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1. 发明专利

JP2011151220A Flow soldering method 审中-公开
标题翻译：流动焊接方法
公开(公告)号：JP2011151220A
公开(公告)日：2011-08-04
申请号：JP2010011606
申请日：2010-01-22
申请人： Panasonic Corp , パナソニック株式会社
发明人： SUETSUGU KENICHIRO , NAKATANI MASAAKI , KISHI ARATA
IPC分类号： H05K3/34 , B23K1/00 , B23K1/08 , B23K1/20 , B23K3/06 , B23K35/22 , B23K35/26 , B23K35/363 , B23K101/42 , C22C13/00 , H05K3/26
摘要： PROBLEM TO BE SOLVED: To solve a problem wherein, for a liquid flux reduced in the amount of a VOC or not using the same, the conventional actual soldering achievement can not be applied to it, because it uses water difficult to evaporate relative to alcohol, and the water content cannot be perfectly removed before input to a jet-flow solder tank, under the pre-heating temperature of the conventional flux.
SOLUTION: This flow soldering method is performed as follows. A land 12b of a through-hole of a board 8 and a land 12a of a component mounting surface 10 are irradiated with plasma 1; a metal mask 14 is installed on a soldering surface 11 of the through-hole 9; solder paste 15 is applied through the metal mask 14 by a solder dispenser 16; thereafter an insertion component 17 is mounted from the component mounting surface 10 being a surface opposite to the soldering surface 11 of the board 8; and the board 8 is soldered in a jet-flow solder tank 20.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：解决的问题为了解决这样一个问题，对于使用这种液体量的VOC量减少的液体通量，由于使用难以蒸发的水，所以不能应用传统的实际焊接成果相对于醇，并且在常规助熔剂的预热温度下，在输入到喷射焊料槽之前，水分含量不能完全去除。
解决方案：该流焊方法如下进行。用等离子体1照射板8的通孔的焊盘12b和部件安装表面10的台阶12a; 金属掩模14安装在通孔9的焊接表面11上; 焊料膏15通过焊料分配器16施加在金属掩模14上; 之后，从与板8的焊接面11相反的面的部件安装面10安装插入部件17。并且板8被焊接在喷射流焊料槽20中。版权所有：（C）2011，JPO＆INPIT

2. 发明专利

JP2011253968A Drier and flow soldering line 审中-公开
标题翻译： DRIER和流动焊接线
公开(公告)号：JP2011253968A
公开(公告)日：2011-12-15
申请号：JP2010127380
申请日：2010-06-03
申请人： Panasonic Corp , パナソニック株式会社
发明人： NAKATANI KIMIAKI , SUETSUGU KENICHIRO , KISHI ARATA
IPC分类号： H05K3/34 , B23K1/00 , B23K1/08 , B23K31/02 , B23K101/42 , F27B9/10
摘要： PROBLEM TO BE SOLVED: To provide a drier, along with a flow soldering line, for properly drying an electronic circuit board that uses low VOC flux.SOLUTION: A wing system unit 8 in which a first wing unit 12 and a second wing unit are coupled is installed at a hot air flowing-in opening 5a of a chamber part 1. The first wing unit 12 and the second wing unit 13 include a plurality of plate-like blades inclined against a plane orthogonal to the flowing-in direction of a hot air. With regard to the inclination angle, a blade arranged closer to the central portion of the hot air flowing-in opening has a larger angle, and a blade arranged farther away from the central portion of the hot air flowing-in opening has a smaller angle. The dispersion direction of the hot air caused by the first wing unit intersects with the dispersion direction of the hot air caused by the second wing unit.
摘要翻译：要解决的问题：为了提供干燥器以及流动焊接线，以适当地干燥使用低VOC通量的电子电路板。解决方案：其中联接有第一翼单元12和第二翼单元的翼系统单元8安装在腔室部分1的热空气流入口5a中。第一翼单元12和第二翼单元13包括与热空气的流入方向垂直的平面倾斜的多个板状叶片。关于倾斜角度，更靠近热空气流入口的中心部分设置的叶片具有较大的角度，并且布置得更远离热空气流入口的中心部分的叶片具有较小的角度。由第一翼单元引起的热空气的分散方向与由第二翼单元引起的热空气的分散方向相交。版权所有（C）2012，JPO＆INPIT

