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1. 发明专利

JP2013191748A Semiconductor light emitting device 审中-公开
标题翻译：半导体发光器件
公开(公告)号：JP2013191748A
公开(公告)日：2013-09-26
申请号：JP2012057296
申请日：2012-03-14
申请人： Mitsubishi Chemicals Corp , 三菱化学株式会社
发明人： MATSUMOTO MEGUMI , KAMATA YOSHIE , MORI HIROSHI
IPC分类号： H01L33/56 , H01L23/28 , H01L33/54
CPC分类号： H01L2224/48091 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a chip-on-board type semiconductor light emitting device with a dome-shaped sealing part, good in formability, excellent in translucency, and excellent in adhesiveness with a wiring metal material such as silver.SOLUTION: A semiconductor light emitting device includes: a dome-shaped sealing part formed by curing a sealing material liquid which contains condensation-type silicone (I), a thixotropy imparting agent (II) having a primary particle size in the range of from 5 nm or more to 20 nm or less, and a compound (III) containing at least one epoxy group in the molecule; and a chip-on-board wiring board where at least a part of a surface bonded with the dome-shaped sealing part is formed of at least one metal selected from the group consisting of silver, copper and aluminum or an alloy at least including one selected from the group consisting of silver, copper and aluminum.
摘要翻译：要解决的问题：提供具有圆顶形密封部件的片上半导体发光器件，成型性好，半透明性优异，与诸如银的布线金属材料的粘合性优异。解决方案：A 半导体发光器件包括：通过固化含有缩合型硅氧烷（I）的密封材料液体形成的圆顶形密封部件，一次粒径在5nm以上的触变赋予剂（II）和20nm以下的分子内含有至少一个环氧基的化合物（III）以及板上布线板，其中与圆顶形密封部分接合的表面的至少一部分由选自银，铜和铝的至少一种金属或至少包括一个的合金形成选自银，铜和铝。

2. 发明专利

JP2013150004A Member forming liquid for semiconductor light emitting device, member for semiconductor light emitting device, member for aerospace industry, semiconductor light emitting device, and phosphor composition 有权
标题翻译：半导体发光器件的成员液体，半导体发光器件的成员，航空器工业的成员，半导体发光器件和磷光体组合物
公开(公告)号：JP2013150004A
公开(公告)日：2013-08-01
申请号：JP2013078482
申请日：2013-04-04
申请人： Mitsubishi Chemicals Corp , 三菱化学株式会社
发明人： KATO HANAKO , MORI HIROSHI , NIIHARA MASATO , TAKIZAWA KENICHI , MATSUO FUMIYUKI
IPC分类号： H01L33/56 , C08G77/08 , H01L23/29 , H01L23/31 , H01L33/48 , H01L33/50 , H01L33/60 , H01L33/62
CPC分类号： H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2924/01322 , H01L2924/10253 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a member forming liquid for a semiconductor light emitting device, excellent in light stability (particularly, resistance to ultraviolet rays) and adhesiveness, having sufficient heat resistance and film forming capability, and capable of sealing the semiconductor light emitting device without causing cracking, peeling, and coloration even when used for a long period.SOLUTION: A siloxane compound containing a constitution unit represented by formula (1) contains (A) a silanol group and/or an alkoxy group bonded to bifunctional silicon, and (B) a silanol group and/or an alkoxy group bonded to trifunctional silicon, the total content of the (A) and the (B) measured by liquidSi-NMR being 0.2 wt.% or more and 5.0 wt.% or less and {the number of moles of the (B)}/{the total of the numbers of moles of the (A) and the (B)} measured by liquidSi-NMR being 1.0% or more and 30% or less. (RSiO) (1) (In the formula (1), Rrepresents an organic group having no unsaturated bonding.)
摘要翻译：要解决的问题：为了提供一种半导体发光元件的成型液，其光稳定性（特别是耐紫外线）和粘合性优异，具有充分的耐热性和成膜能力，能够密封半导体发光装置，即使长时间使用也不会引起开裂，剥离和着色。溶液：含有由式（1）表示的构成单元的硅氧烷化合物含有（A）与双官能硅键合的硅烷醇基和/或烷氧基，和（B）与三官能硅键合的硅烷醇基和/或烷氧基，通过液体Si-NMR测量的（A）和（B）的总含量为0.2重量％以上且5.0重量％以下和（B）} / {通过液体Si-NMR测定的（A）和（B）}的摩尔数的总和为1.0％以上且30％以下。（RSiO）（1）（式（1）中，R表示不具有不饱和键的有机基团。

