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    • 5. 发明专利
    • Substrate processing device
    • 基板处理装置
    • JP2013112436A
    • 2013-06-10
    • JP2011257873
    • 2011-11-25
    • Nikon Corp株式会社ニコン
    • SUZUKI TOMOYA
    • B65H20/32B65H23/188
    • PROBLEM TO BE SOLVED: To provide a substrate processing device enabling a reduction in processing accuracy to be suppressed.SOLUTION: This substrate processing device includes a first processing device for performing a first processing to a substrate which is formed in a band shape and has flexibility, a second processing device for performing a second processing to the substrate to which the first processing has been applied, a conveying device which includes an unloading roller for unloading the substrate from the first processing device and a loading roller for loading the substrate unloaded by the unloading roller to the second processing device and conveys the substrate, and a vibration eliminating device which is provided between the first processing device and the second processing device and eliminates the vibration of the substrate to be conveyed by the conveying device.
    • 要解决的问题:提供能够抑制加工精度降低的基板处理装置。 解决方案:该基板处理装置包括:第一处理装置,用于对形成为带状并具有柔性的基板执行第一处理;第二处理装置,用于对基板执行第一处理 已经应用了一种输送装置,其包括用于从第一处理装置卸载基板的卸载辊和用于将由卸载辊卸载的基板装载到第二处理装置并输送基板的装载辊,以及减振装置, 设置在第一处理装置和第二处理装置之间,并且消除由输送装置输送的基板的振动。 版权所有(C)2013,JPO&INPIT