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1. 发明专利

JP2004048639A Piezo-resonator and manufacturing method of the same 审中-公开
公开(公告)号：JP2004048639A
公开(公告)日：2004-02-12
申请号：JP2002338037
申请日：2002-11-21
申请人： Murata Mfg Co Ltd , 株式会社村田製作所
发明人： KAMISAKA KENICHI , YAMADA HAJIME , TAKEUCHI MASAKI , KAWAMURA HIDEKI , YOSHINO YUKIO , NOMURA TADASHI , USHIMI YOSHIMITSU , HAYASHI TAKASHI , NAKAMURA DAISUKE
IPC分类号： H01L41/09 , H01L21/316 , H01L41/18 , H01L41/22 , H01L41/29 , H01L41/316 , H01L41/319 , H03H3/02 , H03H9/17 , H03H9/54
摘要： PROBLEM TO BE SOLVED: To provide a piezo-resonator having high yield rate, in which stress that a thin film has is made extremely small and which is superior in resonance characteristics. SOLUTION: The resonator includes a substrate 2, an insulating film 4 formed above the substrate 2, an oscillation section 8 having a structure that top and bottom surfaces of a thin film section which has at least one or more layers of piezoelectric thin film are sandwiched by at least one pair of upper electrode 7 and a lower electrode 5 by facing with each other in a thickness direction, and the roughness arithmetic average (Ra) of the lower electrode is 2.5nm or less. Preferably, the surface of the insulating film 4 has the roughness arithmetic average (Ra) of 1.0nm or less, and the stress of the insulating film 4 is set to 250MPa or less on compressive stress and 400MPa on tensile stress. COPYRIGHT: (C)2004,JPO

2. 发明专利

JP2014232765A 蓄電装置审中-公开
标题翻译：电源存储设备
公开(公告)号：JP2014232765A
公开(公告)日：2014-12-11
申请号：JP2013111913
申请日：2013-05-28
申请人：株式会社村田製作所 , Murata Mfg Co Ltd
发明人： UEDA YASUHIKO , HAYASHI TAKASHI , HORIKAWA KEIJI
IPC分类号： H01G11/80 , H01G9/08 , H01G11/10 , H01M2/36 , H01M10/04
CPC分类号： Y02E60/13
摘要：【課題】正極シートと負極シートとの短絡が生じ難い蓄電装置を提供する。【解決手段】正極シート11において、正極部の周囲を囲むように第1の封止部13が設けられており、負極シート21において負極部の周囲を囲むように第2の封止部23が設けられており、正極シート11及び負極シート21が、電解液保持スペースを介して積層されて積層体が構成されており、第1の封止部13において、第1の電解液誘導路13c,13dが設けられており、第2の封止部23に、第2の電解液誘導路23c,23dが設けられており、第1の電解液誘導路13cの開口部である第1の注液口13c1,13d1と、第2の電解液誘導路23c,23dの開口部である第2の注液口23c1,23d1とが、積層体2の外表面においてシートの積層面と平行な方向において異なる位置に設けられている、蓄電装置1。【選択図】図1
摘要翻译：要解决的问题：提供一种难以引起正极片和负极片短路的蓄电装置。解决方案：蓄电装置1包括：正极片11，其具有正极电极部分和设置成围绕正电极部分周围的第一封装部分13; 以及负极片21，其具有设置成包围负极部的周围的负极部和第二封装部23。正电极片11和负电极片21通过电解质保持空间层压成层压体。第一包封部13具有设置在其中的第一电解质导向路径13c，13d。第二封装部23具有设置在其中的第二电解质导向路径23c，23d。由第一电解质导向路径13c和13d的开口形成的第一液体倾倒口13c1和13d1以及由第二电解质导向路径23c和23d的开口形成的第二液体注入口23c1和23d1设置在与层压体2的外表面中的片层压平面平行的方向。

