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1. 发明专利

JP2014110376A Front chamber local anti-pollution transfer mechanism 有权
标题翻译：前厅本地防污染传输机制
公开(公告)号：JP2014110376A
公开(公告)日：2014-06-12
申请号：JP2012265074
申请日：2012-12-04
申请人： National Institute Of Advanced Industrial & Technology , 独立行政法人産業技術総合研究所 , Nanometric Technology Inc , 株式会社ナノテック , Sanmei Co Inc , 株式会社三明
发明人： HARA SHIRO , MAEKAWA HITOSHI , YOKOYAMA YASUAKI , INUZUKA YOSHIKI
IPC分类号： H01L21/677
摘要： PROBLEM TO BE SOLVED: To reduce contamination of a processing substrate which is caused by fine particles in a small manufacturing apparatus.SOLUTION: A small semiconductor manufacturing apparatus 100 is provided with: a processing chamber 110 which processes a semiconductor wafer 131; and an apparatus front chamber 120 which carries in/out the semiconductor wafer 131 to/from the processing chamber 110. Further, an anti-pollution chamber 210, to which the semiconductor wafer 131 is carried in, is provided above the apparatus front chamber 120. Further, a drive chamber 220 which is separated from the anti-pollution chamber 210 in an airtight manner is provided below the apparatus front chamber 120. In the anti-pollution chamber 210, a placement base of the semiconductor wafer 131 and a transfer arm 123 which transfers the semiconductor wafer 131 to the processing chamber 110 are arranged adjacent to each other in a plane view. A gas is blown to the anti-pollution chamber 210 from the upper side to the lower side.
摘要翻译：要解决的问题：为了减少在小型制造装置中由微粒引起的处理基板的污染。解决方案：小型半导体制造装置100具有处理半导体晶片131的处理室110，以及将半导体晶片131输入/从处理室110进出的装置前室120.此外，在装置前室120的上方设置有载置半导体晶片131的防污染室210 此外，在装置前室120的下方设有与防污染室210隔开的驱动室220.在防污染室210中，设置半导体晶片131的放置基座和传送臂将半导体晶片131传送到处理室110的123以平面图彼此相邻布置。气体从上侧向下侧吹送到防污染室210。

2. 发明专利

JP2014110375A Front chamber arm arrangement mechanism 有权
标题翻译：前室臂布置机构
公开(公告)号：JP2014110375A
公开(公告)日：2014-06-12
申请号：JP2012265073
申请日：2012-12-04
申请人： National Institute Of Advanced Industrial & Technology , 独立行政法人産業技術総合研究所 , Nanometric Technology Inc , 株式会社ナノテック , Sanmei Co Inc , 株式会社三明
发明人： HARA SHIRO , MAEKAWA HITOSHI , YOKOYAMA YASUAKI , INUZUKA YOSHIKI
IPC分类号： H01L21/677
摘要： PROBLEM TO BE SOLVED: To prevent contamination of a processing substrate which is caused by fine particles generated in a motor mechanism for arm lifting.SOLUTION: An apparatus front chamber 120 of a small manufacturing apparatus 100 is separated by a division plate 201 in an airtight manner to provide an anti-pollution chamber 210 and a drive chamber 220. An arm lifting motor mechanism 245 moves up and down a transfer arm 123. The transfer arm 123 is disposed in the anti-pollution chamber 210, and the arm lifting motor mechanism 245 is disposed in the drive chamber 220. The arm lifting motor mechanism 245 moves up and down a lifting shaft 244 and thereby moves up and down the transfer arm 123 in a state where the anti-pollution chamber 210 and the drive chamber 220 are maintained in an airtight state. Thus, fine particles generated by the motor mechanism 238 does not contaminate a semiconductor wafer 131.
摘要翻译：要解决的问题：为了防止在由马达机构中产生的细小颗粒引起的处理基板的污染。解决方案：小型制造设备100的装置前室120由气密密封的分隔板201分隔开提供防污染室210和驱动室220.臂提升马达机构245在传送臂123上下移动。传送臂123设置在防污染室210中，臂提升马达机构 245设置在驱动室220中。臂提升马达机构245在提升轴244上下移动，从而在防污染室210和驱动室220保持的状态下上下移动传送臂123 处于密闭状态。因此，由电机机构238产生的微粒子不会污染半导体晶片131。

