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1. 发明专利

JP2012019189A Apparatus and method for mounting electronic component 审中-公开
标题翻译：用于安装电子元件的装置和方法
公开(公告)号：JP2012019189A
公开(公告)日：2012-01-26
申请号：JP2010276830
申请日：2010-12-13
申请人： Shibaura Mechatronics Corp , 芝浦メカトロニクス株式会社
发明人： ICHIHASHI TAKESHI , TAKEISHI KOJI , SHIRAISHI TOSHIRO , TESHIMA KEI
IPC分类号： H05K13/04
摘要： PROBLEM TO BE SOLVED: To provide an apparatus for mounting an electronic component that ensures terminal parts of a TCP are cleaned so as to prevent an adhesive tape stuck to the terminal parts from peeling from the terminal parts.SOLUTION: An apparatus for mounting an electronic component on a circuit board comprises: an apparatus main body 1; punching devices 5A and 5B provided in the apparatus main body 1 for punching out a TCP 4 from a carrier tape 3; a jet nozzle 8 for cleaning the surface of a terminal side of the TCP provided in the carrier tape before punching out the TCP from the carrier tape; index means 18A and 18B provided in the apparatus main body and having a plurality of holding heads 19, for holding the TCP punched out from the carrier tape by the punching device; second cleaning means 91 for removing dirt sticking to and remaining on the TCP held by the holding head of the index means; sticking devices 31A and 31B for sticking an adhesive tape 32 to the surface of the terminal side of the TCP cleaned by the second cleaning means; and a mounting head for mounting the TCP stuck to the adhesive tape by the sticking device on the circuit board.
摘要翻译：要解决的问题：提供一种用于安装确保TCP的端子部分被清洁的电子部件的装置，以防止粘附到端子部分的粘合带从端子部分剥离。解决方案：一种用于将电子部件安装在电路板上的装置包括：设备主体1; 设置在装置主体1中的用于从载带3冲出TCP 4的冲压装置5A和5B; 用于在从载带上冲出TCP之前清洁设置在载带上的TCP的终端侧的表面的喷嘴8; 设置在设备主体中并具有多个保持头19的引导装置18A和18B，用于保持通过冲压装置从载带上冲出的TCP; 第二清洁装置91，用于去除由指示装置的保持头保持的TCP上残留的残留物; 用于将粘合带32粘贴到由第二清洁装置清洁的TCP的终端侧的表面上的粘贴装置31A和31B; 以及用于通过电路板上的贴装装置将TCP粘贴到粘合带上的安装头。版权所有（C）2012，JPO＆INPIT

2. 发明专利

JP2002009050A ASHING METHOD 失效
公开(公告)号：JP2002009050A
公开(公告)日：2002-01-11
申请号：JP2000186028
申请日：2000-06-21
申请人： SHIBAURA MECHATRONICS CORP
发明人： MUTO MAKOTO , KAMIUMA TOSHIYUKI , TAKEISHI KOJI , YAMAZAKI TOMOO
IPC分类号： G03F7/40 , H01L21/027 , H01L21/302 , H01L21/3065
摘要： PROBLEM TO BE SOLVED: To ash a resist film without deteriorating an organic low dielectric film and without reducing processing speed even if the organic low dielectric film exists as the lower layer of the resist film. SOLUTION: In an ashing method, an ashing processing is performed on a substrate to be processed W, which has the organic low dielectric film and the resist film formed as the upper layer. The method is provided with a first process for applying a high frequency electric field to process gas and generating ions by a bias device 5 having a high frequency power source 4, and for performing anisotropic plasma ion ashing on the resist film by the ions accelerated to the substrate to be processed W; and a second process for irradiating process gas with a microwave by a plasma generation device 7 having a microwave power source 13 after the first process and ashing the resist film by the plasma.