3. 发明专利

JP2011110563A Water-soluble flux and method for mounting electronic circuit board using the same 审中-公开
标题翻译：用于安装电子电路板的水溶性通量和方法
公开(公告)号：JP2011110563A
公开(公告)日：2011-06-09
申请号：JP2009267106
申请日：2009-11-25
申请人： Panasonic Corp , パナソニック株式会社
发明人： KISHI ARATA , NAKATANI MASAAKI , SUETSUGU KENICHIRO
IPC分类号： B23K35/363 , B23K1/00 , B23K101/42 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a water-soluble flux that is a water-soluble flux compound for soldering, wherein, even in a flow soldering, no odor of amine or ammonia is perceived and soldering characteristics is hardly damaged.
SOLUTION: There is provided a water-soluble flux for soldering which causes no perception of amine or ammonia odor while securing the soldering characteristics and joining reliability, and can be achieved by employing a water-soluble flux for soldering which is characterized by having a compound in which primary, secondary and tertiary amines having at least one hydroxyl group in a 2-10C hydrocarbon are added to a carboxyl group-containing rosin or an activator. The method for mounting an electronic circuit substrate using the same is also provided.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供作为用于焊接的水溶性助焊剂化合物的水溶性助熔剂，其中即使在流动焊接中，也不会感觉到胺或氨的气味，并且焊接特性几乎不被损坏。解决方案：提供了一种用于焊接的水溶性助焊剂，其不会导致胺或氨气味的感觉，同时确保焊接特性和接合可靠性，并且可以通过使用用于焊接的水溶性焊剂来实现，其特征在于具有其中在2-10℃烃中具有至少一个羟基的伯，仲和叔胺加入到含羧基的松香或活化剂中的化合物。还提供了使用其的电子电路基板的安装方法。版权所有（C）2011，JPO＆INPIT

4. 发明专利

JP2010109041A Flow soldering method 审中-公开
标题翻译：流动焊接方法
公开(公告)号：JP2010109041A
公开(公告)日：2010-05-13
申请号：JP2008277950
申请日：2008-10-29
申请人： Panasonic Corp , パナソニック株式会社
发明人： SUETSUGU KENICHIRO , NAKATANI MASAAKI , KISHI ARATA
IPC分类号： H05K3/34 , B23K1/08 , B23K35/26 , B23K35/363 , B23K101/42 , C22C13/00
摘要： PROBLEM TO BE SOLVED: To solve a problem that it is impossible to refer to the conventional soldering achievements of the liquid flux having reduced amount of VOC or not using the same, because this liquid flux uses water that is not easier in evaporation than alcohol and cannot perfectly remove water content before supply to an injection solder vessel under the existing pre-heating temperature of the flux.
SOLUTION: In this flow soldering method, the soldering process is conducted within the injection solder vessel by loading an inserting component after low VOC soldering paste is printed by utilizing the low VOC (Volatile Organic Compounds) solder paste and setting a metal mask 5 having a shape of opening where the solder is not printed at the central area of a through-hole 2 in a through-hole land electrode of the soldering surface 4 of the substrate 1 for flow.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题为了解决不可能参照使用其减少VOC量的液体焊剂的传统焊接成果的问题，因为该液体焊剂使用不容易蒸发的水而不是在现有的助焊剂预热温度下，在供给到注射焊料容器之前，不能完全去除含水量。
解决方案：在这种流动焊接方法中，通过使用低VOC（挥发性有机化合物）焊膏打印低VOC焊膏之后，通过加载插入部件，在注射焊料容器内进行焊接工艺，并且设置金属掩模在基板1的焊接表面4的通孔焊盘电极中，在通孔2的中心区域处没有印刷焊料的开口形状5。版权所有（C）2010，JPO＆INPIT

