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1. 发明专利

JPH09111577A GLASS CLOTH, PREPREG, LAMINATED BOARD AND MULTILAYER PRINTED CIRCUIT BOARD 失效
公开(公告)号：JPH09111577A
公开(公告)日：1997-04-28
申请号：JP26750495
申请日：1995-10-16
申请人： NITTO BOSEKI CO LTD , MATSUSHITA ELECTRIC WORKS LTD
发明人： SAKAGUCHI KOZO , NAGAMINE FUMIO , MIYASATO KEITA , HATTORI HIROMASA , WATANABE TATSUYA , HIBINO AKINORI
IPC分类号： C08J5/24 , B32B5/10 , B32B15/092 , B32B17/04 , D03D1/00 , D03D15/00 , D03D15/12 , D06M15/55 , D06M101/00 , H05K1/02 , H05K1/03 , H05K3/46 , B32B15/08
摘要： PROBLEM TO BE SOLVED: To obtain a prepreg, a laminated board and a multilayer printed circuit board by using a glass cloth having improved tear strength even in a thin state and woven by using warp or weft thicker than the other weft or warp and decreasing the count of the thicker strand. SOLUTION: A two ply yarn or a single yarn having a filament diameter of 0.003-0.010mm is used as the strand of warp and/or weft. The weft or the warp is composed of a strand of >=75de which is thicker than the other warp or weft, the count of the strand of the weft or warp per unit length is set to be smaller, i.e., 0.3-0.8 times the count of the other warp or weft and the weight of the thicker strand of the weft or warp per unit length is set to be 1.5-2.5 times that of the other warp or weft to obtain a woven thin glass cloth having an areal density of 15-30g/m . The cloth is impregnated with 60-80wt.% (based on the weight of prepreg) of an epoxy resin and the obtained prepreg is hot- pressed together with a metallic foil to form a laminated board having an insulation layer thickness of 0.040-0.080mm and a tear strength of >=35gf. A multilayer printed circuit board is manufactured from the laminated board.

2. 发明专利

JPH06280034A METHOD AND DEVICE FOR ELECTROLESS PLATING 失效
公开(公告)号：JPH06280034A
公开(公告)日：1994-10-04
申请号：JP34716492
申请日：1992-12-25
申请人： MATSUSHITA ELECTRIC WORKS LTD
发明人： HATTORI HIROMASA , YAMAGUCHI NOBORU , YOSHIZAWA IZURU , YOSHII YASUSHI
IPC分类号： C23C18/31 , C23C18/36 , C23C18/40
摘要： PURPOSE:To deposit a electroless plating film on a material to be plated in a stabilized quantity for a long time without being affected by the external air by using this device. CONSTITUTION:A gas contg. oxygen is supplied into a electroless-plating soln. at a temp. between 30 deg.C and the temp. of the soln. This device is provided with a feeder 12 for preserving and receiving the gas contg. oxygen, a detector for detecting the temp. of the gas, a controller 6 to keep the gas at the temp. between 30 deg.C and the soln. temp. based on the signal from the detector, a temp. controller 5 for controlling the gas temp. based on the signal from the controller 6 and a diffuser tube 4 for diffusing the gas kept at a temp. specified by the controller 5 into the electroless-plating soln. in an electroless-plating soln. tank 1.

3. 发明专利

JPH06184758A ELECTROLESS COPPER PLATING METHOD AND DEVICE THEREFOR 失效
公开(公告)号：JPH06184758A
公开(公告)日：1994-07-05
申请号：JP33823392
申请日：1992-12-18
申请人： MATSUSHITA ELECTRIC WORKS LTD
发明人： YOSHIZAWA IZURU , YAMAGUCHI NOBORU , HATTORI HIROMASA , YOSHII YASUSHI
IPC分类号： C23C18/31 , C23C18/40
摘要： PURPOSE:To deposit a copper plating at a constant rate by supplying a pH regulator contg. OH groups to control the concn. of the complex in an electroless copper plating soln. CONSTITUTION:Electroless copper plating is carried out by using an alkaline electroless copper plating soln. A pH regulator contg. OH groups is supplied to control the concn. of the complex consisting of the copper ion, copper ion complexing agent and OH groups. The concn. is detected by a detector 6 in the plating device. The concn. is compared with the set concn. by a comparator 7 based on the detection signal from the detector 6. The supply o the pH regulator to a plating soln. tank 1 is instructed by the discrimination signal of the comparator 7 through a controller 17. Consequently, the fluctuation of the deposition rate due to the deterioration of the plating soln. after a long term use is eliminated.

