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1. 发明专利

JP2011166127A Method of manufacturing liquid-cooled integrated substrate, and liquid-cooled integrated substrate 有权
标题翻译：制备液体冷却的集成基板和液体冷却的集成基板的方法
公开(公告)号：JP2011166127A
公开(公告)日：2011-08-25
申请号：JP2011004430
申请日：2011-01-12
申请人： Dowa Metaltech Kk , Dowaメタルテック株式会社 , Nippon Light Metal Co Ltd , 日本軽金属株式会社
发明人： HORI HISASHI , KOKUBO TAKAKUNI , OSANAI HIDEYO , TAKAHASHI TAKAYUKI , TOMOHARA KUNIHIKO
IPC分类号： H01L23/473 , H01L23/12 , H01L23/13 , H01L23/36 , H05K7/20
CPC分类号： H05K1/0201 , H01L23/3735 , H01L23/473 , H01L2924/0002 , H05K1/0306 , H05K3/0058 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a liquid-cooled integrated substrate reduced in raw material cost and processing cost, reduced in warpage, and excellent in strength and heat radiating property, and the liquid-cooled integrated substrate. SOLUTION: In the method of manufacturing the liquid-cooled integrated substrate 1 constructed such that a metal circuit board 15 made of aluminum or an aluminum alloy is bonded to one surface of a ceramics substrate 10, one surface of a plate-shaped metal base plate 20 made of aluminum or an aluminum alloy is bonded to the other surface, and a liquid-cooled radiator 30 constituted of an extrusion material is bonded to the other surface of the metal base plate 20, the metal circuit board 15, the metal base plate 20 and the ceramics substrate 10 are bonded together by a hot melt bonding method, the metal base plate 20 and the radiator 30 are bonded together by a molten metal bonding method, and the metal base plate 20 and the radiator 30 are pressurized at a surface pressure of -1.25×10 -3 ×(the second moment of area of the radiator)+2.0 or more and then brazing-bonded together with heat. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：解决的问题：提供一种降低原料成本和加工成本，降低翘曲，强度和散热性优异的液冷一体基板的制造方法以及液冷一体基板。解决方案：在制造将铝或铝合金制的金属电路板15结合到陶瓷基板10的一个表面上的液冷集成基板1的制造方法中，将板状的一个表面由铝或铝合金制成的金属基板20与另一面接合，由挤出材料构成的液冷散热器30与金属基板20的另一个表面接合，金属电路板15，金属基板20和陶瓷基板10通过热熔接合方法接合在一起，金属基板20和散热器30通过熔融金属接合方法接合在一起，金属基板20和散热器30被加压在表面压力为-1.25×10 -3 ×（散热器的面积的第二矩）+2.0以上，然后用热钎焊接合。版权所有（C）2011，JPO＆INPIT

2. 发明专利

JP2012160722A Method of manufacturing liquid-cooled integrated substrate, and liquid-cooled integrated substrate 有权
标题翻译：制备液体冷却的集成基板和液体冷却的集成基板的方法
公开(公告)号：JP2012160722A
公开(公告)日：2012-08-23
申请号：JP2012003757
申请日：2012-01-12
申请人： Dowa Metaltech Kk , Dowaメタルテック株式会社 , Nippon Light Metal Co Ltd , 日本軽金属株式会社
发明人： HORI HISASHI , KOKUBO TAKAKUNI , OSANAI HIDEYO , TAKAHASHI TAKAYUKI , TOMOHARA KUNIHIKO
IPC分类号： H05K7/20 , H01L23/36 , H01L23/473
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a liquid-cooled integrated substrate, and the liquid-cooled integrated substrate of which a raw material cost and a processing cost are suppressed to be low, deflection is reduced, and strength and heat radiation characteristic are excellent.SOLUTION: A metal circuit board 15 and metal base plate 20 are jointed to a ceramic substrate 10 by a molten metal jointing method. The metal base plate 20 is jointed to a heat sink 30 by a solder jointing method. In the solder jointing method, a single layer brazing sheet consisting only of a solder of Al-Si-Mg alloy composition is sandwiched between the metal base plate 20 and the heat sink 30 for surface contacting. Under this condition, the metal base plate 20 and the heat sink 30 are pressurized by a surface pressure equal to or higher than -1.25×10×(cross sectional secondary moment of heat sink)+2.0, and then heated and held at the soldering temperature of 570°C or higher in the inactive gas atmosphere, for solder jointing with no flux.
摘要翻译：要解决的问题：为了提供一种液冷一体化基板的制造方法以及将原材料成本和加工成本抑制在低的液冷一体基板，挠曲减小，强度并且散热特性优异。解决方案：金属电路板15和金属基板20通过熔融金属接合方法连接到陶瓷基板10上。金属基板20通过焊接法与散热器30接合。在焊接方法中，仅由Al-Si-Mg合金组成的焊料组成的单层钎焊板夹在金属基板20和用于表面接触的散热器30之间。在这种条件下，金属基板20和散热片30的表面压力等于或高于-1.25×10×（横截面二次矩散热器）+2.0，然后在惰性气体气氛中加热保持在570℃以上的焊接温度，焊接无焊剂。版权所有（C）2012，JPO＆INPIT

