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    • 6. 发明专利
    • MANUFACTURE OF FILM EL ELEMENT
    • JPH0745367A
    • 1995-02-14
    • JP19013593
    • 1993-07-30
    • SHARP KK
    • NOMA MIKIHIROTANAKA KOICHINAKAMURA NORIAKIYAMADA KIMIHIKO
    • G09F9/30H05B33/10H05B33/12H05B33/14
    • PURPOSE:To stabilize the light emitting properties in a short time without raising light emitting threshold voltage, and besides, improve the mass production and long-term reliability by setting the order of performing oxidation treatment and heat treatment, the condition, etc., optimally. CONSTITUTION:For the light emitting layer made in a substrate, the surface is oxidized in oxygen atmosphere or atmoshere including oxygen, and then heat treatment is performed for the light emitting layer in substrate temperature range of 400-500 deg.C. Moreover, in oxidation processing, in case that, for example, Zns is used as the light emitting layer, the composition rate of the light emitting layer is corrected by O atoms filling up the S defect on the surface of the light emitting layer, so the time required for the stabilization of light emitting properties is shortened. That is, the light emitting threshold voltage is lowered without marring the shortening effect of the initial aging time by oxidizing by setting the substrate temperature in heat treatment in the range of 400-500 deg.C, as result the mass producibility of a film EL element and the long-term reliability can be improved, and also the drive voltage can be reduced.
    • 10. 发明专利
    • THIN FILM DIELECTRIC
    • JPH0574760A
    • 1993-03-26
    • JP23588191
    • 1991-09-17
    • SHARP KK
    • TERADA KOSUKEMIKAMI AKIYOSHITANAKA KOICHI
    • H01L21/316H01L21/318H05B33/12H05B33/22
    • PURPOSE:To obtain a thin film dielectric which is high in permittivity and breakdown strength, small in leakage current, and long in service life by a method wherein dielectric thin films of high permittivity and thin films of dielectric material low in leakage current are alternately laminated for the formation of the thin dielectric concerned. CONSTITUTION:A stripe-like transparent electrode 2 of ITO is formed on a glass board 1 through a high frequency sputtering method. Ta2O5 layers 3 and Al2O3 layers 4 are alternately and repeatedly laminated thereon through a high frequency sputtering method. The laminated dielectric is of four or more-layered structure, and it is preferable that it is of 18 or more-layered structure. As high permittivity dielectric material coexists with high-breakdown strength.low leakage current dielectric material in the obtained thin film dielectric, the obtained thin film dielectric becomes higher in permittivity than the thin film which contains only high-breakdown strength.low leakage current dielectric material. The thin film dielectric is more enhanced in breakdown strength and lessened in leakage current as compared with the thin film dielectric which contains only high permittivity dielectric material. Therefore, when a thin film dielectric of this design is applied to an EL element, the EL element can be enhanced in luminance and lowered in driving voltage.