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    • 1. 发明专利
    • Circuit substrate device
    • 电路基板装置
    • JP2011193025A
    • 2011-09-29
    • JP2011129102
    • 2011-06-09
    • Sanyo Electric Co Ltd三洋電機株式会社
    • SAWAI TETSUOIMAOKA SHUNICHIYAMAGUCHI TAKESHISAIDA ATSUSHI
    • H01F27/00H01F17/00H01L23/12H01P3/08
    • PROBLEM TO BE SOLVED: To propose a circuit board device which suppresses generation of electromagnetic fields and meets the requirement for size reduction. SOLUTION: In a circuit board device 100, a first wiring layer 110 has a first inductor 12 and a second inductor 14. A dielectric layer 115 has a first via 70 and a second via 72, each electrically connected to a first inductor 12 and a second inductor 14. A second wiring layer 120 has a bridge wiring line 30, which electrically connects the first via 70 to the second via 72, and a conductor pattern 50 which is formed around a bridge wiring line 30 and has outer edges at positions beyond the outer edges of a first wiring pattern and a second wiring pattern in the first wiring layer 110. A bridge wiring line 30 functions as a coplanar line and suppresses the occurrence of electromagnetic fields. COPYRIGHT: (C)2011,JPO&INPIT
    • 要解决的问题:提出一种抑制电磁场产生并满足减小尺寸要求的电路板装置。 解决方案:在电路板装置100中,第一布线层110具有第一电感器12和第二电感器14.电介质层115具有第一通孔70和第二通孔72,第一通孔70和第二通孔72电连接到第一电感器 12和第二电感器14.第二布线层120具有将第一通孔70电连接到第二通孔72的桥接布线30和形成在桥接布线30周围的导体图案50,并且具有外边缘 在第一布线层110中的第一布线图案和第二布线图案的外边缘之外的位置处。桥接布线30用作共面线并抑制电磁场的发生。 版权所有(C)2011,JPO&INPIT
    • 5. 发明专利
    • AMPLIFIER AND COMMUNICATION EQUIPMENT
    • JPH08148953A
    • 1996-06-07
    • JP28230794
    • 1994-11-16
    • SANYO ELECTRIC CO
    • SAWAI TETSUOHONDA KEIICHINISHIDA MASAOUDA NAONORIHIRAI TOSHIKAZUHARADA YASOO
    • H03G3/30H03G3/00H04B1/3822H04B1/40
    • PURPOSE: To provide an amplifier serving for both transmission and reception stably operated in both transmission mode and reception mode with simple circuit constitution by performing feedback from a feedback circuit provided with a feedback resistor whose resistance value is variable and a second active element for the feedback to a first active element for amplification. CONSTITUTION: The feedback from the feedback circuit provided with the feedback resistor R2 whose resistance value is variable and the second active element (FET2) for the feedback is performed to the first active element (FET1) for the amplification. For instance, a resistor is inserted between the drain of the FET1 for the amplification and the gate of the FET2, the feedback is performed by the resistor, gate bias is linked also with a feedback resistor part, a feedback amount is controlled and coping is performed at the time of the reception and at the time of the transmission. That is, at the time of the reception (when the gate bias is deep), the value of the feedback resistor is made large, the feedback amount to the FET1 is reduced and largest possible gain is obtained. At the time of the transmission, the resistance value is made small, the feedback amount is increased and the gain is stabilized small.
    • 10. 发明专利
    • Semiconductor module and portable apparatus
    • 半导体模块和便携式设备
    • JP2008182207A
    • 2008-08-07
    • JP2007323180
    • 2007-12-14
    • Sanyo Electric Co Ltd三洋電機株式会社
    • IMAOKA SHUNICHIOTSUKA KENJISAWAI TETSUO
    • H01L25/065H01L25/07H01L25/18
    • H01L2224/48091H01L2224/48465H01L2224/73265H01L2924/15311H01L2924/30107H01L2924/3025H01L2924/00014H01L2924/00
    • PROBLEM TO BE SOLVED: To provide a semiconductor module which can preferably control the noise propagation between laminated circuit elements.
      SOLUTION: The semiconductor module includes a multi-layer substrate 20, a first circuit element 30 which is mounted on the multi-layer substrate 20, a second circuit element 50 which is laminated on the first circuit element 30, an interposer substrate 10 which is located between the first circuit element 30 and second circuit element 50 and contains an antenna conductor portion 3a, a passive element 40 which is mounted on the multi-layer substrate 20 and is connected with the antenna conductor portion 3a, and a sealing resin layer 70 which seals each elements. The antenna conductor portion 3a is composed of a wiring pattern spirally formed, and both of its ends are connected with the passive element 40 through a bonding wire 60b. Thereby, the antenna conductor portion 3a functions as a loop antenna where the passive element 40 is interposed.
      COPYRIGHT: (C)2008,JPO&INPIT
    • 要解决的问题:提供一种可以优选地控制层压电路元件之间的噪声传播的半导体模块。 解决方案:半导体模块包括多层基板20,安装在多层基板20上的第一电路元件30,层叠在第一电路元件30上的第二电路元件50,插入基板 10,其位于第一电路元件30和第二电路元件50之间,并且包含天线导体部分3a,安装在多层基板20上并与天线导体部分3a连接的无源元件40和密封 树脂层70,其密封每个元件。 天线导体部3a由螺旋形状的布线图形构成,其两端都通过接合线60b与无源元件40连接。 由此,天线导体部3a作为插入无源元件40的环形天线发挥作用。 版权所有(C)2008,JPO&INPIT