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    • 6. 发明专利
    • Epoxy-based reactive diluent and liquid epoxy resin composition containing the same
    • 基于环氧的反应性稀释液和含有它的液体环氧树脂组合物
    • JP2003026766A
    • 2003-01-29
    • JP2001213366
    • 2001-07-13
    • New Japan Chem Co Ltd新日本理化株式会社
    • YOSHIMURA RIEKONOBE TOMIOYOSHIDA YASUHISAFUJITANI TSURATAKE
    • C08G59/24H01L23/29H01L23/31
    • PROBLEM TO BE SOLVED: To provide a liquid epoxy resin composition which contains an epoxy- based reactive diluent and is useful as a sealing material for semiconductor package, a sealing material for a photoelectric conversion element, a conductive adhesive, a die-bonding paste, an anisotropic conductive paste, and a joint filler for viaholes, through holes, etc.
      SOLUTION: This epoxy resin composition contains (A) an epoxy resin, (B) a reactive diluent, (C) a curing agent, and optionally (D) a filler. Ingredient B is a nuclear hydrogenation product of bisphenol A diglycidyl ether, has a content (obtained by GPC) of a compound represented by formula (1) of 5 wt.% or lower, a degree of nuclear hydrogenation of 80% or higher, a chlorine content of 0.2 wt.% or lower, an epoxy equivalent of 210 or lower, and a viscosity of 1,000 mPa s or lower.
      COPYRIGHT: (C)2003,JPO
    • 要解决的问题:提供含有环氧类反应性稀释剂并可用作半导体封装用密封材料的液态环氧树脂组合物,用于光电转换元件的密封材料,导电粘合剂,芯片粘合膏, 各向异性导电膏,以及用于通孔,通孔等的接合填料。解决方案:该环氧树脂组合物含有(A)环氧树脂,(B)反应性稀释剂,(C)固化剂和任选的(D) 填料。 成分B是双酚A二缩水甘油醚的核氢化物,具有式(1)表示的化合物的含量(GPC得到)为5重量%以下,核氢化度为80%以上的成分 氯含量为0.2重量%以下,环氧当量为210以下,粘度为1000mPa·s以下。