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1. 发明专利

JP2009104930A Conductive paste and package using this 有权
标题翻译：导电胶和使用此包装
公开(公告)号：JP2009104930A
公开(公告)日：2009-05-14
申请号：JP2007276422
申请日：2007-10-24
申请人： Panasonic Corp , パナソニック株式会社
发明人： KISHI ARATA , HIGUCHI TAKAYUKI , YAMAGUCHI ATSUSHI , MIYAGAWA HIDEKI
IPC分类号： H01B1/22 , C09J9/02 , C09J201/00 , H01R11/01
摘要： PROBLEM TO BE SOLVED: To provide a conductive paste which can be replaced (repaired) even in the case a failure has occurred in an electronic component, and a package using the same.
SOLUTION: The conductive paste contains a low-melting point organic compound of 0.1-20 pts.wt., metal particles of 40-1,200 pts.wt., a curing agent of 1-100 pts.wt., and a reducing agent of 0.1-20 pts.wt. to an insulating resin 100 pts.wt., and the low-melting point organic compound is a solid at normal temperature and the melting point of the low-melting point organic compound is lower than the curing starting temperature of the insulating resin and the curing agent and the melting point of the metal particles.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：即使在电子部件中发生故障的情况下，也可以提供即使被更换（修理）的导电膏，也可以使用该导电糊。解决方案：导电糊包含0.1-20重量份的低熔点有机化合物，40-1200重量份的金属颗粒，1-100重量份的固化剂，和还原剂0.1-20重量份绝缘树脂100重量份，低温有机化合物在常温下为固体，低熔点有机化合物的熔点低于绝缘树脂的固化开始温度，固化试剂和金属颗粒的熔点。版权所有（C）2009，JPO＆INPIT

2. 发明专利

JP2009006218A Resin composition applying apparatus and resin composition applying method 有权
标题翻译：树脂组合物应用装置和树脂组合物的应用方法
公开(公告)号：JP2009006218A
公开(公告)日：2009-01-15
申请号：JP2007168310
申请日：2007-06-27
申请人： Panasonic Corp , パナソニック株式会社
发明人： KUWABARA RYO , MIYAGAWA HIDEKI , YAMAGUCHI ATSUSHI
IPC分类号： B05C5/00 , B05C11/10 , B05D1/26 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a resin composition applying apparatus and a resin composition applying method by which a resin composition is continuously and stably applied and can be used efficiently by being used up completely and efficiently. SOLUTION: A syringe 1 is designed so that the distance between the inner surface of a discharge part 5 and the top of a screw thread 7 is 0.1-0.2 mm. A hole part 2a having 0.01-0.1 mm distance from a shaft part 8 is provided at the center part of a cap part 2 connected to a nozzle 3 through a connection part 4 and movable in the syringe 1 downward by pressure. These are fixed to a fixing position 6 preliminarily fixed in a coater main body 12. The shaft part 8 is inserted into the syringe 1 while rotating at 20-50 rpm to prevent that the syringe 1 is lifted and a gap is formed. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种树脂组合物施加装置和树脂组合物施加方法，通过该方法使树脂组合物连续稳定地施加，并且可以被完全有效地使用而有效地使用。解决方案：注射器1被设计成使得排出部5的内表面与螺纹7的顶部之间的距离为0.1-0.2mm。通过连接部4连接到喷嘴3的帽部2的中央部设置有距离轴部8的距离为0.01〜0.1mm的孔部2a，并且通过压力向下方可在注射器1中移动。这些固定在预先固定在涂布机主体12中的固定位置6.轴部8在以20-50rpm旋转的同时插入注射器1中，以防止注射器1被抬起并形成间隙。版权所有（C）2009，JPO＆INPIT

3. 发明专利

JP2008293821A Conductive paste, circuit board using the same, and electronic/electric device 审中-公开
标题翻译：导电胶，使用该电路板的电路板和电子/电气设备
公开(公告)号：JP2008293821A
公开(公告)日：2008-12-04
申请号：JP2007138757
申请日：2007-05-25
申请人： Panasonic Corp , パナソニック株式会社
发明人： KISHI ARATA , HIGUCHI TAKAYUKI , MIYAGAWA HIDEKI , SUETSUGU KENICHIRO
IPC分类号： H01B1/22 , H01B13/00 , H01L21/60 , H05K3/12
CPC分类号： H01L2224/11
摘要： PROBLEM TO BE SOLVED: To provide a conductive paste capable of indicating a relatively-low internal resistance value after hardening while hardening it at relatively-low temperature and preventing deteriorated storage stability caused by use of a reducing agent, corrosion after hardening, and generation of migration. SOLUTION: The conductive paste includes hardenable resin, a hardening agent constituent, metal particles, carbon nanotubes, and a viscosity control agent at a designated ratio. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供能够在相对低温下硬化之后表现出相对低的内部电阻值的导电性糊剂，并且防止由于使用还原剂而导致的储存稳定性恶化，硬化后的腐蚀，和生成移民。解决方案：导电浆料包括可硬化树脂，硬化剂组分，金属颗粒，碳纳米管和以指定比例的粘度控制剂。版权所有（C）2009，JPO＆INPIT