3. 发明专利

JP2013197246A Substrate integrated with radiator, and method of manufacturing the same 有权
标题翻译：与散热器一体化的基板及其制造方法
公开(公告)号：JP2013197246A
公开(公告)日：2013-09-30
申请号：JP2012061603
申请日：2012-03-19
申请人： Nippon Light Metal Co Ltd , 日本軽金属株式会社 , Dowa Metaltech Kk , Dowaメタルテック株式会社
发明人： HORI HISASHI , KOKUBO TAKAKUNI , OSANAI HIDEYO , TOMOHARA KUNIHIKO
IPC分类号： H05K7/20 , B32B15/04 , B32B15/08 , H01L23/36
CPC分类号： H05K1/021 , B23K1/0008 , B23K1/0012 , B23K1/0016 , B23K1/19 , C04B35/645 , C04B37/021 , C04B2237/366 , C04B2237/368 , C04B2237/402 , C04B2237/66 , C04B2237/704 , H01L21/4882 , H01L23/3735 , H01L23/473 , H01L2924/0002 , H05K1/0271 , H05K1/0306 , H05K1/05 , H05K3/0061 , H05K13/0465 , H05K2203/0278 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a substrate integrated with a radiator, for which the raw material cost and the processing cost are suppressed low and the warpage is reduced, and which includes excellent strength and heat dissipation, and the substrate integrated with a radiator.SOLUTION: A metal circuit board 15 and a metal base plate 20 are joined to a ceramic substrate 10 to form a metal-ceramic joined substrate 2, the metal base plate 20 is disposed by laying it on top of one side of a radiator 30 through a wax material, a fixture 51 having a recessed R surface 55 is disposed by bringing it face to face with the other side of the radiator 30, a fixture 52 having a projecting R surface 56 projecting toward the metal-ceramic joined substrate 2 side is brought into contact with the other side of the metal circuit board 15, and the metal-ceramic joined substrate 2 is thermally joined to the radiator 30 while pressurizing them by the radiator side fixture 51 and the metal-ceramic joined substrate side fixture 52. A curvature radius R (mm) of the projecting R surface 56 and the recessed R surface 55 is 6,500≤R≤bearing(N/mm)×2,000+12,000.
摘要翻译：要解决的问题：提供一种制造与散热器一体化的基板的方法，其原料成本和加工成本被抑制低并且翘曲减小，并且其包括优异的强度和散热性，并且基板集成具有散热器。解决方案：将金属电路板15和金属基板20接合到陶瓷基板10以形成金属陶瓷接合基板2，金属基板20通过将金属基板20放置在通过蜡材料的散热器30，具有凹入的R表面55的固定件51通过与散热器30的另一侧面对面地设置，具有向金属陶瓷接合的突出的R表面56的固定件52 基板2侧与金属电路板15的另一侧接触，并且金属陶瓷接合基板2与散热器30热连接，同时通过散热器侧固定件51a对其加压和金属陶瓷接合基板侧固定件52.突出的R表面56和凹入的R表面55的曲率半径R（mm）为6500≤R≤Bearing（N / mm）×2,000 + 12,000。

