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1. 发明专利

JP2009212270A Semiconductor device 审中-公开
标题翻译：半导体器件
公开(公告)号：JP2009212270A
公开(公告)日：2009-09-17
申请号：JP2008053045
申请日：2008-03-04
申请人： Panasonic Corp , パナソニック株式会社
发明人： MARUMO SHINYA , TAKAYAMA YOSHIKI , NISHIO TETSUSHI
IPC分类号： H01L23/12 , H01L27/14 , H01L31/10
CPC分类号： H01L2224/45144 , H01L2224/48091 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To prevent the debonding of a seal resin concerning a semiconductor device. SOLUTION: The semiconductor device 12 includes: an insulating substrate 1 formed with a wiring part 4 for an external connection; a frame 2 formed in a fringe portion on a surface of the insulating substrate 1; a semiconductor element 6 which is bonded to an more inner side than the frame 2 on the surface of the insulating substrate 1 and is electrically connected to the wiring part 4 through a metal narrow line 7; a protection body 9 bonded to a surface of the semiconductor element 6; and a seal resin 10 covering the metal narrow line 7. An exposure face 4a coming into contact with the seal resin 10 is present in the wiring part 4, and a gold plating part 11 is formed on a part of the exposure face 4a. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了防止关于半导体器件的密封树脂的脱粘。解决方案：半导体器件12包括：形成有用于外部连接的布线部分4的绝缘基板1; 形成在绝缘基板1的表面上的边缘部的框架2; 半导体元件6，其在绝缘基板1的表面上与框架2的内侧接合，并且通过金属窄线7电连接到布线部4; 接合到半导体元件6的表面的保护体9; 以及覆盖金属窄线7的密封树脂10.在布线部4中存在与密封树脂10接触的曝光面4a，在曝光面4a的一部分上形成镀金部11。版权所有（C）2009，JPO＆INPIT

2. 发明专利

JP2013122937A Optical semiconductor device 审中-公开
标题翻译：光学半导体器件
公开(公告)号：JP2013122937A
公开(公告)日：2013-06-20
申请号：JP2010072338
申请日：2010-03-26
申请人： Panasonic Corp , パナソニック株式会社
发明人： TAKAYAMA YOSHIKI
IPC分类号： H01L31/02
CPC分类号： H01L31/0203 , H01L27/14618 , H01L2224/16145 , H01L2224/73265 , H01L2224/48091 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide an optical semiconductor device which prevents unnecessary incident light and reflection light from an end face of a transparent member to an optical element part, which easily achieves downsizing and high functionality, and which has stable optical characteristics.SOLUTION: An optical semiconductor device comprises: a first semiconductor chip 1; a second semiconductor chip 2 which is held on the first semiconductor ship 1 and whose upper part has an optical element 3; and a transparent member 6 fastened on the second semiconductor chip 2 so as to cover the optical element 3. An outer edge of the transparent member 6 lies inside an edge of the first semiconductor chip 1 and outside an edge of the second semiconductor chip 2.
摘要翻译：解决的问题：提供一种光学半导体装置，其防止从透明构件的端面到光学元件部分的不必要的入射光和反射光，其容易实现小型化和高功能性，并且具有稳定的光学特性。解决方案：一种光学半导体器件包括：第一半导体芯片1; 保持在第一半导体载体1上并且其上部具有光学元件3的第二半导体芯片2; 以及固定在第二半导体芯片2上以覆盖光学元件3的透明构件6.透明构件6的外边缘位于第一半导体芯片1的边缘的内侧并且位于第二半导体芯片2的边缘的外侧。版权所有（C）2013，JPO＆INPIT