4. 发明专利

JP2014103190A Solar cell module 有权
标题翻译：太阳能电池模块
公开(公告)号：JP2014103190A
公开(公告)日：2014-06-05
申请号：JP2012252953
申请日：2012-11-19
申请人： Panasonic Corp , パナソニック株式会社
发明人： HINO HIROHISA , OHASHI NAOMICHI , SUZUKI YASUHIRO , KISHI ARATA , MIYAGAWA HIDEKI
IPC分类号： H01L31/042
CPC分类号： Y02E10/52
摘要： PROBLEM TO BE SOLVED: To provide a solar cell module capable of achieving high generation efficiency by effectively reflecting light passing through spaces between solar cells to collect the light to the solar cells.SOLUTION: The solar cell module comprises: a white resin; plural solar cells positioned on an upper face of the white resin; a transparent resin positioned over an upper face of the solar cells; and a surface coating material positioned over an upper face of the transparent resin, wherein the white resin forms a convex part between the plural solar cells, and wherein the white resin is formed by connecting a rectangular parallelepiped located beneath a lower face of the plural solar cells and the convex part located between the plural solar cells.
摘要翻译：要解决的问题：提供一种通过有效地反射通过太阳能电池之间的空间的光来实现高发电效率的太阳能电池模块，以将光收集到太阳能电池。解决方案：太阳能电池模块包括：白色树脂; 多个太阳能电池位于白色树脂的上表面上; 位于太阳能电池的上表面上的透明树脂; 以及位于所述透明树脂的上表面上的表面涂层材料，其中所述白色树脂在所述多个太阳能电池之间形成凸部，并且其中所述白色树脂通过连接位于所述多个太阳能电池的下表面下方的长方体形成电池和位于多个太阳能电池之间的凸部。

5. 发明专利

JP2013035066A Bonding material, bonded portion and circuit board 有权
标题翻译：粘接材料，粘结部分和电路板
公开(公告)号：JP2013035066A
公开(公告)日：2013-02-21
申请号：JP2012200626
申请日：2012-09-12
申请人： Panasonic Corp , パナソニック株式会社
发明人： YAMAGUCHI ATSUSHI , NISHIKAWA KAZUHIRO , MIYAGAWA HIDEKI
IPC分类号： B23K35/26 , B23K1/00 , B23K35/22 , B23K101/42 , C22C12/00 , H05K3/32 , H05K3/34
CPC分类号： H05K3/321 , B23K35/025 , B23K35/26 , B23K35/262 , B23K35/264 , B23K35/3613 , B23K35/3618 , B23K35/362 , H01B1/22 , H05K3/3484 , Y10T403/479 , Y10T428/31678
摘要： PROBLEM TO BE SOLVED: To provide a solder material which enables to realize a lower mounting temperature when an electronic component is mounted, and to provide a solder paste and a conductive adhesive.SOLUTION: The solder material has a basic composition composed of Sn, Bi and In. The solder material may further contain at least one metal selected from the group consisting of Cu, Ge and Ni. The solder paste which enables to realize a low-temperature mounting can be obtained by blending a flux component into the solder material. The conductive adhesive which enables to realize a low-temperature mounting can be obtained by blending a resin component into the solder material.
摘要翻译：要解决的问题：提供一种当安装电子部件时能够实现较低安装温度的焊料材料，并且提供焊膏和导电粘合剂。
解决方案：焊料材料具有由Sn，Bi和In组成的基本组成。焊料材料还可以含有选自Cu，Ge和Ni中的至少一种金属。能够通过将助熔剂成分混合到焊料材料中来获得能够实现低温安装的焊膏。可以通过将树脂成分混合到焊料材料中来获得能够实现低温安装的导电粘合剂。版权所有（C）2013，JPO＆INPIT