4. 发明专利

JP2011166122A Substrate integrated with fin, and method of manufacturing the same 有权
标题翻译：与FIN一体化的基板及其制造方法
公开(公告)号：JP2011166122A
公开(公告)日：2011-08-25
申请号：JP2011000386
申请日：2011-01-05
申请人： Dowa Metaltech Kk , Dowaメタルテック株式会社 , Nippon Light Metal Co Ltd , 日本軽金属株式会社
发明人： HORI HISASHI , OSANAI HIDEYO , TAKAHASHI TAKAYUKI
IPC分类号： H01L23/12 , H01L23/36 , H01L23/473 , H05K7/20
CPC分类号： H01L23/473 , H01L21/4878 , H01L23/3735 , H01L2924/0002 , Y10T29/49144 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a substrate integrated with fin and a method of manufacturing the same, capable of manufacturing the substrate integrated with fins equipped with heat radiation fins arranged at fine pitches in a simple process by a processing method suppressing warpage of a metal base plate and deformation (generation of a corrugated shape or the like) of the heat radiation fins. SOLUTION: A metal circuit board 15 is bonded to a ceramic substrate 10 by a molten metal bonding method, and the plurality of heat radiation fins 20a are formed to a part to be cut which is a part of the metal base plate 20 by a grooving process of forming a plurality of grooves by performing anchoring with a tool to exert tensile stress on a surface of the cutting part to which the heat radiation fins 20a is to be formed, and moving a multi-cutter constituted by laminating a plurality of disk cutters onto the tensile-stress-exerted surface while rotating it. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供与散热片一体化的基板及其制造方法，能够通过抑制翘曲的处理方法，以简单的工艺制造集成有配备有以细间距布置的散热片的散热片的基板的金属基板和散热片的变形（波纹形状等的产生）。解决方案：通过熔融金属接合方法将金属电路板15接合到陶瓷基板10上，并且将多个散热片20a形成为作为金属基板20的一部分的待切割部分通过利用工具进行锚固来对形成有散热片20a的切割部的表面施加拉伸应力的槽形成方法，并且移动多层切割机构的圆盘切割机旋转到拉伸应力表面上。版权所有（C）2011，JPO＆INPIT

5. 发明专利

JP2011166126A Liquid-cooled integrated substrate, and method of manufacturing the same 有权
标题翻译：液体冷却的集成基板及其制造方法
公开(公告)号：JP2011166126A
公开(公告)日：2011-08-25
申请号：JP2011004429
申请日：2011-01-12
申请人： Dowa Metaltech Kk , Dowaメタルテック株式会社 , Nippon Light Metal Co Ltd , 日本軽金属株式会社
发明人： HORI HISASHI , KOKUBO TAKAKUNI , OSANAI HIDEYO , TAKAHASHI TAKAYUKI , TOMOHARA KUNIHIKO
IPC分类号： H01L23/36 , H01L23/473 , H01L25/07 , H01L25/18 , H05K1/02 , H05K3/38
CPC分类号： H05K1/0201 , H01L23/3735 , H01L23/473 , H01L2924/0002 , H05K1/0306 , H05K3/0058 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a liquid-cooled integrated substrate reduced in raw material cost and processing cost, reduced in warpage (shape deformation) as the integrated substrate, and excellent in strength and heat radiating property, and to provide a method of manufacturing the same. SOLUTION: In the liquid-cooled integrated substrate 1 constructed such that a metal circuit board 15 made of aluminum or an aluminum alloy is bonded to one surface of a ceramics substrate 10, one surface of a plate-shaped metal base plate 20 made of aluminum or an aluminum alloy is bonded to the other surface, a liquid-cooled radiator 30 constituted of an extrusion material is bonded to the other surface of the metal base plate 20, the relation between a thickness t1 of the metal circuit board 15 and a thickness t2 of the metal base plate 20 satisfies t2/t1≥2, the thickness t1 of the metal circuit board 15 is 0.4-3 mm, and the thickness t2 of the metal base plate 20 is 0.8-6 mm. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：解决方案：为了提供一种降低原料成本和加工成本的液冷集成基板，减少作为一体基板的翘曲（形状变形），并且具有优异的强度和散热性，并且提供制造方法解决方案：在液晶冷却集成基板1中，将由铝或铝合金制成的金属电路板15结合到陶瓷基板10的一个表面上，将板状金属基板20的一个表面由铝或铝合金制成的另一个表面上，由金属基板20的另一个表面连接由挤出材料构成的液冷散热器30，金属电路板15的厚度t1 并且金属基板20的厚度t2满足t2 /t1≥2，金属电路板15的厚度t1为0.4-3mm，金属基板20的厚度t2为0.8-6mm。版权所有（C）2011，JPO＆INPIT

