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    • 3. 发明专利
    • MANUFACTURE OF SEMICONDUCTOR DEVICE
    • JP2001015394A
    • 2001-01-19
    • JP18711599
    • 1999-07-01
    • NIPPON TELEGRAPH & TELEPHONE
    • OOISO YOSHITAKAIGA RYUZOAMANO CHIKARA
    • H01L21/02H01S5/00H01S5/323
    • PROBLEM TO BE SOLVED: To obtain a crystal which is high in quality and hardly deteriorates in crystallinity at its interface by a method wherein a semiconductor layer formed on the top surface of a substrate is subjected to a high-temperature process, then the substrate located under the semiconductor layer is removed to turn the semiconductor layer to a thin film, and the thin film is pasted on another substrate of different lattice constant. SOLUTION: An etching stop layer 2, a clad layer 3, a light trapping layer 4, an active layer 5, a light trapping layer 6, a clad layer 7, and a cap layer 8 are grown on an InP substrate 1, then an SiO2 film 9 is deposited for the formation of a mesa. Thereafter, a current block layer composed of an Fe-InP layer 10 and an N-InP layer 11 is grown at a growth temperature of 630 deg.C or so. After the SiO2 film 9 is removed, a P-InP layer 12 and a contact layer 13 are grown. Then, a wax 14 is applied, and the semiconductor substrate 1 is pasted on an Si substrate 15. Thereafter, the InP substrate 1 is subjected to etching to make the etching stop layer 2 exposed, the etching stop layer 2 is removed, and the laminate is pasted on a Ga-As substrate 16.