3. 发明专利

JP2013124324A Curable polyorganosiloxane composition and polyorganosiloxane cured material obtained by curing the composition 审中-公开
标题翻译：可固化的聚羟基硅氧烷组合物和通过固化组合物获得的聚羟基硅氧烷固化的材料
公开(公告)号：JP2013124324A
公开(公告)日：2013-06-24
申请号：JP2011274681
申请日：2011-12-15
申请人： Mitsubishi Chemicals Corp , 三菱化学株式会社
发明人： TERADA NORIAKI , MORI HIROSHI , TAKIZAWA KENICHI
IPC分类号： C08L83/04 , C08G59/40 , H01L33/56
CPC分类号： H01L2224/48091 , H01L2224/49107 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a curable polyorganosiloxane composition, capable of suppressing the discoloring of silver used in an electrode for LED or the like due to a contaminant under the usage environment.SOLUTION: The curable polyorganosiloxane composition contains: (A) a curable condensed type silicone resin containing two or more silanol groups in one molecule; (B) a curing catalyst; and (C) an epoxy resin having bisphenol group, in which the ratio (weight ratio) of (C) the epoxy resin having bisphenol group to the total solid content in the composition is 0.01/100 or more and 0.8/100 or less. The blending of a predetermined amount of the (C) the epoxy resin having bisphenol group allows suppression of the discoloring of silver resulting from a contaminant such as sulfur component.
摘要翻译：要解决的问题：提供一种可固化的聚有机硅氧烷组合物，其能够抑制由于使用环境下的污染物引起的LED等的电极的变色。解决方案：可固化聚有机硅氧烷组合物包含：（A）在一个分子中含有两个或多个硅烷醇基团的可固化缩合型有机硅树脂; （B）固化催化剂; 和（C）具有双酚基的环氧树脂，其中（C）具有双酚的环氧树脂与组合物中的总固体含量的比率（重量比）为0.01 / 100以上且0.8 / 100以下。预定量的（C）具有双酚基的环氧树脂的混合可以抑制由诸如硫成分的污染物产生的银的变色。版权所有（C）2013，JPO＆INPIT

4. 发明专利

JP2013091778A Method of manufacturing curable polysiloxane composition 有权
标题翻译：制备可固化多晶硅组合物的方法
公开(公告)号：JP2013091778A
公开(公告)日：2013-05-16
申请号：JP2012203226
申请日：2012-09-14
申请人： Mitsubishi Chemicals Corp , 三菱化学株式会社
发明人： TERADA NORIAKI , MORI HIROSHI , TAKIZAWA KENICHI , TONOMURA TASUKU
IPC分类号： C08G77/08 , C08G77/14 , C08G77/38 , C08G77/44 , C08K5/5419 , C08L83/06 , H01L23/29 , H01L23/31
CPC分类号： H01L2224/48091 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a curable organopolysiloxane composition for giving a good physical property using an organopolysiloxane containing a phenyl group by a method using a condensation catalyst.SOLUTION: The method of manufacturing the curable polysiloxane composition includes a step of condensation of a bifunctional linear polydiorganosiloxane mixture containing at least a first component and a second component using a condensation catalyst. The condensation catalyst includes a gallium compound. The first component is a bifunctional linear polydiorganosiloxane that has a hydroxide group or hydrolyzable group that is bonded to each terminal silicon atom, and has an aryl group bonded to at least one end of the silicon atom. The second component is a bifunctional linear polydimethyl siloxane that has a hydroxide group or hydrolyzable group that is bonded to each terminal silicon atom.
摘要翻译：解决问题的方法：提供一种使用含有苯基的有机聚硅氧烷通过使用缩合催化剂的方法制造可固化的有机基聚硅氧烷组合物以提供良好的物理性能的方法。解决方案：制备可固化聚硅氧烷组合物的方法包括使用缩合催化剂缩合含有至少第一组分和第二组分的双官能线性聚二有机硅氧烷混合物的步骤。缩合催化剂包括镓化合物。第一组分是双官能线性聚二有机硅氧烷，其具有键合到每个末端硅原子上的氢氧基或可水解基团，并且具有与硅原子的至少一个末端键合的芳基。第二组分是具有与每个末端硅原子键合的氢氧基或可水解基团的双官能线性聚二甲基硅氧烷。版权所有（C）2013，JPO＆INPIT