4. 发明专利

JPH1015942A PREPREG LOADING METHOD 失效
公开(公告)号：JPH1015942A
公开(公告)日：1998-01-20
申请号：JP16875796
申请日：1996-06-28
申请人： MATSUSHITA ELECTRIC WORKS LTD
发明人： HATTORI HIROMASA
IPC分类号： B29B11/16 , B29K101/10 , B29K105/06 , C08J5/24
摘要： PROBLEM TO BE SOLVED: To enable lamination with which the broken powder of a resin hardly adhere to the surface of metal foil. SOLUTION: In a method feeding a prepreg in a grasped state, a feed machine 10 equipped with a grasping means 11, the heating means 12 of the grasping means and the cooling means 13 thereof is used and, in such a state that the grasping means 11 grasping the prepreg so as to come into contact with the total width thereof, the grasping means 11 is heated so that the prepreg becomes a temp. range from the softening temp. of a thermosetting resin compsn. of a B-stage to the curing temp. thereof and subsequently cooled to the softening temp. of the thermosetting resin compsn. or lower and the prepreg is fed during this heating/cooling period.

5. 发明专利

JPH06280033A ELECTROLESS PLATING METHOD 失效
公开(公告)号：JPH06280033A
公开(公告)日：1994-10-04
申请号：JP34472492
申请日：1992-12-24
申请人： MATSUSHITA ELECTRIC WORKS LTD
发明人： YOSHIZAWA IZURU , YAMAGUCHI NOBORU , TONE KAORU , HATTORI HIROMASA , TAKAHASHI HIROAKI
IPC分类号： C23C18/31 , C23C18/34 , C23C18/40
摘要： PURPOSE:To conduct electroless plating without the replenished metal ion being deposited in a plating soln. and with the activity of the electroless plating soln. maintained for a long time. CONSTITUTION:A metal ion is replenished to an electroless plating soln. 12 contg. the metal ion, a metal ion complexing agent, a metal ion reducing agent and a pH regulator in an electroless plating tank 1. In this case, a metallic complex soln. 7 consisting of the metal ion and metal ion complexing agent is used, a part of the soln. 7 is drawn off from the tank 1 and sent to a complexing tank 13, and a fresh metal compd. is added to the soln. which is used to replenish the metal ion.

6. 发明专利

JPH05206592A MANUFACTURE OF CERAMIC BOARD AND CERAMIC WIRING BOARD 失效
公开(公告)号：JPH05206592A
公开(公告)日：1993-08-13
申请号：JP1243792
申请日：1992-01-27
申请人： MATSUSHITA ELECTRIC WORKS LTD
发明人： HATTORI HIROMASA , YAMAGUCHI NOBORU , YOSHIZAWA IZURU
IPC分类号： B28B11/14 , H05K1/02 , H05K1/03 , H05K3/00
摘要： PURPOSE:To enable a large number of ceramic wiring boards to be manufactured at a time without causing a short circuit which occurs due to a metal film left in a groove by a method wherein a discontinuous spot is locally provided to a groove formed along a board cutting line. CONSTITUTION:Even if a metal film 4 or solder 5 is left unremoved in a board dividing groove in a wiring board manufacturing process, it hardly causes a short circuit to a wiring board. The metal film 4 or the solder 5 is cut at a round or square through-hole 6 or a groove non-formed region, so that circuits 3 are prevented from being electrically connected to each other. That is, metal is not attached to a spot where the through-hole 6 is provided, so that the metal film 4 or the solder 5 are cut off at the through-hole 6. As mentioned above, a groove is disconnected at a spot where a short circuit is apt to occur, whereby a large number of ceramic wiring boards can be manufactured at a time without causing a short circuit.