6. 发明专利

JP2015053414A 電子部品搭載基板およびその製造方法有权
标题翻译：电子元件装配基板及其制造方法
公开(公告)号：JP2015053414A
公开(公告)日：2015-03-19
申请号：JP2013185997
申请日：2013-09-09
申请人： Dowaメタルテック株式会社 , Dowa Metaltech Kk
发明人： SUNAJI NAOYA , OSANAI HIDEYO , KURITA TORU
IPC分类号： H01L21/52 , H01L23/12 , H01L23/13 , H05K3/32
CPC分类号： H01L23/4924 , H01L21/4846 , H01L21/4878 , H01L23/3735 , H01L23/3736 , H01L23/498 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/04026 , H01L2224/05644 , H01L2224/27442 , H01L2224/29139 , H01L2224/29339 , H01L2224/29394 , H01L2224/32225 , H01L2224/32245 , H01L2224/75315 , H01L2224/83009 , H01L2224/83192 , H01L2224/83203 , H01L2224/83385 , H01L2224/83447 , H01L2224/8384 , H01L2924/01046 , H01L2924/01047 , H01L2924/01079 , H05K1/053 , H05K3/3431 , H05K2203/0307 , Y02P70/613 , H01L2924/00014 , H01L2924/00012
摘要：【課題】銅板または銅めっき板上に電子部品を接合欠陥が少ない状態で接合して、ヒートサイクルを付与した後にも良好な接合状態を保持することができる、耐熱衝撃性に優れた電子部品搭載基板およびその製造方法を提供する。【解決手段】銅あるいは(表面に銅めっき皮膜20を形成する場合は)アルミニウムまたはアルミニウム合金からなる金属板10の一方の主面に電子部品14が搭載された電子部品搭載基板の製造方法において、金属板10の一方の主面(または銅めっき皮膜20の表面)(電子部品14が接合される面)を粗くしてその表面粗さを0.4μm以上にする表面加工を行い、その主面(または銅めっき皮膜20の表面)に銀ペーストを塗布して電子部品14を配置した後、銀ペースト中の銀を焼結させて銀接合層12を形成し、この銀接合層12によって電子部品14を金属板10の一方の主面(または銅めっき皮膜20の表面)に接合する。【選択図】図1
摘要翻译：要解决的问题：提供：具有优异的耐热冲击性的电子元件配置的基板，即使在将电子部件接合在铜板或镀铜板上的状态下也能够保持良好的接合状态，其中接合缺陷几乎不发生，然后进行热循环; 以及用于制造装有电子元件的基板的方法。解决方案：在配备电子元件的基板中，电子元件14安装在由铜制成的金属板10的一个主表面上（或者在铜在其表面上形成铝电镀铝或铝合金。在配备电子元件的基板的制造方法中，使表面粗糙度为0.4μm以上的表面处理通过使一个主面（或具有镀铜膜20的表面）（即，具有铜镀膜20的表面）金属板10的电子部件14），将银膏施加到主表面（或具有镀铜膜20的表面）上，并且将电子部件14定位在其上，然后将银通过在银膏中烧结银形成接合层12，并且通过银粘合层12将电子部件14接合到金属板10的一个主表面（或具有镀铜膜20的表面）。