3. 发明专利

JP2010192866A Optical device, solid-state imaging device, and optical device manufacturing method 审中-公开
标题翻译：光学装置，固态成像装置和光学装置制造方法
公开(公告)号：JP2010192866A
公开(公告)日：2010-09-02
申请号：JP2009208725
申请日：2009-09-09
申请人： Panasonic Corp , パナソニック株式会社
发明人： TAKAYAMA YOSHIKI , MARUO TETSUMASA
IPC分类号： H01L27/14 , H01L23/28
CPC分类号： H01L27/14618 , H01L2224/45144 , H01L2224/48091 , H01L2924/01077 , H01L2924/01079 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To prevent the separation of a recessed package from an interface of a light shielding resin due to thermal stress in an optical device having a structure in which an optical element, to which a transparent member is directly fixed, is housed by being fixed to the bottom of the recessed package, and the light shielding resin is filled into the recessed package.
SOLUTION: An optical device 1 includes: an optical element 9 having a light receiving unit 10 on an upper surface thereof; a transparent member 14 stacked on the upper surface of the optical element 9 to cover the light receiving unit 10; a box body 2 that has a bottom wall 3, sidewalls 4 protruding from outer edges of the bottom wall 3, and a through-hole 8 passing through the bottom wall 3, and houses the optical element 9 and a transparent member 14 in a region partitioned by the bottom wall 3 and sidewalls 4; and a sealing member 16 that is filled into a region partitioned by the bottom wall 3 and sidewalls 4 of the box body 2 and into the through-hole 8. The bottom wall 3 of the box body 2 is partitioned into a central region for holding the optical element 9 and a peripheral region formed outside the central region. The through-hole 8 is formed in the peripheral region.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：解决的问题为了防止在具有直接固定有透明构件的光学元件的结构的光学装置中由于热应力而使凹陷封装与遮光树脂的界面分离，通过固定到凹陷封装的底部而被容纳，并且遮光树脂被填充到凹形封装中。解决方案：光学装置1包括：光学元件9，其上表面具有光接收单元10; 透明构件14，堆叠在光学元件9的上表面上以覆盖光接收单元10; 具有底壁3的箱体2，从底壁3的外边缘突出的侧壁4和穿过底壁3的通孔8，并将光学元件9和透明构件14容纳在区域由底壁3和侧壁4隔开; 以及密封构件16，其被填充到由箱体2的底壁3和侧壁4分隔开并进入通孔8的区域中。箱体2的底壁3被分隔成用于保持的中心区域光学元件9和形成在中心区域外部的周边区域。通孔8形成在周边区域中。版权所有（C）2010，JPO＆INPIT

4. 发明专利

JP2009277950A Optical semiconductor device 审中-公开
标题翻译：光学半导体器件
公开(公告)号：JP2009277950A
公开(公告)日：2009-11-26
申请号：JP2008128964
申请日：2008-05-16
申请人： Panasonic Corp , パナソニック株式会社
发明人： TAKAYAMA YOSHIKI
IPC分类号： H01L31/02 , H01L23/28
CPC分类号： H01L31/0203 , H01L24/05 , H01L24/06 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L27/14618 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/0557 , H01L2224/06155 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/10161 , H01L2924/15153 , H01L2924/15192 , H01L2924/181 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： PROBLEM TO BE SOLVED: To provide an optical semiconductor device that prevents a defect in optical characteristics by suppressing sticking matter on a transparent member fixed directly on a semiconductor chip while making the transparent member compact. SOLUTION: The optical semiconductor device has the semiconductor chip 11 having an optical element 12 formed on one surface and the transparent member 13 fixed on the semiconductor chip 11 with a transparent adhesive 25 to cover the optical element 12, and at least one ridge line of a surface of the transparent member 13 which is opposed to the semiconductor chip 11 is formed into a chamfer portion 14 or round portion. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：解决的问题：提供一种光学半导体装置，其通过抑制直接固定在半导体芯片上的透明构件上的粘附物质，同时使透明构件紧凑，从而防止光学特性的缺陷。解决方案：光半导体器件具有半导体芯片11，其具有在一个表面上形成的光学元件12，并且透明构件13用透明粘合剂25固定在半导体芯片11上以覆盖光学元件12，并且至少一个与半导体芯片11相对的透明构件13的表面的脊线形成为倒角部14或圆形部。版权所有（C）2010，JPO＆INPIT