5. 发明专利

JP2013077813A Package and light-emitting device 审中-公开
标题翻译：包装和发光装置
公开(公告)号：JP2013077813A
公开(公告)日：2013-04-25
申请号：JP2012199107
申请日：2012-09-11
申请人： Mitsubishi Chemicals Corp , 三菱化学株式会社
发明人： UMEDA KAZUNORI , KATO YUKIO , MORI HIROSHI
IPC分类号： H01L33/48
CPC分类号： H01L33/62 , H01L2924/0002 , H01L2933/0033 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To increase reliability of a package by making it difficult to generate a peeling and floating of a lead frame inside a resin molded body and a crack and a breakage of a package, in a package for a light-emitting device.SOLUTION: A package 1, having a recessed part 21 on a top face of which a light-emitting device 4 is mounted, formed by integrally molding a lead frame 3 and a resin molded body 2, is constituted by providing end part bent parts 32a and 32a which are bent from a bottom of an inner lead part 32 toward an upper direction at both side edges of a part to be embedded in the resin molded body 2 of the inner lead part 32 which constitutes the lead frame 3.
摘要翻译：要解决的问题：为了提高包装的可靠性，使得在用于发光元件的封装件中难以产生树脂成型体内的引线框架的剥离和浮动以及封装的裂纹和断裂，发光装置。解决方案：通过将引线框架3和树脂成型体2整体成型而形成有通过一体地成型引线框架3和树脂成形体2而形成有发光装置4的顶面上的凹部21的封装1，在构成引线框架3的内部引线部32的树脂成型体2的嵌入部分的两侧边缘处，从内部引线部32的底部向上方弯曲的弯曲部32a，32a。版权所有（C）2013，JPO＆INPIT

6. 发明专利

JP2013049870A Liquid for forming member for semiconductor light-emitting device, and method for manufacturing semiconductor light-emitting device using the same 有权
标题翻译：用于形成半导体发光装置的构件的液体，以及使用该半导体发光装置制造半导体发光装置的方法
公开(公告)号：JP2013049870A
公开(公告)日：2013-03-14
申请号：JP2012262345
申请日：2012-11-30
申请人： Mitsubishi Chemicals Corp , 三菱化学株式会社
发明人： KATO HANAKO , MORI HIROSHI , KOBAYASHI HIROSHI , TONOMURA TASUKU , YAMAZAKI MASANORI , ABE MARI
IPC分类号： C08J5/00 , C08G77/06 , C08K3/00 , C08L101/02 , H01L33/56
CPC分类号： C09D183/04 , H01L24/45 , H01L33/56 , H01L2224/16 , H01L2224/16225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48257 , H01L2224/49107 , H01L2924/00014 , H01L2924/01019 , H01L2924/0102 , H01L2924/01021 , H01L2924/01046 , H01L2924/01057 , H01L2924/01063 , H01L2924/01066 , H01L2924/01067 , H01L2924/01068 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/12041 , H01L2924/12042 , H01L2924/181 , H01L2924/19041 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/0401
摘要： PROBLEM TO BE SOLVED: To provide a novel member for a semiconductor light-emitting device, which is excellent in transparency, light resistance and heat resistance, seals the semiconductor light-emitting device without causing cracks and exfoliation even in long-period use, and can hold a phosphor.SOLUTION: The member has: (1) hydroxyl or a functional group which can be hydrogen-bonded with oxygen in metalloxan bond on the surface of ceramics or a metal; (2) a maintaining ratio of transmission of light having a wavelength of 400 nm at 80% or more but not more than 110%, before and after the member is left at 200°C for 500 hours; (3) no change recognized by visual inspection, after applying light having a center wavelength of 400 nm or more but not more than 450 nm and a wavelength over 385nm but not more than 500 nm for 24 hours so that an illumination intensity with a wavelength of 436 nm is 4,500 W/m; and (4) a refractive index of light having a wavelength of 550 nm at 1.45 or more.
摘要翻译：要解决的问题：为了提供透明性，耐光性和耐热性优异的半导体发光器件的新型部件，即使在长时间内也不会引起裂纹和剥离而密封半导体发光器件使用，并且可以容纳荧光体。该成员具有：（1）在陶瓷或金属表面的金属氧化物键中可以与氧氢键合的羟基或官能团; （2）在200℃下放置500小时后，将波长400nm的光的透射率保持在80％以上但不超过110％的前后; （3）在将中心波长为400nm以上且450nm以下且波长超过385nm但不超过500nm的光24小时后，通过目视检查无变化，使得具有波长的照明强度 436nm是4,500W / m 2 ; 和（4）在1.45以上的波长为550nm的光的折射率。版权所有（C）2013，JPO＆INPIT