7. 发明专利

JP2013207133A Metal-ceramic joined substrate and method for producing the same 审中-公开
标题翻译：金属陶瓷接合基板及其制造方法
公开(公告)号：JP2013207133A
公开(公告)日：2013-10-07
申请号：JP2012075597
申请日：2012-03-29
申请人： Dowa Metaltech Kk , Dowaメタルテック株式会社
发明人： IDEGUCHI SATORU , OSANAI HIDEYO
IPC分类号： H01L23/13 , H01L23/12
摘要： PROBLEM TO BE SOLVED: To provide a metal-ceramic joined substrate capable of improving reliability thereof by suppressing deformation of a screw-fastening portion of a metal base plate joined to a ceramic substrate, and a method for producing the metal-ceramic joined substrate.SOLUTION: In a metal-ceramic joined substrate, a metal circuit plate 12 comprising aluminum or an aluminum alloy is directly joined to one face of a ceramic substrate 10, and a metal base plate 14 comprising aluminum or an aluminum alloy is directly joined to the other face. In the metal-ceramic joined substrate, the substantially entire area of the outer peripheral surface of an annular member 16 (comprising carbon steel, stainless or a copper alloy having higher melting point and strength than the metal base plate 14) is directly joined to the substantially entire area of the inner peripheral surface of a through hole (for screw fastening) that is formed at the peripheral part of the metal base plate 14 and extends in the substantially vertical direction with respect to a joined surface between the metal base plate 14 and the ceramic substrate 10 so as to penetrate through from one face of the metal base plate 14 to the other face.
摘要翻译：要解决的问题：提供一种能够通过抑制与陶瓷基板接合的金属基板的螺纹紧固部的变形来提高可靠性的金属陶瓷接合基板，以及金属 - 陶瓷接合基板的制造方法。解决方案：在金属陶瓷接合基板中，包括铝或铝合金的金属电路板12直接接合到陶瓷基板10的一个面上，并且包括铝或铝合金的金属基板14直接接合到另一面在金属陶瓷接合基板中，环状部件16的外周面（包含碳钢，不锈钢或具有比金属基板14的高的熔点和强度的铜合金）的大致整个区域直接接合到在金属基板14的周边部形成有贯通孔（螺纹紧固）的内周面的大致整个区域，并且相对于金属基板14和陶瓷基板10从金属基板14的一面穿透到另一面。

8. 发明专利

JP2011199209A Method for manufacturing metal-ceramic bonded circuit board 有权
标题翻译：金属陶瓷结合电路板的制造方法
公开(公告)号：JP2011199209A
公开(公告)日：2011-10-06
申请号：JP2010067139
申请日：2010-03-24
申请人： Dowa Metaltech Kk , Dowaメタルテック株式会社
发明人： KOTANI HIROTAKA , IDEGUCHI SATORU , OSANAI HIDEYO
IPC分类号： H05K3/06 , H01L23/12 , H01L23/14
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a metal-ceramic bonded circuit board for performing the uniform coating of resist ink, when coating the circuit pattern of a metal-ceramic bonded circuit board with etching resist ink by a roll coater, preventing ink sagging on the side face of the circuit pattern, preventing even the section of a runner to the circuit pattern from being coated with the resist ink, even if the amount of pushing of a roll is increased, and preventing a ceramic board from being cracked, even if the metal-ceramic bonded circuit board is bent.SOLUTION: A method of manufacturing a metal-ceramic bonded circuit board 18 is such that a metal circuit board 18a is bonded to one surface of a ceramic board, and a portion of a runner to the circuit pattern of this metal circuit board remains, and then etching processing is carried out, by coating the circuit pattern of the metal-ceramic bonded circuit board with etching resist ink by a roll coater by using a coating roll 10, whose groove pitch is ranging from 0.05 to 0.2 mm.
摘要翻译：要解决的问题：为了提供一种用于进行抗蚀剂油墨的均匀涂布的金属 - 陶瓷粘结电路板的制造方法，当通过辊涂机将抗蚀剂油墨涂覆在金属陶瓷粘合电路板的电路图案上时，墨水在电路图案的侧面下垂，即使滚筒的推压量增加，甚至防止流道对电路图案的部分被涂覆有抗蚀剂油墨，并且防止陶瓷板被破裂即使金属陶瓷接合电路板弯曲也是如此。解决方案：金属陶瓷接合电路板18的制造方法是将金属电路板18a接合在陶瓷基板的一个表面上，保留该金属电路板的电路图形，然后通过使用辊式涂布机通过辊式涂布机将金属陶瓷粘合电路板的电路图案涂覆在抗蚀剂油墨上，然后进行蚀刻处理涂布辊10的槽间距为0.05〜0.2mm。