5. 发明专利

JP2009049071A Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：JP2009049071A
公开(公告)日：2009-03-05
申请号：JP2007211610
申请日：2007-08-15
申请人： Panasonic Corp , パナソニック株式会社
发明人： TAKAYAMA YOSHIKI
IPC分类号： H01L23/12 , H01L23/02 , H01L23/04 , H01L27/14
CPC分类号： H01L23/49805 , H01L2924/0002 , H05K3/3442 , H05K2201/09181 , H05K2201/10727 , Y02P70/613 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To secure sufficient reliability in solder mounting of a miniaturized semiconductor device to a mounting board, even in the case of a miniaturized semiconductor device.
SOLUTION: The height of the side face terminal at each corner is made higher than the height of the side face terminal 4 on each side. Thereby, even when the height of the side face terminal 4 on each side is lowered in comparison with a conventional one by miniaturization of the semiconductor device or the like, a solder filet 11 greatly affecting reliability can be sufficiently formed between the side face terminal 3 at each corner and the terminal of the mounting board during solder mounting of the device to the mounting board, and reliability in solder mounting of the device to the mounting board can be improved.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：即使在小型半导体器件的情况下，为了确保将小型半导体器件的焊接安装到安装板的足够的可靠性。解决方案：使各侧角处的侧面端子的高度比侧面侧端子4的高度高。由此，即使通过半导体装置等的小型化，与现有的侧面端子4的高度相比，即使侧面端子4的高度下降，也可以在侧面端子3之间充分形成大大影响可靠性的焊料片11 在将装置焊接到安装板的过程中，在安装板的每个角落和端子处，并且可以提高装置对安装板的焊接安装的可靠性。版权所有（C）2009，JPO＆INPIT

6. 发明专利

JP2013098357A Semiconductor device 审中-公开
标题翻译：半导体器件
公开(公告)号：JP2013098357A
公开(公告)日：2013-05-20
申请号：JP2011239983
申请日：2011-11-01
申请人： Panasonic Corp , パナソニック株式会社
发明人： OHIRO MASAHIKO , FUJII EIZO , TAKAYAMA YOSHIKI
IPC分类号： H01L21/60
CPC分类号： H01L24/73 , H01L2224/32225 , H01L2224/48 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/48471 , H01L2224/48479 , H01L2224/4848 , H01L2224/49 , H01L2224/49109 , H01L2224/49175 , H01L2224/49431 , H01L2224/49433 , H01L2224/73265 , H01L2224/78 , H01L2224/78301 , H01L2224/85 , H01L2224/85051 , H01L2224/85181 , H01L2224/85186 , H01L2224/85986 , H01L2924/00014 , H01L2924/15174 , H01L2924/00012 , H01L2924/00 , H01L2224/4554
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device which allows wires to be connected stably in a less connection area on a slanted part, on a via and on a via cover, which are considered as an unavailable area for wire bonding.SOLUTION: A semiconductor device comprises: a package including an opening, a die pad provided in the opening, a slanted part provided around the opening and an inner lead; a semiconductor chip including a first electrode pad and mounted on the die pad; and a first wire connecting the inner lead and the first electrode pad. At least a part of the inner lead is arranged on the slanted part and a first component on which the first wire is connected is arranged on the inner lead.
摘要翻译：要解决的问题：提供一种半导体器件，其允许电线在倾斜部分的较小连接区域，通孔和通孔盖上稳定地连接，这被认为是用于引线接合的不可用区域。解决方案：半导体器件包括：包括开口的封装，设置在开口中的管芯焊盘，设置在开口周围的倾斜部分和内部引线; 包括第一电极焊盘并安装在管芯焊盘上的半导体芯片; 以及连接内引线和第一电极焊盘的第一线。内引线的至少一部分布置在倾斜部分上，并且连接第一线的第一部件布置在内引线上。版权所有（C）2013，JPO＆INPIT