3. 发明专利

JP2000349075A PLASMA PROCESSING APPARATUS 失效
公开(公告)号：JP2000349075A
公开(公告)日：2000-12-15
申请号：JP24205599
申请日：1999-08-27
申请人： SHIBAURA MECHATRONICS CORP
发明人： TAKEISHI KOJI , MIYAMOTO TAKASHI , TSUGAMI YOSHIZO
IPC分类号： H01L21/302 , C23F4/00 , H01L21/205 , H01L21/3065 , H05H1/46
摘要： PROBLEM TO BE SOLVED: To obtain a plasma processing apparatus which can stabilize discharge. SOLUTION: In the plasma processing apparatus, a process gas G is introduced into the interior of a discharge tube 6 of dielectric, a microwave M guided via a microwave waveguide 10 is irradiated on the process gas G within the discharge tube 6 to generate a plasma. A slit 12 for guiding of the microwave M into the discharge tube 6 is made in a surface E or H of the microwave waveguide 10. The slit 12 is extended to be parallel to a direction of the axis of the tube 6, and the waveguide 10 is filled with dielectric therein.

4. 发明专利

JP2000286332A DRY-ETCHING ELECTROSTATIC CHUCK DEVICE AND RECEPTACLE STAND 失效
公开(公告)号：JP2000286332A
公开(公告)日：2000-10-13
申请号：JP9291199
申请日：1999-03-31
申请人： SHIBAURA MECHATRONICS CORP
发明人： TAKEISHI KOJI
IPC分类号： B23Q3/15 , H01L21/68 , H01L21/683 , H02N13/00
摘要： PROBLEM TO BE SOLVED: To provide an electrostatic chuck device which can be commonly used for both down flow etching and reactive ion etching. SOLUTION: A chuck main body 16, having a pair of insulating films 27 pinching a conductive film 25 from both sides, is adhered to a mounting stand 4. The surface of the chuck main body 16 is covered by a protective film 28 consisting of fluororesin, and the circumferential part 28a of the protective film 28 is curved to the side of a side circumferential surface 4b of the mounting stand 4 and covers a bonding agent exposed part 26 between the chuck main body 16 and the mounting stand 4. A bonding agent exposed part 39 between the protective film 26 and the mounting stand 4 is covered by a protective ring 29. The flat part 28b on the surface of the protective film 28 forms the mounting surface, where the material to be treated W is mounted, and the outside diameter of the mounting stand 28b is smaller than the outside diameter of the material to be treated W.

5. 发明专利

JP2010247005A Apparatus and method for generating fine bubble 审中-公开
标题翻译：用于产生细小泡沫的装置和方法
公开(公告)号：JP2010247005A
公开(公告)日：2010-11-04
申请号：JP2009095786
申请日：2009-04-10
申请人： Shibaura Mechatronics Corp , 芝浦メカトロニクス株式会社
发明人： WATANABE SHIGERU , SAKAI TETSUYA , MIYAMOTO TAKASHI , TAKEISHI KOJI
IPC分类号： B01F5/00 , B01F3/04 , B01F5/06
摘要： PROBLEM TO BE SOLVED: To provide a fine bubble generator capable of improving generation efficiency of fine bubbles.
SOLUTION: The fine bubble generator 1 includes a cylinder 2 containing a liquid, a bubble-generating structure 3 arranged in the cylinder 2 in a rotatable way and generating fine bubbles from the porous outer peripheral surface into the liquid in the cylinder 2, a rotating mechanism 4 rotating the bubble-generating structure 3 externally outside the cylinder 2, an inlet tube 8 allowing the liquid in the cylinder 2 to flow into the cylinder 2 and a discharge tube 9 discharging the liquid out of the cylinder, and the inlet tube 8 and the discharge tube 9 are each connected to the cylinder 2 so as to make the liquid in the cylinder 2 turn around the bubble-generating structure 3.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：解决的问题：提供能够提高细小气泡的发泡效率的微细气泡发生器。解决方案：微细气泡生成器1包括容纳液体的气缸2，以可旋转的方式布置在气缸2中的气泡产生结构3，并从多孔外周面向气缸2内的液体产生细小的气泡旋转机构4，其使气泡生成结构体3在气缸2的外部旋转，允许气缸2内的液体流入气缸2的入口管8和将液体排出气缸的排出管9，入口管8和排放管9各自连接到气缸2，以使气缸2中的液体绕气泡产生结构3转动。版权所有（C）2011，JPO＆INPIT