5. 发明专利

JP2009088573A Joint structure and electronic circuit board 有权
标题翻译：联合结构与电子电路板
公开(公告)号：JP2009088573A
公开(公告)日：2009-04-23
申请号：JP2009014498
申请日：2009-01-26
申请人： Panasonic Corp , パナソニック株式会社
发明人： SUETSUGU KENICHIRO , KOSHI MASUO , TODOROKI KENICHIRO , HIBINO TOSHIHARU , TAKANO HIROAKI , NAKADA MIKIYA , MAEDA YUKIO
IPC分类号： H05K3/34 , H05K1/00 , H05K1/11 , H05K3/40
CPC分类号： H05K3/3447 , H05K1/0293 , H05K1/115 , H05K1/116 , H05K3/3452 , H05K3/3463 , H05K3/4092 , H05K2201/0373 , H05K2201/0397 , H05K2201/09663 , H05K2201/0979 , H05K2201/099
摘要： PROBLEM TO BE SOLVED: To effectively reduce occurrence of lift-off, in a joint structure composed by jointing an electronic component to a board by soldering. SOLUTION: This joint structure comprises a board 1 provided with a through-hole 2, a land 3a-3c disposed on the periphery of the through-hole 2, and a lead 5 led out from an electronic part and arranged in the through-hole 2. A fillet for connecting the land 3a-3c with the lead 5 comprises upper and lower fillets 6a and 6b touching the front and rear surface land parts 3a and 3b, respectively, wherein the outer diameter of the upper fillet is not larger than 1.5 times of the diameter of the through-hole. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：通过焊接将电子部件与电路板接合而构成的接合结构中，有效地减少剥离的发生。解决方案：该接头结构包括设置有通孔2的基板1，设置在通孔2的周边的台阶3a-3c，以及从电子部件引出并布置在通孔2中的引线5。用于将焊盘3a-3c与引线5连接的圆角包括分别接触前后表面焊盘部分3a和3b的上部和下部焊盘6a和6b，其中上部焊脚的外径不是大于通孔直径的1.5倍。版权所有（C）2009，JPO＆INPIT

6. 发明专利

JP2009044180A Printed board, electrical appliance, and method for recycling wastes of the same 有权
标题翻译：印刷电路板，电器及其回收废物的方法
公开(公告)号：JP2009044180A
公开(公告)日：2009-02-26
申请号：JP2008272288
申请日：2008-10-22
申请人： Panasonic Corp , パナソニック株式会社
发明人： SUETSUGU KENICHIRO , HIBINO TOSHIHARU , YAMAGUCHI ATSUSHI , HIRANO MASATO
IPC分类号： H05K1/02 , C22B13/00 , C22B25/06 , G06Q50/00 , G06Q50/04 , G06Q50/26 , H05K1/18 , H05K3/00 , H05K3/34 , H05K13/04
CPC分类号： C22B25/06 , C22B13/00 , H01H2009/0077 , H05K1/0266 , H05K1/18 , H05K3/3463 , H05K13/0465 , H05K2201/09936 , H05K2203/178 , Y02P10/214 , Y02P10/228 , Y02P70/611 , Y02P70/613 , Y10T29/49117 , Y10T29/49819 , Y10T29/49821 , Y10T29/49822
摘要： PROBLEM TO BE SOLVED: To provide a printed board or an electrical appliance mounted with parts which facilitate identification whether lead is contained or not, and a method for recycling wastes of the same. SOLUTION: An identification mark indicating no inclusion of lead is attached to a printed board. In the recycling process, a printed board or an electrical appliance is screened by discriminating an article not including lead and an article including lead by an identification mark. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种安装有便于识别是否含铅的部件的印刷电路板或电器，以及用于回收废物的方法。
解决方案：指示不包括铅的识别标记附着在印刷电路板上。在再循环过程中，通过识别标识来区分不包括铅的物品和包括铅的物品来筛选印刷板或电器。版权所有（C）2009，JPO＆INPIT

7. 发明专利

JP2009177137A Soldering apparatus and soldering method 有权
标题翻译：焊接设备和焊接方法
公开(公告)号：JP2009177137A
公开(公告)日：2009-08-06
申请号：JP2008298779
申请日：2008-11-21
申请人： Panasonic Corp , パナソニック株式会社
发明人： KISHI ARATA , NAKATANI MASAAKI , SUETSUGU KENICHIRO
IPC分类号： H05K3/34
摘要： PROBLEM TO BE SOLVED: To easily use a soldering apparatus so that the moisture of flux does not remain in an electronic circuit board before soldering.
SOLUTION: The soldering apparatus 100 includes a conveyor 8 which conveys an electronic circuit board 9, a fluxer 1 which applies a flux having water as a solvent to a surface of the electronic circuit board 9 to be soldered, a first heating device 2 which heats the electronic circuit board 9, a water removal device 7 which removes water attached to the electronic circuit board 9, a second heating device 3 which heats the electronic circuit board 9 to maintain the electronic circuit board 9 at a temperature at which the flux exerts its activating action, a flow soldering bath 4 in which molten solder is attached to the electronic circuit board 9, and a cooler 5. The water removal device 7 includes a gas blowing portion having a first jig 10 which blows a gas to an electronic component disposition surface, and a drawing portion having a second jig 11 which draws water from the surface to be soldered.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了容易地使用焊接装置，使得在焊接之前焊剂的水分不会残留在电子电路板中。焊接设备100包括传送电子电路板9的输送机8，将具有水的助熔剂作为溶剂的助焊剂1施加到待焊接的电子电路板9的表面，第一加热装置 2，其加热电子电路板9，除去附着到电子电路板9的水的除水装置7，加热电子电路板9以将电子电路板9维持在第二加热装置3的温度的第二加热装置3，助熔剂发挥其活化作用，其中熔融焊料附着到电子电路板9的流动焊接浴4和冷却器5.除水装置7包括具有第一夹具10的气体吹送部分，该第一夹具10将气体吹向电子部件配置表面和具有第二夹具11的绘图部分，其从待焊接的表面抽取水。版权所有（C）2009，JPO＆INPIT