3. 发明专利

JP2003298200A Electronic component and its producing method 有权
标题翻译：电子元件及其生产方法
公开(公告)号：JP2003298200A
公开(公告)日：2003-10-17
申请号：JP2002098925
申请日：2002-04-01
申请人： Murata Mfg Co Ltd , 株式会社村田製作所
发明人： HAYASHI TAKASHI , INOUE KAZUHIRO , TONAMI YOSHIYUKI
IPC分类号： H05K1/11 , H01L21/3205 , H01L23/52 , H05K3/02 , H05K3/40
摘要： PROBLEM TO BE SOLVED: To provide an electronic component, and its producing method, in which both reduction in size and formation of a fine surface electrode are satisfied.
SOLUTION: A through hole is made through an insulator substrate 1 and filled with firing type silver paste which is then fired at 800°C or above thus forming a through hole 2. A conductive protective film 3a and a back electrode 4 are then formed, respectively, on one and the other major surfaces of the insulator substrate 1 to cover the end face of the through hole 2. Subsequently, a fine surface electrode 7a is formed by lift-off method to cover the conductive protective film 3a. A low through hole conduction resistance is attained and a fine surface electrode can be formed.
COPYRIGHT: (C)2004,JPO
摘要翻译：解决的问题：提供一种电子部件及其制造方法，其中既满足了微小表面电极的尺寸减小和形成。解决方案：通孔通过绝缘体基板1制成并填充有焙烧型银浆，然后在800℃或更高温度下烧制，从而形成通孔2.导电保护膜3a和背电极4 然后分别形成在绝缘体基板1的一个和另一个主表面上以覆盖通孔2的端面。随后，通过剥离方法形成微小表面电极7a以覆盖导电保护膜3a。可以获得低通孔导通电阻，并且可以形成精细的表面电极。版权所有（C）2004，JPO

4. 发明专利

JP2004221622A Piezoelectric resonator, piezoelectric filter, duplexer, communication apparatus, and manufacturing method of piezoelectric resonator 审中-公开
公开(公告)号：JP2004221622A
公开(公告)日：2004-08-05
申请号：JP2002338036
申请日：2002-11-21
申请人： Murata Mfg Co Ltd , 株式会社村田製作所
发明人： YAMADA HAJIME , TAKEUCHI MASAKI , KAWAMURA HIDEKI , FUJINO HIROYUKI , YOSHINO YUKIO , KAMISAKA KENICHI , NOMURA TADASHI , NAKAMURA DAISUKE , USHIMI YOSHIMITSU , HAYASHI TAKASHI
IPC分类号： C23C14/08 , C23C14/10 , H01L41/08 , H01L41/09 , H01L41/18 , H01L41/22 , H01L41/253 , H01L41/29 , H01L41/316 , H01L41/319 , H03H3/02 , H03H9/02 , H03H9/17 , H03H9/58
摘要： PROBLEM TO BE SOLVED: To provide a piezoelectric thin film resonator having a stabilized temperature characteristic of resonant frequency, a method for manufacturing the same, and a communication apparatus using the piezoelectric thin film resonator. SOLUTION: The piezoelectric thin film resonator 1 is provided with: a substrate 2 having an opening 5; first 6 and second 7 insulation films which are provided on one surface of the substrate 2 while covering the opening 5 and which primarily include SiO 2 and Al 2 O 3 , respectively, Al 2 O 3 having oxygen defect and being in an amorphous state; and a piezoelectric thin film 10 which is provided on the second insulation film 7 and is sandwiched between electrodes 8, 9 and which primarily includes ZnO. COPYRIGHT: (C)2004,JPO&NCIPI

5. 发明专利

JP2004014848A Thin-film circuit board and its manufacturing method 审中-公开
公开(公告)号：JP2004014848A
公开(公告)日：2004-01-15
申请号：JP2002167112
申请日：2002-06-07
申请人： Murata Mfg Co Ltd , 株式会社村田製作所
发明人： YOSHIDA KOJI , HAYASHI TAKASHI , TOSE MASATO
IPC分类号： H05K1/16 , H05K3/38 , H05K3/42
摘要： PROBLEM TO BE SOLVED: To efficiently manufacture a reliable thin-film circuit board which has superior adhesive strength between an organic insulating film and a metal wire and superior oxidation resistance of the organic insulating film, and to provide its manufacturing method.
SOLUTION: An organic insulating film 2 containing a cycloolefin-based resin is formed on a substrate 1, an inorganic insulating film 12 is formed on the organic insulating film 2, and a metal wire 5 is formed on the organic insulating film 2 across the inorganic insulating film 12. Benzocyclobutene is used as the cycloolefin-based resin. The inorganic insulating film is ≥5 nm thick and formed as a continuous film covering the entire organic insulating film. The circuit structure body having the organic insulating film, inorganic insulating film, and metal wire is arranged on a substrate having a metal wire formed on the top surface.
COPYRIGHT: (C)2004,JPO

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