6. 发明专利

JP2005072034A Plasma treatment apparatus 有权
标题翻译：等离子体处理装置
公开(公告)号：JP2005072034A
公开(公告)日：2005-03-17
申请号：JP2003208388
申请日：2003-08-22
申请人： Shibaura Mechatronics Corp , 芝浦メカトロニクス株式会社
发明人： TAKEISHI KOJI
IPC分类号： H01L21/3065 , H01L21/68 , H01L21/683
摘要： PROBLEM TO BE SOLVED: To provide a plasma treating apparatus for suppressing deposition of build-ups on the back of an object to be treated, placed on electrostatic chuck in plasma treatment inside a chamber. SOLUTION: A surface for retaining the object W to be treated in the electrostatic chuck 9 is formed so that the electrostatic attraction force becomes weaker at a periphery 34 than at a center 33, in the plasma treating apparatus. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种等离子体处理装置，用于抑制在待处理物体的背面上积聚的沉积物，放置在室内的等离子体处理中的静电卡盘上。解决方案：在等离子体处理装置中，形成用于保持静电卡盘9中要处理的物体W的表面，使得静电吸引力在周边34比在中心33处更弱。版权所有（C）2005，JPO＆NCIPI

7. 发明专利

JP2001156043A PLASMA-PROCESSING APPARATUS 失效
公开(公告)号：JP2001156043A
公开(公告)日：2001-06-08
申请号：JP34016899
申请日：1999-11-30
申请人： SHIBAURA MECHATRONICS CORP
发明人： TSUGAMI YOSHIZO , MIYAMOTO TAKASHI , TAKEISHI KOJI
IPC分类号： H01L21/302 , H01L21/3065
摘要： PROBLEM TO BE SOLVED: To achieve sufficient cooling by placing a sheet member, in contact with a discharge tube or a microwave transmission window member and to prevent deterioration of the sheet member due to beat wilding between the discharge bulb or microwave transmitting window member and the sheet member or due to ultraviolet rays or the like. SOLUTION: A metal member 14, consisting of a metal material, allocated in the surrounding of a discharge tube 6 and a flexible sheet member 12 provided at the surrounding between the discharge bulb 6 and metal member 14 are provided at the connecting portion of a microwave waveguide 10 an the discharge tube 6. The sheet member 12 includes a pair of heat-resistant layers 12a, 12c, consisting of a heat-resistant material allocated at the inner circumferential side facing to the discharge tube 6 and at the outer circumference side facing to the metal member 14 and a heat conductive layer 12b consisting of a heat conducting material arranged between a pair of heat-resistant layers 12a, 12c.

8. 发明专利

JP2010206068A Plasma processing apparatus, and plasma processing method 有权
标题翻译：等离子体加工设备和等离子体处理方法
公开(公告)号：JP2010206068A
公开(公告)日：2010-09-16
申请号：JP2009051856
申请日：2009-03-05
申请人： Shibaura Mechatronics Corp , 芝浦メカトロニクス株式会社
发明人： WATANABE SHIGERU , TAKEISHI KOJI , SAKAI TETSUYA , MUTO MAKOTO , MATSUSHIMA DAISUKE , SHIRAHAMA YUKI , WATANABE DAISUKE
IPC分类号： H01L21/3065 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a plasma processing apparatus and a plasma processing method that can suppress an influence on an object to be processed and improve productivity when unnecessary matter is removed. SOLUTION: The plasma processing apparatus 1 includes a processing container 6 containing the object W to be processed and being capable of maintaining an atmosphere of pressure reduced below the atmospheric pressure, a pressure reducing means 3 of reducing the pressure in the processing container, a plasma generation chamber having a space communicating with the space wherein the object to be processed is stored and generating plasma, a plasma generating means 2 of making an electromagnetic wave act on the space wherein the plasma is generated to generate the plasma, a gas supply means 4 of supplying a process gas to the space wherein the plasma is generated, a removal liquid steam supply means 30 of supplying removal liquid steam to the space wherein the object to be processed is stored, and a first temperature control means 51 of controlling the temperature of the object to be processed so as to be a temperature or below at which the removal liquid stream condenses. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：解决的问题：提供一种能够抑制对待处理物体的影响的等离子体处理装置和等离子体处理方法，并且在不必要的物质被去除时提高生产率。解决方案：等离子体处理装置1包括容纳待处理对象物W并能够将压力降低到大气压以下的气氛的处理容器6，减小处理容器内的压力的减压装置3 等离子体产生室，其具有与待处理物体相互存储并产生等离子体的空间连通的空间;等离子体产生装置2，其使电磁波作用于产生等离子体的空间以产生等离子体;气体供给装置4，其向生成等离子体的空间供给处理气体;去除液体蒸汽供给装置30，其向被处理物体存储的空间供给去除液体蒸汽;第一温度控制装置51，被处理物的温度为除去液体流冷凝的温度以下。版权所有（C）2010，JPO＆INPIT

