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    • 1. 发明专利
    • TRANSMISSION LINE CHANGEOVER SWITCHING CIRCUIT
    • JPH09321829A
    • 1997-12-12
    • JP15292196
    • 1996-05-27
    • SANYO ELECTRIC CO
    • HIRAI TOSHIKAZUUDA NAONORIHONDA KEIICHISAWAI TETSUOHARADA YASOO
    • H01P1/15H03K17/693H04B1/44H04L29/14
    • PROBLEM TO BE SOLVED: To improve the element separation characteristic between two transmission lines and to make a device using the circuit small. SOLUTION: Field effect transistors(FETs) 1, 4 are conductive and FETs 2, 4 are nonconductive in the case of reception, a reception signal S1 (frequency f1) reaches a reception terminal RX from an input output terminal (RC) to a transmission line 1 and the capacitance of capacitors C1, C3 is set so that a resonance frequency of a bypass circuit (resonance circuit consisting of the FET4, the C1, C3, and a bonding wire L4) to bypass a very small signal S1 given to a transmission line 2 to a ground terminal G is in matching with the frequency f1 of the signal S1 in the case of reception. The conduction of the FETs is inverted in the case of transmission to that of the reception, a transmission signal S2 (frequency f2) reaches the terminal RC from a transmission terminal (TX) via the transmission line 2, and the capacitance of the capacitors C1, C2 is set so that the resonance frequency of a bypass circuit (resonance circuit consisting of the FET3, the C1, C3, and the bonding wire L4) to bypass a very small signal S2 given to the transmission line 1 to the terminal G is in matching with the frequency f2 of a very small signal S2 given to the transmission line 1. As a result, the isolation characteristic between the transmission lines 1, 2 in the case of the transmission and reception is improved.
    • 3. 发明专利
    • CONDUCTOR CONNECTING METHOD AND CIRCUIT DEVICE
    • JPH09102542A
    • 1997-04-15
    • JP26135695
    • 1995-10-09
    • SANYO ELECTRIC CO
    • BABA SEIICHINAGAMI KIMIHIKOSAWADA MINORUHARADA YASOO
    • H01L21/3205H01L21/768H01L23/522
    • PROBLEM TO BE SOLVED: To improve the reliability of interlayer connections between a conductor provided on one insulating resin layer and another conductor provided on another insulating resin layer or between one conductor provided on a substrate and another conductor provided on an insulating resin layer with a connecting conductor which is formed across the upper surface of the uppermost insulating resin layer. SOLUTION: Insulating resin layers 2, 3, 4, and 5 composed of polyimide layers are successively formed on a GaAs substrate 1 and Ti/Au conductor patterns 6, 7, 8, and 9 are respectively provided on the substrate 1 and resin layers 2, 3, and 4 at different positions. The patterns 6 and 7 are electrically connected to each other with a Ti/Au connecting conductor 10 formed through the resin layers 2, 3, 4, and 5, across the upper surface of the layer 5, and through the layers 5, 4, and 3. The patterns 8 and 9 are electrically connected to each other with a Ti/Au connecting conductor formed through the resin layer 5, across the upper surface of the layer 5, and through the layers 5 and 4. Therefore, a connecting method by which highly reliable interlayer connections can be obtained can be realized.