7. 发明专利

JP2011233923A Member for semiconductor light emitting device and method of manufacturing the same, and semiconductor light emitting device using the same 有权
标题翻译：半导体发光器件的制造方法及其制造方法和使用该半导体发光器件的半导体发光器件
公开(公告)号：JP2011233923A
公开(公告)日：2011-11-17
申请号：JP2011161290
申请日：2011-07-22
申请人： Mitsubishi Chemicals Corp , 三菱化学株式会社
发明人： KATO HANAKO , MORI HIROSHI , KOBAYASHI HIROSHI , TOMURA TSUBASA
IPC分类号： H01L33/56 , C08G77/14 , H01L23/28 , H01L33/32 , H01L33/50 , H01L33/58
CPC分类号： H01L2224/48091 , H01L2224/48247 , H01L2224/49107 , H01L2224/73265 , Y02P40/57 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a novel semiconductor light emitting device that has superior transparency, light fastness, heat resistance, reflow resistance, and temperature-resisting properties, is sealed without causing cracking or peeling during use for a long period, and holds a phosphor.SOLUTION: The semiconductor light emitting device has at least one of peaks selected from the group consisting of a peak which has a peak top in a region of a chemical shift of -40 ppm or more and 0 ppm or less in a solid Si-nuclear magnetic resistance resonance spectrum and also has a half-value width of 0.3 ppm or more and 3.0 ppm or less of the peak, and a peak which has a peak top in a region of a chemical shift of -80 ppm or more and less than -40 ppm and also has a half-value width of 0.3 ppm or more and 5.0 ppm or less of the peak, in which a silicon percentage content is 20 wt.% or more, a silanol percentage content is 0.1 wt.% or more and 10 wt.% or less, and a hardness measured value (Shore A) by durometer type A is 5 or more and 90 or less.
摘要翻译：要解决的问题为了提供一种具有优异的透明性，耐光性，耐热性，耐回流性和耐温性的新颖的半导体发光器件，在长期使用期间被密封而不会引起开裂或剥离，并保持荧光体。解决方案：半导体发光器件具有选自以下的至少一个峰：固体中具有在-40ppm以上且0ppm以下的化学位移的区域中具有峰顶的峰 Si核磁阻共振谱，并且峰值的半值宽度为0.3ppm以上且3.0ppm以下，在化学位移为-80ppm以上的峰顶具有峰值小于-40ppm，并且半值宽度为0.3ppm以上且5.0ppm以下的峰，其中硅百分含量为20重量％以上，硅烷醇含量为0.1重量％。％以上且10重量％以下，硬度测定值（肖氏A）由A型硬度计为5以上且90以下。版权所有（C）2012，JPO＆INPIT

8. 发明专利

JP2011201766A Nitride semiconductor production apparatus, production method for nitride semiconductor, and nitride semiconductor crystal 有权
标题翻译：氮化物半导体生产设备，氮化物半导体生产方法和氮化物半导体晶体
公开(公告)号：JP2011201766A
公开(公告)日：2011-10-13
申请号：JP2011045056
申请日：2011-03-02
申请人： Mitsubishi Chemicals Corp , 三菱化学株式会社
发明人： FUJITO TAKESHI , NAGAOKA HIROFUMI , SUZUKI YOSHINORI , MORI HIROSHI , IKARI MASASHI
IPC分类号： C30B29/38 , C23C16/34 , C23C16/44 , C30B25/08 , H01L21/205
摘要： PROBLEM TO BE SOLVED: To provide a nitride semiconductor production apparatus made of quartz which is almost prevented from being clouded even when repeatedly used and provides nitride semiconductors stable in the Si carrier concentration, in the production of the nitride semiconductor by a hydride vapor phase epitaxy method.SOLUTION: The nitride semiconductor production apparatus is characterized in that a portion or the whole of a surface, brought into contact with materials or at least one in a mixture of these materials introduced into the apparatus when the nitride semiconductor is produced, is constituted of synthetic quartz glass. For example, it is preferable that the synthetic quartz glass is used for a portion or the whole of a surface brought into contact with a material serving as a raw material of the nitride semiconductor or a reactive substance producible of a raw material of the nitride semiconductor by reaction, and it is further preferable that the synthetic quartz glass is used for a surface brought into contact with a group III halide such as GaCl or with HCl.
摘要翻译：要解决的问题：为了提供即使在重复使用时几乎可以防止云层的氮化物半导体制造装置，也可以提供在Si载流子浓度上稳定的氮化物半导体，通过氢化物气相外延生产氮化物半导体方法。方法：氮化物半导体制造装置的特征在于，在制造氮化物半导体时，形成与材料接触的表面的一部分或全部或者被引入到装置中的这些材料的混合物中的至少一种的合成石英玻璃。例如，优选使用合成石英玻璃作为与作为氮化物半导体的原料的材料接触的表面的一部分或全部，或者可以由氮化物半导体的原料生成的反应性物质通过反应，进一步优选的是，合成石英玻璃用于与III族卤化物如GaCl或HCl接触的表面。

