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    • 3. 发明专利
    • BONDING METHOD FOR RESIN
    • JPH04173232A
    • 1992-06-19
    • JP30087490
    • 1990-11-06
    • DAI ICHI HIGH FREQUENCY CO LTDNIPPON STEEL CORP
    • TANIGUCHI YASUYUKIMORISHITA YOSHIYUKIKOBAYASHI RYOJIYOSHITOME TAKAHIROTSUCHIDA ISAMUYOSHIDA KOTARO
    • B29C65/04B29C65/34
    • PURPOSE:To conduct without generating dielectric breakdown of resin in the state of bringing a couple of electrodes into contact with the surface of resin laminated with a heat generating body layer interposed therein, high frequency voltage, by setting the resistance of heat generating body layer in an electric line and the area of electrodes under the specified conditions at that time. CONSTITUTION:Resin sheets 1A and LB to be bonded together are laminated, and a resistant heat generating body 2 is interposed between the laminates. Electrodes 3A and 3B are disposed on the surface of the resin sheet 1A positioned on the sections 2a and 2b of the resistant heat generating body 2, and a high frequency power source 4 is connected with the electrodes 3A and 3B. High frequency voltage of 10 to 10 Hz is applied, and power is applied to the heat generating body layer indirectly through a resin layer. At that time, the resistance R of the heat generating body layer in the electric line and the area S of electrodes are set as shown by the formula I so as to apply power without generating dielectric breakdown of the resin sheets in the electrode sections. In the formula, (z) represents impedance (OMEGA.cm ) per unit area of a capacitor formed on the electrode section using resin as a dielectric medium, and E represents dielectric strength V for the overall thickness of resin and P represents the power W to be supplied to the heat generating layer.
    • 5. 发明专利
    • Method for densifying porous structure and densifying apparatus
    • 用于对多孔结构和透镜装置进行识别的方法
    • JP2013086999A
    • 2013-05-13
    • JP2011227053
    • 2011-10-14
    • Ihi Aerospace Co Ltd株式会社IhiエアロスペースDai Ichi High Frequency Co Ltd第一高周波工業株式会社
    • YAMAUCHI HIROSHIHAYAKAWA HIRONAGASUZUKI SHIGERUIDE DAIKIMURA SOJIROKOBAYASHI RYOJIMIYATA SHUICHIRO
    • C04B41/85B64G1/00C04B35/80F16D65/12
    • PROBLEM TO BE SOLVED: To provide a method for densifying a porous structure and a densifying apparatus capable of manufacturing a high-density porous structure required for, for example, a nozzle liner of a spacecraft or a brake disk, and greatly shortening the time required for its manufacture.SOLUTION: This densifying apparatus includes: a reactor 2; a heating derivative 4 arranged in the reactor 2, and comprising a high-density C/C composite having a density of ≥1.95 g/cmand supported in the state where a carbon preform W is immersed into a liquid phase precursor C stored in the reactor 2; and a power supply part 6 for heating the liquid phase precursor C and the preform W immersed into the liquid phase precursor C in the reactor 2 by supplying a high-frequency current to the heating derivative 4 and heating by resistance heating, and allowing a decomposition product of the liquid phase precursor C decomposed by the heating to impregnate and deposit into many fine cavities of the carbon preform W.
    • 解决的问题:提供一种致密化多孔结构的方法和能够制造例如航天器或制动盘的喷嘴衬套所需的高密度多孔结构的致密化装置,并且大大缩短 其制造所需的时间。 解决方案:该致密化装置包括:反应器2; 布置在反应器2中的加热衍生物4,并且包含密度为≥1.95g/ cm 3的高密度C / C复合物,并且在碳 将预制件W浸入存储在反应器2中的液相前体C中; 以及电源部分6,用于通过向加热衍生物4提供高频电流并通过电阻加热进行加热来加热液相前体C和浸入反应器2中的液相前体C中的预成型件W,并且允许分解 通过加热分解的液相前体C的产物浸渍并沉积到碳预型体W的许多细小空腔中。(C)2013,JPO&INPIT