8. 发明专利

JP2009158725A Semiconductor device and die bonding material 审中-公开
标题翻译：半导体器件和DIE接合材料
公开(公告)号：JP2009158725A
公开(公告)日：2009-07-16
申请号：JP2007335423
申请日：2007-12-27
申请人： Panasonic Corp , パナソニック株式会社
发明人： FUJIWARA SEIJI , TOMITA YOSHIHIRO , FURUSAWA AKIO , SUETSUGU KENICHIRO
IPC分类号： H01L21/52 , B23K35/26 , C22C12/00
CPC分类号： C22C12/00 , H01L24/05 , H01L24/29 , H01L24/32 , H01L24/73 , H01L2224/04042 , H01L2224/0603 , H01L2224/29 , H01L2224/29101 , H01L2224/29111 , H01L2224/29113 , H01L2224/29298 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83455 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/0133 , H01L2924/0134 , H01L2924/014 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/01028 , H01L2924/01083 , H01L2924/3512 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： PROBLEM TO BE SOLVED: To provide a low-cost junction material containing no lead and having a high melting temperature, and to secure the proper mounting and electrical reliability of a semiconductor device.
SOLUTION: With reference to a semiconductor device to be joined to a mother board using a junction material of 200°C to 230°C melting point, a Bi alloy containing Cu of 0.8 to 10 wt.% and Ge of 0.02 to 0.2 wt.% is adopted as a junction material 15, i.e., a die bonding material to join a semiconductor element 13 to a semiconductor substrate 11. As a result, in the case where the semiconductor device is joined to the mother board by reflow, the connection failure of the semiconductor element 13 is suppressed, and the proper mounting and electrical reliability of the semiconductor device is secured, as the junction material 15 to join the semiconductor element 11 to the semiconductor substrate 13 does not melt.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种不含铅并具有高熔点的低成本接合材料，并确保半导体器件的正确安装和电可靠性。解决方案：参考使用200℃至230℃熔点的接合材料连接到母板的半导体器件，含有0.8至10重量％的Cu和0.02至100的Ge的Bi合金采用0.2重量％的接合材料15，即将半导体元件13连接到半导体基板11的芯片接合材料。结果，在半导体器件通过回流焊接到母板的情况下，半导体元件13的连接故障被抑制，并且由于将半导体元件11与半导体基板13接合的接合材料15不会熔化，所以能够确保半导体器件的适当的安装和电气可靠性。版权所有（C）2009，JPO＆INPIT

9. 发明专利

JP2008293821A Conductive paste, circuit board using the same, and electronic/electric device 审中-公开
标题翻译：导电胶，使用该电路板的电路板和电子/电气设备
公开(公告)号：JP2008293821A
公开(公告)日：2008-12-04
申请号：JP2007138757
申请日：2007-05-25
申请人： Panasonic Corp , パナソニック株式会社
发明人： KISHI ARATA , HIGUCHI TAKAYUKI , MIYAGAWA HIDEKI , SUETSUGU KENICHIRO
IPC分类号： H01B1/22 , H01B13/00 , H01L21/60 , H05K3/12
CPC分类号： H01L2224/11
摘要： PROBLEM TO BE SOLVED: To provide a conductive paste capable of indicating a relatively-low internal resistance value after hardening while hardening it at relatively-low temperature and preventing deteriorated storage stability caused by use of a reducing agent, corrosion after hardening, and generation of migration. SOLUTION: The conductive paste includes hardenable resin, a hardening agent constituent, metal particles, carbon nanotubes, and a viscosity control agent at a designated ratio. COPYRIGHT: (C)2009,JPO&INPIT

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