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    • 6. 发明专利
    • SEMICONDUCTOR LASER ELEMENT
    • JPS57141987A
    • 1982-09-02
    • JP2790881
    • 1981-02-26
    • SHARP KK
    • HAYAKAWA TOSHIROUTAKAGI TOSHIKIMIOOTSUKA NAOTAKA
    • H01S5/00H01S5/22
    • PURPOSE:To suppress non-light emitting recombination of carriers through a deep level and to stabilize the long period driving of the element without joining an N type layer having the deep level to an active layer, by constituting all double heterogenuous junction planes by P type clad layers holding active layers. CONSTITUTION:On an N type GaAs substrate 2; a Te doped, N type, Ga0.45 Al0.55As clad layer 13; a Zn doped, P type, Ga0.5Al0.5As clad layer 14; a Zn doped, P type, Ga0.8Al0.2As active layer 15; a Zn doped, P type Ga0.5Al0.5As clad layer 16; and a Ge doped, P type GaAs cap layer 6 are laminated; and they are continuously grown epitaxially in a liquid phase. An Al2O3 film 7 is deposited on the entire surface to obtain an oxide film stripe structure. Then a window 9 is provided. A P side electrode 8 is deposited on the exposed layer 6 and on the film 7. An N side electrode 1 is formed on the badk surface of the substrate 2. Thus the P-N junction is formed at the interface between the N type clad layer 13 and the P type clad layer 14, the carriers are inputted into the active layer 15, and the laser operation is performed.
    • 7. 发明专利
    • SEMICONDUCTOR LASER ELEMENT
    • JPS57103385A
    • 1982-06-26
    • JP18009080
    • 1980-12-18
    • SHARP KK
    • HAYAKAWA TOSHIROUTAKAGI TOSHIKIMIOOTSUKA NAOTAKA
    • H01L33/12H01L33/14H01L33/24H01L33/30H01S5/00H01S5/223H01S5/24
    • PURPOSE:To stabilize the operation of the laser element of double heterostructure of Ga1-xAlxAs and to prolong the lifetime thereof by interposing a buffer layer with no added Te between an activated layer and a clad layer of added Te. CONSTITUTION:An N type GaAs current restricting layer 22 is formed on a P type GaAs substrate 21, a V shaped groove 27 is provided by applying anisotropic etching thereto and a P type Ga0.62Al0.28As activated layer 24 with added Ge is laid on a P type Ga0.45Al0.55As clad layer 23 with Zn added whereby the crystallinity and flatness of the activated layer are improved. Next, an N type Ga0.45Al0.35As clad layer 25 with Te added is grown through the intermediary of an N type Ga0.82Al0.18As buffer layer 30 with Si added, which contains no Te, and the N type clad layer containing defects caused by Te and the activated layer promoting deterioration by re-connection of an electronic positive hole are separated from each other, whereby the deterioration is prevented. Then, an N type GaAs cap layer 26 with Te added and electrodes 1 and 8 are laminated and thereby the device is completed. The thickness of the activated layer 24 and of the buffer layer 30 is made maximum in the center of the V shaped groove and thus the light in the layer 24 is led effectively to the central part of the device.