3. 发明专利

JP2014109418A Laminarization mechanism in apparatus 有权
标题翻译：装置中的层压机构
公开(公告)号：JP2014109418A
公开(公告)日：2014-06-12
申请号：JP2012265075
申请日：2012-12-04
申请人： National Institute Of Advanced Industrial & Technology , 独立行政法人産業技術総合研究所 , Nanometric Technology Inc , 株式会社ナノテック , Sanmei Co Inc , 株式会社三明
发明人： HARA SHIRO , MAEKAWA HITOSHI , YOKOYAMA YASUAKI , INUZUKA YOSHIKI
IPC分类号： F24F7/06
摘要： PROBLEM TO BE SOLVED: To create laminar air flow in a small semiconductor manufacturing apparatus without using a HEPA filter.SOLUTION: A cleaning room 210 in an apparatus front chamber 120 which loads and unloads semiconductor wafers to a processing chamber 110 includes an upper punching plate 254 having a plurality of through-holes 1101 for making air supplied from an air supply valve 251 flow therethrough and a lower punching plate 255 having a plurality of through-holes 1102 for making air exhausted from an exhaust valve 253 flow therethrough. Overall height of the apparatus can be reduced because air purified by an external filter is moved in laminar flow through the upper punching plate 254 and the lower punching plate 255 and there is no need to set a HEPA filter in the cleaning room 210 for purification of air and creation of laminar air flow.
摘要翻译：要解决的问题：在不使用HEPA过滤器的情况下在小型半导体制造装置中形成层流气流。解决方案：将半导体晶片装载和卸载到处理室110的装置前室120中的清洁室210包括上冲孔板 254具有多个用于从供气阀251供应的空气的通孔1101流过，并且具有多个用于使排气阀253排出的空气的通孔1102的下冲孔255流过其中。可以减少设备的整体高度，因为通过外部过滤器净化的空气通过上冲孔板254和下冲孔板255以层流的方式移动，并且不需要在清洁室210中设置HEPA过滤器来净化空气和层流气流的产生。

4. 发明专利

JP2013120789A Exposure system 审中-公开
标题翻译：曝光系统
公开(公告)号：JP2013120789A
公开(公告)日：2013-06-17
申请号：JP2011267033
申请日：2011-12-06
申请人： National Institute Of Advanced Industrial & Technology , 独立行政法人産業技術総合研究所 , Sanmei Co Inc , 株式会社三明 , Nanometric Technology Inc , 株式会社ナノテック
发明人： HARA SHIRO , KUMPUAN SOMAWANG , INUZUKA YOSHIKI , YOKOYAMA YASUAKI
IPC分类号： H01L21/027 , G03F7/20 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To provide a mask aligner by which alignment between a mask and a wafer can be performed easily and accurately.SOLUTION: The present invention relates to a mask aligner 1 exposing a wafer W having a predetermined size through a mask M. The mask aligner 1 includes: an exposure stage 3f on which the wafer W is placed; a mask holder 3b which is mounted so as to face a surface of the exposure stage 3f, the surface being on a side where the wafer W is placed, and on which the mask M is placed so as to face the wafer W placed on the exposure stage 3f; and an LED light source 8c mounted so as to face the exposure stage 3f via the mask holder 3b.
摘要翻译：要解决的问题：提供掩模对准器，通过该掩模对准器可以容易且精确地执行掩模和晶片之间的对准。掩模对准器1包括：放置晶片W的曝光台3f;掩模对准器1包括：曝光台3f，其上放置有晶片W. 安装成面对曝光台3f的表面的面罩座3b，该表面位于放置晶片W的一侧，并且掩模M被放置在面上，以面对设置在晶片W上的晶片W 暴露阶段3f; 以及经由掩模保持器3b与曝光台3f相对安装的LED光源8c。版权所有（C）2013，JPO＆INPIT

5. 发明专利

JP2014110374A Front chamber lift arrangement mechanism 审中-公开
标题翻译：前厅升降机构
公开(公告)号：JP2014110374A
公开(公告)日：2014-06-12
申请号：JP2012265072
申请日：2012-12-04
申请人： National Institute Of Advanced Industrial & Technology , 独立行政法人産業技術総合研究所 , Nanometric Technology Inc , 株式会社ナノテック , Sanmei Co Inc , 株式会社三明
发明人： HARA SHIRO , MAEKAWA HITOSHI , YOKOYAMA YASUAKI , INUZUKA YOSHIKI
IPC分类号： H01L21/677
摘要： PROBLEM TO BE SOLVED: To provide a front chamber lift arrangement mechanism for preventing contamination of a processing substrate which is caused by fine particles generated by a substrate lifting motor mechanism 238 with a simple and inexpensive structure in a small manufacturing apparatus.SOLUTION: An apparatus front chamber 120 of a small semiconductor manufacturing apparatus 100 is separated by a division plate 201 in an airtight manner to provide an anti-pollution chamber 210 and a drive chamber 220. A wafer lifting mechanism 230 includes: a lifting body 231 on which a semiconductor wafer 131 is placed; and a wafer lifting motor mechanism 238 which moves up and down the lifting body 231. The lifting body 231 is disposed in the anti-pollution chamber 210, and the wafer lifting motor mechanism 238 is disposed in the drive chamber 220. The wafer lifting motor mechanism 238 moves up and down a lifting shaft 232 and thereby moves up and down the lifting body 231 in a state where the anti-pollution chamber 210 and the drive chamber 220 are maintained in an airtight state. Thus, fine particles occurring in the wafer lifting motor mechanism 238 does not contaminate the semiconductor wafer 131.
摘要翻译：要解决的问题：提供一种用于在小型制造装置中以简单且便宜的结构防止由基板提升马达机构238产生的细小颗粒所引起的处理基板的污染的前室提升装置。解决方案：小型半导体制造装置100的前室120由分隔板201以气密方式隔开，以提供防污染室210和驱动室220.晶片提升机构230包括：提升体231，半导体放置晶片131; 以及提升体231上下移动的晶片升降马达机构238.提升体231设置在防污染室210内，晶片升降马达机构238配置在驱动室220内。晶片升降马达机构238在提升轴232上下移动，从而在防污染室210和驱动室220保持气密状态的状态下上下移动提升体231。因此，晶片升降马达机构238中出现的细小颗粒不会污染半导体晶片131。