7. 发明专利

JPH07268639A ELECTROLESS PLATING APPARATUS 失效
公开(公告)号：JPH07268639A
公开(公告)日：1995-10-17
申请号：JP6180494
申请日：1994-03-31
申请人： MATSUSHITA ELECTRIC WORKS LTD
发明人： HATTORI HIROMASA , YOSHIZAWA IZURU
IPC分类号： C23C18/31 , H05K3/18
摘要： PURPOSE:To suppress the remaining and sticking of fine copper powder by using a flexible transparent plastic tube as a pipe for transferring a plating soln. used for connecting an electroless plating soln. tank to a plating soln. adjustment tank. CONSTITUTION:A plating soln. 7 in an electroless plating tank 1 is transferred to a plating soln. adjustment tank 2, the pH and copper concn. of the plating soln. 7 are adjusted and the plating soln. 7 is recycled as a copper replenishing source to the plating tank 1. A transparent plastic tube such as a transparent soft PE tube is used as a pipe 3 for transferring the plating soln. 7. Since the tube is flexible, a joint is unnecessary and a smooth continuous structure free from a joint is ensured. The plating soln. stagnates hardly in the tube and the remaining and sticking of fine copper powder due to the deposition of copper in the pipe 3 are hardly caused.

8. 发明专利

JPH07316829A ELECTROLESS PLATING METHOD 失效
公开(公告)号：JPH07316829A
公开(公告)日：1995-12-05
申请号：JP10865894
申请日：1994-05-23
申请人： MATSUSHITA ELECTRIC WORKS LTD
发明人： HATTORI HIROMASA , YOSHIZAWA IZURU
IPC分类号： C23C18/31 , H05K3/18
摘要： PURPOSE:To provide an electroless plating method by which the generation of metal powder is reduced in the plating soln., and the electroless plating is stably conducted over a long period. CONSTITUTION:An electroless plating device 9 consists of an electroless plating soln. tank 1, a gas blowing means 2 and a plating soln. component replenishing means 5. A plating soln. component 7s is supplied from the means 5 to adjust the component concn. in an electroless plating soln. 7. The gas blowing means 2 is provided in the tank 1 filled with the soln. 7 and separated from the side face la of the tank 1 with a space in between. A partition plate 3 is set by penetrating through the surface 7a of ths soln. 7 in the upper part of the space between the side face 1a and the blowing means 2. The soln. component 7s is supplied between the partition plate 3 and the side face 1a from the means 5 provided at the upper part of the space between the partition plate 3 and the side face 1a.

9. 发明专利

JPH0664986A CERAMIC SUBSTRATE WITH METALLIC FILM 失效
公开(公告)号：JPH0664986A
公开(公告)日：1994-03-08
申请号：JP22177992
申请日：1992-08-20
申请人： MATSUSHITA ELECTRIC WORKS LTD
发明人： HATTORI HIROMASA , YAMAGUCHI NOBORU , YOSHIZAWA IZURU
IPC分类号： C04B41/88 , C04B41/51 , C04B41/52 , H05K1/09 , H05K3/38
摘要： PURPOSE:To provide a ceramic substrate with a metallic film, capable of strongly bonding a glassy material-containing layer, laminated and formed on the metallic film thereto and hardly causing the peeling of the glassy material- containing layer. CONSTITUTION:This objective ceramic substrate with a metallic film is obtained by dispersing an inorganic substance 4 in the metallic film 2 formed on the surface of the ceramic substrate 1 so as to provide the maximum content thereof on the side of the surface.

10. 发明专利

JPH10291716A LOADING DEVICE 失效
公开(公告)号：JPH10291716A
公开(公告)日：1998-11-04
申请号：JP10418497
申请日：1997-04-22
申请人： MATSUSHITA ELECTRIC WORKS LTD
发明人： HATTORI HIROMASA
IPC分类号： B65G57/03 , B65G57/11 , B65H31/36
摘要： PROBLEM TO BE SOLVED: To provide a pre-preg loading device that can continuously load pre- pregs with ease, which are formed continuously by impregnating resin vanish, drying and cutting the pre-pregs to equal size. SOLUTION: A pre-preg 3 comprises a base material impregnated by thermosetting resin and dried. A loading device, in which the pre-preg 3 is cut to specified size, and the cut pre-pregs are loaded on the loading device, is provided with a conveyor 1 for conveying the pre-pregs 3 to be conveyed after cutting and throw and a pallet 2, on which the pre-pregs 3 thrown by the conveyor 1 is loaded. The loading device is also provided with a vibration device 5, which vibrates in parallel with the side walls 7 erected at four sides of the pallet 2. The loading device has such inclination that the tip angle is low to the advancing direction of the pallet 2 and the opposite angle at the position of an opposite angle is higher.

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