9. 发明专利

JP2008145780A Apparatus and method for manufacturing display device and ink-jet supply apparatus 有权
标题翻译：制造显示装置和墨水供应装置的装置和方法
公开(公告)号：JP2008145780A
公开(公告)日：2008-06-26
申请号：JP2006333653
申请日：2006-12-11
申请人： Shibaura Mechatronics Corp , 芝浦メカトロニクス株式会社
发明人： IKUTA AKIRA , TSURUOKA YASUJI , TAKEISHI KOJI , MIYAMOTO TAKASHI
IPC分类号： G02B5/20 , G02F1/1335 , G09F9/00
摘要： PROBLEM TO BE SOLVED: To make a convex part ink-repellent and a concave part ink-philic even if the whole substrate having the patterned convex and concave parts is subject to ink-repellent treatment.
SOLUTION: A method for manufacturing a display device, in which a thin film material liquid is supplied to the substrate 1, which consists of an inorganic material and on which the convex part 2 consisting of an organic material is formed and the concave part 3 is divided by the convex part 2, by an ink-jet method to form a thin film layer, comprises the steps of: accumulating a fluorocarbon resin F on both of the convex part 2 and the concave part 3; and cleaning the fluorocarbon resin F accumulated on both of the convex part 2 and the concave part 3.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：即使具有图案化的凹凸部分的整个基板进行拒墨处理，也使得油墨拒斥剂和凹入部分具有亲墨色性。解决方案：一种显示装置的制造方法，其中将薄膜材料液体供给到由无机材料构成的基板1，并且在其上形成由有机材料构成的凸部2和凹部部分3由凸部2通过喷墨法分开以形成薄膜层，包括以下步骤：在两个凸部2和凹部3上积聚氟碳树脂F; 并清洗积聚在凸部2和凹部3两者上的氟碳树脂F.（C）2008，JPO＆INPIT

10. 发明专利

JP2007173853A Plasma processing device 有权
标题翻译：等离子体加工装置
公开(公告)号：JP2007173853A
公开(公告)日：2007-07-05
申请号：JP2007010777
申请日：2007-01-19
申请人： Shibaura Mechatronics Corp , 芝浦メカトロニクス株式会社
发明人： MIYAMOTO TAKASHI , TAKEISHI KOJI , SUZUKI HASHIO
IPC分类号： H01L21/3065 , H05H1/46
摘要： PROBLEM TO BE SOLVED: To provide a plasma processing device which allows the lowering of processing rate and formation of particles to be positively and readily copied with. SOLUTION: By providing a bypass line 50 which allows the cleaning gas to be exhausted without passing a processing chamber 10, an efficient cleaning can be performed, while the contamination of the chamber or the like is prevented. Further, the addition of a heating means to an electrical discharge tube 22 allows the reaction products to be heated and evaporated to rapidly eliminate them. Furthermore, the covering of inside wall of a transport pipe 30 with reaction products, such as aluminum fluoride in advance, allows the changes with time in the plasma processing rate to be repressed. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种等离子体处理装置，其允许降低加工速率和形成颗粒以被积极地容易地复制。解决方案：通过提供允许清洁气体在不通过处理室10的情况下排出的旁路管线50，可以执行有效的清洁，同时防止腔室等的污染。此外，向放电管22添加加热装置允许加热和蒸发反应产物以迅速消除它们。此外，预先对诸如氟化铝的反应产物的输送管30的内壁的覆盖允许等离子体处理速度随时间的变化被抑制。版权所有（C）2007，JPO＆INPIT

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