会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 2. 发明专利
    • METHOD FOR VAPOR-PHASE EPITAXIAL GROWTH
    • JPS62105996A
    • 1987-05-16
    • JP24621285
    • 1985-11-05
    • NIPPON TELEGRAPH & TELEPHONE
    • NISHIOKA TAKASHIITO YOSHIOYAMAMOTO AKIISA
    • H01L21/205C30B25/02
    • PURPOSE:To obtain a thin crystal film free from cracking and having excellent characteristics, by depositing a thin crystal film of a substance different from substrate on a substrate by vapor-phase epitaxial growth, modifying the thin crystal film and growing a thin crystal film on the modified thin crystal film under electrical discharge. CONSTITUTION:A thin crystal film of a substance different from substrate is grown on a crystal substrate by vapor-phase epitaxial growth. In the above process, the surface of the substrate is cleaned by heating at a high temperature or by plasma discharge and an initial deposition layer is formed on the substrate by vapor-phase epitaxial growth in the 1st step. In the 2nd step, the above thin crystal film is deposited on the initial deposition layer by vapor-phase epitaxial growth under electrical discharge in a raw material gas of the above thin crystal film or the above thin crystal film is annealed for a short time (about 1min) to modify the crystallinity of the initial deposition layer. In the 3rd step, the thin crystal film is grown on the above initial deposition layer by epitaxial growth under electrical discharge in a raw material gas of the above thin crystal film. The temperature of the substrate is maintained always to
    • 3. 发明专利
    • MANUFACTURE OF COMPOSITE SEMICONDUCTOR SUBSTRATE
    • JPH01220819A
    • 1989-09-04
    • JP4658588
    • 1988-02-29
    • NIPPON TELEGRAPH & TELEPHONE
    • SUGO MITSURUYAMAMOTO AKIISAYAMAGUCHI MASASHI
    • H01L21/28H01L21/20H01L21/36
    • PURPOSE:To enable integrated circuits or the like to be produced finely and precisely by forming a metallic layer on a second principal face of a semiconductor substrate opposite to the first one as a temperature higher than ordinary temperature is given to the substrate such that the metallic layer has a sufficiently large thickness that is determined in view of the temperature given to the substrate so that a composite semiconductor substrate obtains an inverse number of radius of curvature of warpage that is smaller than one tenth of that of the substrate. CONSTITUTION:On one principal face 2a of a semiconductor substrate body 1, a semiconductor layer 3 having a coefficient of thermal expansion higher than that of the substrate 1 is formed as a temperature higher than ordinary temperature is given to the semiconductor substrate 1, so that a semiconductor substrate 1 is produced. Then, a metallic layer 5 is formed on the other principal face 2b of the substrate 1 by vapor deposition, whereby a composite semiconductor substrate 6 is produced. The metallic layer 5 is formed, as a temperature higher than ordinary temperature is given to the semiconductor substrate 1, into a thickness which is large enough to enable the composite semiconductor substrate 6 to be produced to have only an inverse number of radius of curvature of warpage that is smaller than one tenth of that of the semiconductor substrate. Further, the temperature given to the semiconductor substrate 1 should be taken into consideration when such a thickness is determined.
    • 5. 发明专利
    • METHOD AND APPARATUS FOR GROWING THIN FILM
    • JPS6246994A
    • 1987-02-28
    • JP18392085
    • 1985-08-23
    • NIPPON TELEGRAPH & TELEPHONE
    • NISHIOKA TAKASHIITO YOSHIOYAMAMOTO AKIISA
    • C30B25/02C30B23/02H01L21/205
    • PURPOSE:To execute expital growth of a high-grade semiconductor in succession by cleaning the surface of a substrate to be grown by the plasma obtd. by the plasma discharge generated in gas with H2 or O2 as a constituting component. CONSTITUTION:The Si substrate 20 to be grown installed on a susceptor (made of carbon coated with SiC) on a vertically movable supporting table 21 is placed to an electric discharge region generated by the electric power supplied from an RF plasma power source 4 to an electrode 41. The inside of a substrate-surface treatment chamber 2 into which gaseous H2 is preliminarily introduced 23 is always adjusted to 1 Torr and the substrate 20 is kept 400 deg.C. Mainly CH4 is formed of the atom-like hydrogen excited by the electric discharge and C which is a foreign element on the substrate 20 to detach said element from the substrate surface. On the other hand, the natural oxide film of Si which is the other foreign matter is reduced away by the excited hydrogen. The cleaned substrate 20 is introduced through a gate valve 1 into a growing chamber 3 and is moved together with the supporting table and susceptor to positions 30-32. The substrate 30 is heated to a prescribed temp. by the electric power supplied from a high-frequency heating power source 5 and the epitaxial growth is executed.