专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2011151412A Semiconductor device 审中-公开
标题翻译：半导体器件
公开(公告)号：JP2011151412A
公开(公告)日：2011-08-04
申请号：JP2011082717
申请日：2011-04-04
申请人： Panasonic Corp , パナソニック株式会社
发明人： NOSE KOJI , FUJII EIZO
IPC分类号： H01L23/00 , H01L23/02 , H01L23/26 , H01L27/14 , H01L31/02
CPC分类号： H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/01322 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To easily and surely prevent flare and dew condensation in a light-receiving semiconductor device. SOLUTION: A semiconductor device 10 comprises: a semiconductor chip 11 having a light receiving element; an open package 12 which has the semiconductor chip 11 fixed to a chip holding part 12a provided on a bottom thereof and having a recessed cross-section, by a fixing material 13; a light-shielding and dehumidifying member 16 which is fitted along the inside of the package 12 and has a window part 16a in a region facing a light receiving region of the semiconductor chip 11 and has a fringe part 16b formed by bending a peripheral edge of the window part 16a toward the bottom and is given light shielding and dehumidifying properties; and a plate-like light-transmissive member 18 fixed to at least an upper end part of the package 12 by a sealant 17. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了容易且可靠地防止光接收半导体器件中的闪光和结露。解决方案：半导体器件10包括：具有光接收元件的半导体芯片11; 通过固定材料13将半导体芯片11固定到设置在其底部并具有凹入截面的芯片保持部分12a的开放封装12; 沿着封装12的内侧嵌合的遮光除湿构件16，在与半导体芯片11的光接收区域相对的区域中具有窗口部16a，并具有通过使半导体芯片11的周边部弯折而形成的边缘部16b 窗口部分16a朝向底部并具有遮光和除湿特性; 以及通过密封剂17固定到包装体12的至少上端部的板状透光性部件18.权利要求（C）2011，JPO＆INPIT

2. 发明专利

JP2013098357A Semiconductor device 审中-公开
标题翻译：半导体器件
公开(公告)号：JP2013098357A
公开(公告)日：2013-05-20
申请号：JP2011239983
申请日：2011-11-01
申请人： Panasonic Corp , パナソニック株式会社
发明人： OHIRO MASAHIKO , FUJII EIZO , TAKAYAMA YOSHIKI
IPC分类号： H01L21/60
CPC分类号： H01L24/73 , H01L2224/32225 , H01L2224/48 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/48471 , H01L2224/48479 , H01L2224/4848 , H01L2224/49 , H01L2224/49109 , H01L2224/49175 , H01L2224/49431 , H01L2224/49433 , H01L2224/73265 , H01L2224/78 , H01L2224/78301 , H01L2224/85 , H01L2224/85051 , H01L2224/85181 , H01L2224/85186 , H01L2224/85986 , H01L2924/00014 , H01L2924/15174 , H01L2924/00012 , H01L2924/00 , H01L2224/4554
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device which allows wires to be connected stably in a less connection area on a slanted part, on a via and on a via cover, which are considered as an unavailable area for wire bonding.SOLUTION: A semiconductor device comprises: a package including an opening, a die pad provided in the opening, a slanted part provided around the opening and an inner lead; a semiconductor chip including a first electrode pad and mounted on the die pad; and a first wire connecting the inner lead and the first electrode pad. At least a part of the inner lead is arranged on the slanted part and a first component on which the first wire is connected is arranged on the inner lead.
摘要翻译：要解决的问题：提供一种半导体器件，其允许电线在倾斜部分的较小连接区域，通孔和通孔盖上稳定地连接，这被认为是用于引线接合的不可用区域。解决方案：半导体器件包括：包括开口的封装，设置在开口中的管芯焊盘，设置在开口周围的倾斜部分和内部引线; 包括第一电极焊盘并安装在管芯焊盘上的半导体芯片; 以及连接内引线和第一电极焊盘的第一线。内引线的至少一部分布置在倾斜部分上，并且连接第一线的第一部件布置在内引线上。版权所有（C）2013，JPO＆INPIT

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式