6. 发明专利

JP2010245434A Solder bonding method and solder bonding structure 有权
标题翻译：焊接方法和焊接结合结构
公开(公告)号：JP2010245434A
公开(公告)日：2010-10-28
申请号：JP2009094889
申请日：2009-04-09
申请人： Panasonic Corp , パナソニック株式会社
发明人： OHASHI NAOMICHI , KISHI ARATA , YAMAGUCHI ATSUSHI , MIYAGAWA HIDEKI
IPC分类号： H05K3/34 , H05K3/28 , H05K3/32
CPC分类号： H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a solder bonding method of forming a bonding part which is stable in bondability and highly reliable.
SOLUTION: The solder bonding method of soldering an electronic component 4 with a bump electrode 5 to an electronic circuit board 1 includes the steps of: forming a conductive paste layer 3 by supplying conductive paste containing a conductive filler, a flux, a first thermosetting resin, and a curing agent for curing the resin to an electrode part 2 of the electronic circuit board 1; forming an insulating resin paste layer 6 by supplying insulating resin paste containing a second thermosetting resin and a curing agent for curing the resin to the electronic component 4; loading the electronic component 4 on the electronic circuit board 1; and heating and fusing the conductive filler to solder the electronic component 4 to the electrode part 2 of the electronic circuit board 1, and curing the first and second thermosetting resins of the paste layers 3 and 6.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种焊接方法，其形成粘合性稳定并且高可靠性的接合部。解决方案：将具有凸起电极5的电子部件4焊接到电子电路板1的焊接方法包括以下步骤：通过提供包含导电填料，焊剂，第一热固性树脂和用于将树脂固化到电子电路板1的电极部分2的固化剂; 通过向电子部件4供给含有第二热固性树脂的绝缘树脂膏和用于固化树脂的固化剂，形成绝缘树脂浆料层6; 将电子部件4装载在电子电路基板1上; 加热并熔融导电填料以将电子部件4焊接到电子电路板1的电极部分2上，并固化糊层3和6的第一和第二热固性树脂。版权所有（C）2011 ，JPO＆INPIT

7. 发明专利

JP2010171407A Package structure 有权
标题翻译：包装结构
公开(公告)号：JP2010171407A
公开(公告)日：2010-08-05
申请号：JP2009290673
申请日：2009-12-22
申请人： Panasonic Corp , パナソニック株式会社
发明人： KUWABARA RYO , MATSUNO KOSO , YAMAGUCHI ATSUSHI , MIYAGAWA HIDEKI
IPC分类号： H05K1/14
CPC分类号： H05K1/144 , H05K2201/042 , H05K2201/10189 , H05K2201/10515 , H05K2201/2036
摘要： PROBLEM TO BE SOLVED: To provide a package structure having a laminate structure in which a plurality of printed wiring boards are stacked with predetermined gaps, the structure having a high mechanical strength, so that it is less likely to cause deformation, rupture and the like even if it undergoes external stress, enabling the gaps among the printed wiring boards to be kept substantially constant.
SOLUTION: The package structure includes a first printed wiring board on the top surface of which a plurality of electronic components including at least one first electronic component are mounted, a second printed wiring board stacked on the top surface of the first printed wiring board, and a plurality of connecting members for mechanically interconnecting the first and second printed wiring boards while maintaining a constant gap therebetween, the connecting members including a first cured resin for bonding the top surface of at least one first electronic component to the bottom surface of the second printed wiring board.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供具有层叠结构的封装结构，其中多个印刷电路板以预定间隙堆叠，该结构具有高机械强度，使得其不太可能引起变形，断裂即使其经受外部应力，使得印刷线路板之间的间隙能够保持基本上恒定。解决方案：包装结构包括：顶表面上的第一印刷线路板，其上安装有至少一个第一电子部件的多个电子部件;堆叠在第一印刷布线的顶表面上的第二印刷线路板板和多个连接构件，用于在保持第一和第二印刷线路板之间保持恒定间隙的同时机械地互连第一和第二印刷线路板，连接构件包括用于将至少一个第一电子部件的顶表面接合到第一电子部件的底表面的第一固化树脂第二印刷线路板。版权所有（C）2010，JPO＆INPIT

