the cylindrical molded body having wall thickness larger than a desired dimension is molded and, thereafter, the outer peripheral surface of the part of a tube main body 3 is subjected to cutting processing so as to leave the thick-walled parts 22 at both end parts. Next, the molded body 1 is usually heated at about 400-1000 deg.C to perform a primary baking process decomposing the binder to properly cure the molded body and the obtained baked body is sintered. In this primary baking process and the sintering process, dimensional accuracy can be well held by the action of the ring-shape thick-walled parts 22 without generating deformation such as collapse.
    • 7. 发明专利
    • APPARATUS FOR PRODUCING SILICON CARBIDE FILM
    • JPH03130366A
    • 1991-06-04
    • JP26753989
    • 1989-10-13
    • SHINETSU CHEMICAL CO
    • MADONO JIYUNJIHAYASHI NORIOFUJIMA YOSHIHIKOMATSUMOTO FUKUJI
    • C04B35/565C04B35/56C23C16/32C23C16/44C23C16/46H01L21/205H01L21/31
    • PURPOSE:To allow film formation with excellent uniformity and homogeneity with the apparatus for forming the high purity silicon carbide film by chemical vapor deposition on the inside surface of a cylindrical work by adopting the constitution to prevent the distance between a heating section and a gas introducing section from changing. CONSTITUTION:A base body 31 is housed in a reaction tube 17 and the tube 17 is capped, then the inside of the tube is reduced in pressure at the time of forming the high purity silicon carbide film on the inside surface of the cylindrical silicon carbide film base body (work) 31 of the reaction tube for a semiconductor diffusion furnace. A water cooled induction coil 26 is then energized to heat the lower part of the base body 31 to a band shape and gaseous raw materials contg. a carbon source and silicon source are supplied to the band-shaped heating region mentioned above through a gas supplying pipe 28. The silicon carbide film is then deposited by evaporation on the lower part in the base body 31. The tube 17 is lowered by operating a reduction motor 3 in this state and the film formation is executed while the band-shaped reaction region supplied with the gaseous raw materials is moved from the bottom end to the top end of the base body 31. Since the coil 26 and the supplying pipe 28 are fixed with this device, the distance between both does not change at the time of the film formation.