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    • 2. 发明专利
    • Electronic component and its manufacturing method
    • 电子元件及其制造方法
    • JP2007294764A
    • 2007-11-08
    • JP2006122592
    • 2006-04-26
    • Murata Mfg Co Ltd株式会社村田製作所
    • YAMADA HAJIMEUSHIMI YOSHIMITSUKAMISAKA KENICHISAITO TOMOKAAIZAWA NAOKOFUJINO HIROYUKI
    • H01G4/12H01G4/33H01G13/00
    • PROBLEM TO BE SOLVED: To provide a manufacturing method for an electronic component capable of manufacturing a capacitor that is large in capacity, has little variation in characteristics, and is capable of being provided at a low cost.
      SOLUTION: The electronic component 10 contains a substrate 12. A first electrode 14 is formed at the center of the one primary surface of the substrate 12. A dielectric ceramic green sheet 15 containing dielectric ceramic material is formed on the substrate 12 and the first electrode 14. A part of the dielectric ceramic green sheet 15 overlapping with the center of the first electrode 14 is melted and baked by irradiation with a laser beam, so that a high-permittivity dielectric thin film 16 is formed on the center of the first electrode 14. The residual part of the dielectric ceramic green sheet 15 is removed. A second electrode 18 is formed on the center of the dielectric thin film 16.
      COPYRIGHT: (C)2008,JPO&INPIT
    • 要解决的问题:为了提供能够制造容量大的电容器的电子部件的制造方法,特性的变化很小,并且能够以低成本提供。 电子部件10包含基板12.第一电极14形成在基板12的一个主表面的中心。包含电介质陶瓷材料的电介质陶瓷生片15形成在基板12上, 第一电极14.与第一电极14的中心重叠的电介质陶瓷生片15的一部分通过用激光束照射而熔化和烘烤,使得在介电陶瓷生片15的中心形成高介电常数介电薄膜16 第一电极14.去除电介质陶瓷生片15的剩余部分。 第二电极18形成在电介质薄膜16的中心。版权所有:(C)2008,JPO&INPIT
    • 3. 发明专利
    • Dielectric resonator and manufacturing method thereof
    • 电介质谐振器及其制造方法
    • JP2004282152A
    • 2004-10-07
    • JP2003067030
    • 2003-03-12
    • Murata Mfg Co Ltd株式会社村田製作所
    • ANDO MASAMICHIFUJINO HIROYUKITSUTSUMI MUNENORI
    • B28B3/02H01P7/10H01P11/00
    • PROBLEM TO BE SOLVED: To provide a dielectric resonator and a manufacturing method thereof for solving a problem of ununiformized density at molding of ceramic powder and facilitating setting of a shape for deciding the characteristic of the dielectric resonator. SOLUTION: Stepwise recessed parts 11a, 11a', 11b, 11b' comprising faces nearly in parallel with principal faces Sx, Sy of the dielectric resonator are formed at the ridges of the dielectric resonator formed to be nearly a rectangular solid as a whole. The recessed parts are formed by using a punch moved separately from a main body punch and the ceramic powder is powder-molded by using a multi-stage press method. COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题:提供一种用于解决陶瓷粉末成型时的不均匀密度的问题的介质谐振器及其制造方法,并且便于设置用于确定介质谐振器的特性的形状。 解决方案:在形成为几乎矩形的固体的介质谐振器的脊上形成包括与介质谐振器的主面Sx,Sy几乎平行的面的逐步凹进部分11a,11a',11b,11b'作为 整个。 通过使用与主体冲头分开移动的冲头形成凹部,并且通过使用多级压制方法将陶瓷粉末粉末成型。 版权所有(C)2005,JPO&NCIPI
    • 7. 发明专利
    • Electronic component and its manufacturing method
    • 电子元件及其制造方法
    • JP2007281920A
    • 2007-10-25
    • JP2006106085
    • 2006-04-07
    • Murata Mfg Co Ltd株式会社村田製作所
    • YAMADA HAJIMEAIZAWA NAOKOFUJINO HIROYUKIKUBO RYUICHIKOSHIDO YOSHIHIRO
    • H03H3/02H01L23/02H03H3/08
    • PROBLEM TO BE SOLVED: To provide a manufacturing method of an electronic component in which flexure or breaking hardly occur on a bonded substrate, and thermal damage is small on an element formed on the substrate.
      SOLUTION: An elastic bulk wave device 10 being the electronic component includes a first substrate 12 comprised of Si and a second substrate 22 comprised of a glass substrate. An elastic bulk wave element 14 is formed on one major surface of the first substrate 12. First electrodes for bonding 20a, 20b, 20c comprised of Sn are formed on one major surface side of the first substrate 12. Second electrodes for bonding 28a, 28b, 28c comprised of Au are formed on one major surface side of the second substrate 22. A laser is applied from the other major surface side of the second substrate 22 so that the first electrodes for bonding 20a, 20b, 20c and the second electrodes for bonding 28a, 28b, 28c are melt and bonded. Accordingly, bonded parts 30a, 30b, 30c are formed.
      COPYRIGHT: (C)2008,JPO&INPIT
    • 要解决的问题:提供一种电子部件的制造方法,其中在接合的基板上几乎不发生弯曲或断裂,并且在形成在基板上的元件上的热损伤小。 解决方案:作为电子部件的弹性体波装置10包括由Si构成的第一基板12和由玻璃基板构成的第二基板22。 在第一基板12的一个主表面上形成弹性体波元件14.在第一基板12的一个主表面侧形成有由Sn构成的用于接合的第一电极20a,20b,20c。用于接合的第二电极28a,28b 在第二基板22的一个主表面侧上形成由Au构成的28c。从第二基板22的另一个主表面侧施加激光,使得用于键合20a,20b,20c的第一电极和用于 键合28a,28b,28c熔融粘合。 因此,形成接合部30a,30b,30c。 版权所有(C)2008,JPO&INPIT