8. 发明专利

JP2008305898A Sealing structure of electronic component 审中-公开
标题翻译：电子元件密封结构
公开(公告)号：JP2008305898A
公开(公告)日：2008-12-18
申请号：JP2007150317
申请日：2007-06-06
申请人： Panasonic Corp , パナソニック株式会社
发明人： MATSUNO KOSO , MIYAGAWA HIDEKI , YAMAGUCHI ATSUSHI
IPC分类号： H01L23/29 , H01L21/60 , H01L23/31
CPC分类号： H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a sealing structure formed to joint an electronic component to a wiring substrate, which at once relaxes thermal stress and has humidity resistance and/or water resistance. SOLUTION: In the sealing structure of an electronic component, a connecting electrode on a circuit board faces a connecting electrode of an electronic component, and a conductive connection part of conductive material is formed between both electrodes. A resin sealing part for sealing the conductive connection part is formed between the substrate surface and at least the lower side surface of the electronic component. The resin sealing part comprises at least two layers, an inside resin layer and an outside resin layer. The glass transition temperature of the inside resin layer is different from that of the outside resin layer. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供形成为将电子部件接合到布线基板的密封结构，该布线基板立即放松热应力并具有耐湿性和/或耐水性。解决方案：在电子部件的密封结构中，电路板上的连接电极面对电子部件的连接电极，并且在两个电极之间形成导电材料的导电连接部分。用于密封导电连接部的树脂密封部形成在基板表面和电子部件的至少下侧表面之间。树脂密封部包括至少两层，内侧树脂层和外侧树脂层。内部树脂层的玻璃化转变温度与外部树脂层的玻璃化转变温度不同。版权所有（C）2009，JPO＆INPIT

9. 发明专利

JP2008293820A Conductive paste and substrate 有权
标题翻译：导电胶和基材
公开(公告)号：JP2008293820A
公开(公告)日：2008-12-04
申请号：JP2007138756
申请日：2007-05-25
申请人： Panasonic Corp , パナソニック株式会社
发明人： HIGUCHI TAKAYUKI , MIYAGAWA HIDEKI , YAMAGUCHI ATSUSHI , KISHI ARATA
IPC分类号： H01B1/22 , C09J9/02 , C09J163/02 , H01B5/14 , H01L21/52 , H05K1/09 , H05K3/32
摘要： PROBLEM TO BE SOLVED: To provide a conductive paste capable of being applicable at an easy operation when mounting electronic components on a substrate and fixing the electronic components on the substrate at high mechanical strength after curing.
SOLUTION: The conductive paste contains conductive filler constituents selected from Sn and a combination of one or more of elements selected from a group of Bi, In, Ag, and Cu, a thermosetting resin constituent, and a curing agent constituent corresponding to the thermosetting resin constituent as basic constituents, and also includes a thixotropy-giving additive for giving thixotropy to the thermosetting resin constituent in a range of mounting temperature by adding to the basic constituents.
COPYRIGHT: (C)2009,JPO&INPIT

10. 发明专利

JP2011066080A Covering method of mounting structure by protective film, mounting structure and repairing method of mounting structure 有权
标题翻译：保护膜安装结构的覆盖方法，安装结构和安装方式的安装结构
公开(公告)号：JP2011066080A
公开(公告)日：2011-03-31
申请号：JP2009213530
申请日：2009-09-15
申请人： Panasonic Corp , パナソニック株式会社
发明人： MATSUNO KOSO , MIYAGAWA HIDEKI , YAMAGUCHI ATSUSHI , OWADA HIROE
IPC分类号： H05K3/28 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To protect an electrode component from moisture, without fail, even under a high temperature and high humidity, and to facilitate repairing of the electronic component. SOLUTION: The electronic component and an electronic circuit board 1, on which the component is mounted are covered with a first coating agent having moisture resistance and insulating properties to form a first coat 51; further, a second coating agent in which the first coating agent is added with an additive having thickening properties is applied to form a second coat 52, thus covering a mounting structure. Even if the electronic component is an insertion type, its pin-like electrode component 44 can be protected by full thickness by using at least the second coat 52. Since the main components of the first and second coating agents are identical, the first and second coats 51 and 52 can be selectively dissolved or softened using the same solvent, at the same time as the repairing of the electronic component. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：即使在高温和高湿度下，也能够保护电极组件免受潮湿，并且便于电子部件的修理。解决方案：安装有组件的电子部件和电子电路板1被具有防潮性和绝缘性的第一涂层剂覆盖以形成第一涂层51; 此外，施加其中第一涂层剂添加有增稠特性的添加剂的第二涂层剂以形成第二涂层52，从而覆盖安装结构。即使电子部件是插入型，也可以通过至少使用第二涂层52来使其针状电极部件44全面保护。由于第一和第二涂布剂的主要成分相同，所以第一和第二涂层在修复电子部件的同时，可以使用相同的溶剂选择性地溶解或软化涂层51和52。版权所有（C）2011，JPO＆INPIT

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