9. 发明专利

JP2009239242A Member forming liquid for semiconductor light emitting device, member for semiconductor light emitting device, member for aerospace industry, semiconductor light emitting device, and phosphor composition 有权
标题翻译：半导体发光器件的成员液体，半导体发光器件的成员，航空器工业的成员，半导体发光器件和磷光体组合物
公开(公告)号：JP2009239242A
公开(公告)日：2009-10-15
申请号：JP2008163786
申请日：2008-06-23
申请人： Mitsubishi Chemicals Corp , 三菱化学株式会社
发明人： KATO HANAKO , MORI HIROSHI , NIIHARA MASATO , TAKIZAWA KENICHI , MATSUO FUMIYUKI
IPC分类号： H01L23/29 , H01L23/31 , H01L33/48 , H01L33/50 , H01L33/56 , H01L33/60 , H01L33/62
CPC分类号： H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2924/01322 , H01L2924/10253 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a member forming liquid for a semiconductor light emitting device that has superior light stability (particularly, resistance to ultraviolet rays) and adhesiveness, has sufficient heat resistance and film forming capability, and seals the semiconductor light emitting device without causing cracking, peeling, and coloration even when used for a long period. SOLUTION: A siloxane compound containing a constitution unit represented by formula (1) of (R 1 SiO 1.5 ) contains (A) a silanol group and/or an alkoxy group bonded to bifunctional silicon, and (B) a silanol group and/or an alkoxy group bonded to trifunctional silicon, the total content of (A) and (B) measured by liquid 29 Si-NMR being 0.2 to 5.0% by weight and äthe number of moles of (B)}/äthe total of the numbers of moles of (A) and (B)} measured by liquid 29 Si-NMR being 1.0 to 30% by weight. In formula (1), R 1 represents an organic group having no unsaturated bonding. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供具有优异的光稳定性（特别是耐紫外线）和粘合性的半导体发光器件的成型液形成液体，具有足够的耐热性和成膜能力，并且密封半导体光即使长时间使用也不会引起开裂，剥离和着色。解决方案：含有由式（1）表示的结构单元的硅氧烷化合物（R 1 SiO 1.5 ）含有（A）硅烷醇基和/或与双功能硅键合的烷氧基，（B）与三官能硅键合的硅烷醇基和/或烷氧基，通过液体测定的（A）和（B）的总含量为0.2〜5.0重量％，（A）和（B）}的摩尔数（（B）} /的总摩尔数为（A）和（B）} 至30重量％。在式（1）中，R 1表示不具有不饱和键的有机基团。版权所有（C）2010，JPO＆INPIT

10. 发明专利

JP2009224754A Semiconductor light emitting device, lighting apparatus, and image display device 审中-公开
标题翻译：半导体发光装置，照明装置和图像显示装置
公开(公告)号：JP2009224754A
公开(公告)日：2009-10-01
申请号：JP2008212445
申请日：2008-08-21
申请人： Mitsubishi Chemicals Corp , 三菱化学株式会社
发明人： KATO HANAKO , MORI HIROSHI , IMURA HIROYUKI
IPC分类号： H01L33/48 , H01L33/50 , H01L33/56
CPC分类号： H01L2224/14 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49107 , H01L2224/73265 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a new semiconductor light emitting device having resistance against occurrence of cracking and releasing under a long period of usage, especially having excellent brightness (reflectivity), durability, heat resistance, light resistance and adhesiveness or the like, even used for a power device. SOLUTION: The semiconductor light emitting device includes: a package (A); a semiconductor element (B); and a sealing material (C). The surface material of the package (A) and/or the semiconductor element (B) contains at least one or more among Si, Al and Ag, and the sealing material (C) satisfies a predetermined condition and is directly brought into contact with the surface material of the package (A) and/or the semiconductor element (B). COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：解决问题的方案为了提供一种具有耐久性，耐久性，耐热性，耐光性，粘合性，特别是具有优异的亮度（反射率），耐久性，耐热性，耐光性和粘接性的长时间使用中具有抗裂纹和脱模性的新型半导体发光元件喜欢，甚至用于电源设备。解决方案：半导体发光器件包括：封装（A）; 半导体元件（B）; 和密封材料（C）。封装（A）和/或半导体元件（B）的表面材料含有Si，Al和Ag中的至少一种或多种，密封材料（C）满足预定条件并直接与封装（A）和/或半导体元件（B）的表面材料。版权所有（C）2010，JPO＆INPIT

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