7. 发明专利

JP2010273087A Semiconductor device and method for manufacturing the same 审中-公开
标题翻译：半导体器件及其制造方法
公开(公告)号：JP2010273087A
公开(公告)日：2010-12-02
申请号：JP2009122961
申请日：2009-05-21
申请人： Panasonic Corp , パナソニック株式会社
发明人： MARUO TETSUMASA , NISHIO TETSUSHI , TAKAYAMA YOSHIKI
IPC分类号： H01L23/02 , H01L27/14 , H01L27/15 , H01L31/02 , H01L33/52 , H01L33/62 , H04N5/335
CPC分类号： H01L2224/45144 , H01L2224/48091 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To solve the problem that there is the case that deterioration of optical characteristics is caused in a semiconductor device having a transparent member adhered to an optical area of a semiconductor element.
SOLUTION: In the semiconductor device, the semiconductor element 4 is provided on the top surface of a substrate 3, and the semiconductor element 4 is electrically connected to the substrate 3 via a conductive thin line 5. The optical area is formed on the top surface of the semiconductor element 4, and a first transparent member 1 is adhered to the optical area via transparent adhesives 6. A second transparent member 2 is adhered on the top surface of the first transparent member 1 via the transparent adhesives 6, and the first transparent member 1 and the second transparent member 2 each consist of the same material.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：解决的问题为了解决在具有粘附到半导体元件的光学区域的透明构件的半导体器件中引起光学特性劣化的问题。解决方案：在半导体器件中，半导体元件4设置在基板3的顶表面上，并且半导体元件4经由导电细线5电连接到基板3.光学区域形成在半导体元件4的顶表面和第一透明构件1通过透明粘合剂6粘附到光学区域。第二透明构件2通过透明粘合剂6粘附在第一透明构件1的顶表面上，并且第一透明构件1和第二透明构件2各自由相同的材料构成。版权所有（C）2011，JPO＆INPIT

8. 发明专利

JP2009266905A Semiconductor device 审中-公开
标题翻译：半导体器件
公开(公告)号：JP2009266905A
公开(公告)日：2009-11-12
申请号：JP2008111924
申请日：2008-04-23
申请人： Panasonic Corp , パナソニック株式会社
发明人： OHIRO MASAHIKO , TAKAYAMA YOSHIKI
IPC分类号： H01L23/12
CPC分类号： H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/49433 , H01L2224/73265 , H01L2224/78301 , H01L2224/85181 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device that achieves multi-pin formation even if being small while securing bonding strength. SOLUTION: The semiconductor device is provided with a semiconductor chip 1, a package 2 (a base) that has a mounting part, mounted with the semiconductor chip 1, and a plurality of conductors 4 in which internal terminals 8 are arranged oppositely to each other on the outer periphery of the semiconductor chip 1, and each wire 5 that connects between each electrode pad 3 of the semiconductor chip 1 and each internal terminal 8 of the conductors 4. The internal terminal 8 is formed into a shape that the chip side facing the semiconductor chip 1 is expanded. By this, it is possible to surely put a second bond on the internal terminal 8 regardless of the direction of the wire 5 extended from the electrode pad 3, thereby ensuring bonding strength. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供即使在保持接合强度的同时实现多针形成的半导体器件。解决方案：半导体器件设置有半导体芯片1，具有安装部分的封装2（基座），安装有半导体芯片1和多个导体4，其中内部端子8相对布置并且连接在半导体芯片1的每个电极焊盘3和导体4的每个内部端子8之间的每个导线5形成为形状为：半导体芯片1的外周面面向半导体芯片1的芯片侧扩大。由此，无论从电极焊盘3延伸的线5的方向如何，都可以将内部端子8确定地进行第二接合，从而确保接合强度。版权所有（C）2010，JPO＆INPIT