6. 发明专利

JP2013120791A Exposure system 有权
标题翻译：曝光系统
公开(公告)号：JP2013120791A
公开(公告)日：2013-06-17
申请号：JP2011267040
申请日：2011-12-06
申请人： National Institute Of Advanced Industrial & Technology , 独立行政法人産業技術総合研究所 , Sanmei Co Inc , 株式会社三明 , Nanometric Technology Inc , 株式会社ナノテック
发明人： HARA SHIRO , KUMPUAN SOMAWANG , INUZUKA YOSHIKI , YOKOYAMA YASUAKI
IPC分类号： H01L21/027 , G03F7/20
摘要： PROBLEM TO BE SOLVED: To provide a mask aligner small in calorific value and short in rising time until to emit light having a wavelength required for exposure.SOLUTION: The present invention relates to a mask aligner 1 exposing a wafer W having a predetermined size through a mask M. The mask aligner 1 includes: an exposure stage 3f on which the wafer W is placed; a mask holder 3b which is mounted so as to face the exposure stage 3f and on which the mask M is placed; and an LED light source 8c mounted so as to face the exposure stage 3f via the mask holder 3b and including a light emitting diode for emitting ultraviolet light.
摘要翻译：要解决的问题：提供小的热值和上升时间短的掩模对准器，直到发射具有曝光所需的波长的光。掩模对准器1包括：放置晶片W的曝光台3f;掩模对准器1包括：曝光台3f，其上放置有晶片W. 安装成面向曝光台3f并且掩模M放置在其上的荫罩座3b; 以及经由掩模保持器3b面对曝光台3f并且包括用于发射紫外光的发光二极管安装的LED光源8c。版权所有（C）2013，JPO＆INPIT

7. 发明专利

JP2013120788A System and method for exposure 有权
标题翻译：曝光系统和方法
公开(公告)号：JP2013120788A
公开(公告)日：2013-06-17
申请号：JP2011267030
申请日：2011-12-06
申请人： National Institute Of Advanced Industrial & Technology , 独立行政法人産業技術総合研究所 , Sanmei Co Inc , 株式会社三明 , Nanometric Technology Inc , 株式会社ナノテック
发明人： HARA SHIRO , KUMPUAN SOMAWANG , INUZUKA YOSHIKI , YOKOYAMA YASUAKI
IPC分类号： H01L21/027 , G03F7/20 , H01L21/677
CPC分类号： G03F7/70716 , G03F7/2051 , G03F7/70733 , H01L21/677 , H01L21/67733 , H01L21/67736 , H01L21/67796
摘要： PROBLEM TO BE SOLVED: To provide a mask aligner that can adequately respond to super small lot production and multiproduct production.SOLUTION: The present invention relates to a mask aligner 1 exposing a wafer W having a predetermined size through a mask M. The mask aligner 1 includes: a transport device 5 for transporting the wafer W and the mask M; an exposure stage 3f on which the wafer W transported by the transport device 5 is placed; a mask holder 3b which is mounted so as to face the exposure stage 3f and on which the mask M transported by the transport device 5 is placed; and an LED light source 8c mounted so as to face the exposure stage 3f via the mask holder 3b.
摘要翻译：要解决的问题：提供可以充分响应超小批量生产和多产品生产的掩模对准器。掩模对准器1包括：用于传送晶片W和掩模M的传送装置5;掩模对准器1包括：传送装置5，用于传送晶片W和掩模M; 由放置运送装置5输送的晶片W的曝光台3f; 安装成面向曝光台3f并由传送装置5输送的掩模M放置在其上的荫罩座3b; 以及经由掩模保持器3b与曝光台3f相对安装的LED光源8c。版权所有（C）2013，JPO＆INPIT

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