9. 发明专利

JP2009260191A SOLDERING METHOD OF Pb-LESS SOLDER AND SOLDERED ARTICLE THEREOF 有权
标题翻译：无铅焊锡焊接方法及其焊接工艺
公开(公告)号：JP2009260191A
公开(公告)日：2009-11-05
申请号：JP2008110350
申请日：2008-04-21
申请人： Dowa Metaltech Kk , Dowaメタルテック株式会社
发明人： IDEGUCHI SATORU , OSANAI HIDEYO
IPC分类号： H05K3/34 , B23K1/00 , B23K1/19 , B23K1/20
摘要： PROBLEM TO BE SOLVED: To provide a soldering method of Pb-less solder which improves a joint strength with a pattern composed of Pb-less solder and Cu or Cu alloy, even if the thickness of an Ni plating layer is thin. SOLUTION: The soldering method of Pb-less solder includes a process to form the Ni plating layer 3 in a Cu pattern 2, a process to apply a Pb-less solder 5 of which the main component is Sn to the Cu pattern through the Ni plating layer and to heat-treat it, wherein by the process of heat-treatment, the Ni plating layer is vanished and the Pb-less solder is joined with the pattern. COPYRIGHT: (C)2010,JPO&INPIT

10. 发明专利

JP2014130989A Electronic component mounting board and manufacturing method therefor 有权
标题翻译：电子元件安装板及其制造方法
公开(公告)号：JP2014130989A
公开(公告)日：2014-07-10
申请号：JP2013068775
申请日：2013-03-28
申请人： Dowa Metaltech Kk , Dowaメタルテック株式会社
发明人： SUNAJI NAOYA , OSANAI HIDEYO , KURITA TORU
IPC分类号： H01L21/52 , H01L23/12 , H01L23/13 , H05K3/12 , H05K3/38
CPC分类号： H01L21/4857 , C23C24/106 , H01L23/3735 , H01L24/05 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/04026 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05664 , H01L2224/29006 , H01L2224/29294 , H01L2224/29339 , H01L2224/2949 , H01L2224/32013 , H01L2224/32225 , H01L2224/83009 , H01L2224/83075 , H01L2224/83192 , H01L2224/83203 , H01L2224/83385 , H01L2224/83395 , H01L2224/83424 , H01L2224/83439 , H01L2224/83444 , H01L2224/83455 , H01L2224/83464 , H01L2224/8384 , H01L2924/10253 , H01L2924/12042 , H01L2924/12044 , H01L2924/15787 , H01L2924/203 , Y10T428/12472 , H01L2924/00012 , H01L2924/00015 , H01L2924/01015 , H01L2924/00014 , H01L2924/01014 , H01L2924/01005 , H01L2924/00 , H01L2924/0002
摘要： PROBLEM TO BE SOLVED: To provide an electronic component mounting board which allows for bonding of an electronic component onto a metal plate, composed of aluminum or an aluminum alloy, with sufficient bonding strength, and to provide a manufacturing method therefor.SOLUTION: One principal surface of a metal plate (for mounting an electronic component) 10 of substantially rectangular planar shape composed of aluminum or an aluminum alloy is subjected to surface treatment so as to have a surface roughness of 0.2 μm or more, and then a plating film 20 of nickel or a nickel alloy is formed on one principal surface of a metal plate 10. An electronic component 14 is bonded onto the plating film 20 by a silver bonding layer 12 (including a sintered compact of silver). Subsequently, one principal surface of a ceramic substrate 16 of substantially rectangular planar shape is bonded to the other principal surface of the metal plate 10, and a heat dissipation metal plate (metal base plate) 18 of substantially rectangular planar shape is bonded to the other principal surface of the ceramic substrate 16.
摘要翻译：要解决的问题：提供一种电子部件安装板，其能够将电子部件接合到由铝或铝合金构成的金属板上，具有足够的接合强度，并提供其制造方法。解决方案：一个主体对由铝或铝合金构成的大致矩形的平面形状的金属板（用于安装电子部件）10的表面进行表面处理，使其表面粗糙度为0.2μm以上，然后进行镀膜20 镍或镍合金形成在金属板10的一个主表面上。电子部件14通过银粘合层12（包括银的烧结体）结合到镀膜20上。随后，将大致矩形平面形状的陶瓷基板16的一个主表面接合到金属板10的另一个主表面，并且将基本上矩形平面形状的散热金属板（金属基板）18接合到另一个陶瓷基板16的主表面。

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