9. 发明专利

JP2008305972A Optical device, its manufacturing method, camera module using optical device and electronic apparatus loading camera module 审中-公开
标题翻译：光学装置及其制造方法，使用光学装置的摄像机模块和电子装置装载相机模块
公开(公告)号：JP2008305972A
公开(公告)日：2008-12-18
申请号：JP2007151739
申请日：2007-06-07
申请人： Panasonic Corp , パナソニック株式会社
发明人： NANO MASANORI , TAKAYAMA YOSHIKI , FUKUDA TOSHIYUKI
IPC分类号： H01L27/14 , H04N5/335 , H04N5/369
CPC分类号： H01L27/14625 , H01L27/14618 , H01L27/14627 , H01L27/14632 , H01L2224/05001 , H01L2224/05009 , H01L2224/05567 , H01L2224/13 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48227 , H01L2224/48464 , H01L2924/00014 , H04N5/2257 , H01L2224/05599 , H01L2224/05099
摘要： PROBLEM TO BE SOLVED: To provide a small and thin optical device with sufficient reliability without affecting a function of a micro-lens even in work for wiping off attachment such as dust. SOLUTION: The optical device is provided with a photodetector chip having an active region 12 which is formed on a main face of a substrate 11 and in which a plurality of photodetectors are arranged, a circuit region 15 arranged on an outer peripheral part of the active region 12, a through conductor 19 disposed in a thickness direction of the substrate 11, and an external connection terminal 18 installed on a rear face confronted with the main face in the substrate 11 by connecting it to the through conductor 19, with a micro-lens 14 arranged on the active region 12 in accordance with the photodetector, a flattening film 22 which is formed on a main face of the photodetector chip so that it covers the micro-lens 14 and flattens unevenness of the micro-lens 14 and is formed of a transparent member whose refractive index is smaller than the micro-lens 14, and a transparent protection film 23 which is formed on the flattening film 22 and is formed of a transparent inorganic material transparent to visible light. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供足够可靠性的小而薄的光学装置，而不影响微透镜的功能，即使在擦除诸如灰尘的附件的工作中也是如此。解决方案：光学装置设置有具有有源区12的光电检测器芯片，该有源区12形成在基板11的主面上并且布置有多个光电检测器，电路区域15布置在外周部分有源区域12，沿基板11的厚度方向配置的贯通导体19，以及外部连接端子18，该外部连接端子18通过将基板11的主面与通孔导体19连接而安装在与基板11的主面相对的背面上，根据光电检测器布置在有源区域12上的微透镜14，形成在光电检测器芯片的主面上的平坦化膜22，使得其覆盖微透镜14并使微透镜14的凹凸变平坦并且由折射率小于微透镜14的透明构件形成，并且形成在平坦化膜22上并由透明无机材料t形成的透明保护膜23 透明至可见光。版权所有（C）2009，JPO＆INPIT

10. 发明专利

JP2012064837A Semiconductor module 审中-公开
标题翻译：半导体模块
公开(公告)号：JP2012064837A
公开(公告)日：2012-03-29
申请号：JP2010208973
申请日：2010-09-17
申请人： Panasonic Corp , パナソニック株式会社
发明人： TAKAYAMA YOSHIKI , MARUO TETSUMASA
IPC分类号： H01L27/14 , H01L23/02 , H01L25/04 , H01L25/18 , H04N5/357 , H04N5/369
CPC分类号： H01L2224/05554 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2924/16151 , H01L2924/16152 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To minimize degradation of image quality while attaining compaction and thinning of a semiconductor module encasing a semiconductor chip in which a photoelectric conversion part is formed, and a semiconductor chip in which a drive circuit for driving the photoelectric conversion part is formed.SOLUTION: The semiconductor module comprises: a semiconductor chip 101 in which a photoelectric conversion region 118 is formed; a semiconductor chip 102 provided in a region on the semiconductor chip 101 excepting the photoelectric conversion region 118 and in which a drive circuit for driving the photoelectric conversion part constituting the photoelectric conversion region 118 is formed; a package basic body 103 encasing the semiconductor chips 101 and 102 and having an opening 112 formed at least in a region facing the photoelectric conversion region 118; a translucent cover 104 which closes the opening 112 in a state where the semiconductor chips 101 and 102 are encased; and a reflection inhibition wall 109 which inhibits the light incident toward the semiconductor chip 102 from being reflected to the photoelectric conversion region 118.
摘要翻译：要解决的问题：为了最小化图像质量的劣化，同时实现包围其中形成光电转换部件的半导体芯片的半导体模块的压实和变薄，以及半导体芯片，其中驱动光电转换的驱动电路部分形成。解决方案：半导体模块包括：形成有光电转换区域118的半导体芯片101; 设置在除了光电转换区域118之外的半导体芯片101的区域中形成驱动构成光电转换区域118的光电转换部的驱动电路的半导体芯片102; 封装基体103，封装半导体芯片101和102，并且至少形成在面向光电转换区域118的区域中的开口112; 在半导体芯片101和102被封装的状态下关闭开口112的半透明盖104; 以及抑制入射到半导体芯片102的光被反射到光电转换区域118的反射抑制壁109.（C）2012，JPO＆INPIT

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