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    • 1. 发明专利
    • Semiconductor bulk crystal and method of manufacturing semiconductor bulk crystal
    • 半导体晶体晶体和制造半导体大理石晶体的方法
    • JP2014181170A
    • 2014-09-29
    • JP2013058585
    • 2013-03-21
    • Mitsubishi Chemicals Corp三菱化学株式会社
    • OHATA TATSUHIROENATSU YUKIKUBO SHUICHIFUJITO TAKESHI
    • C30B29/38C30B25/04C30B25/20H01L21/205
    • PROBLEM TO BE SOLVED: To provide semiconductor bulk crystal which has a nonpolar surface or semipolar surface as a main surface, and includes group III metal nitride crystal having less lamination defects and excellent crystallinity, and a method thereof.SOLUTION: There is provided semiconductor bulk crystal which has group III metal nitride semiconductor crystal 20 grown on a main surface of a ground substrate 10 which has a nonpolar surface or semipolar surface as the main surface, which has a striped recessed part. A cavity 1A is formed between the ground substrate 10 and the grown group III metal nitride semiconductor crystal 20, a surface of the cavity 1A on the side of the group III metal nitride semiconductor crystal 20 has opposite facet surfaces 20A, 20B, and tilt angles of the facet surfaces 20A, 20B from the main surface of the ground substrate 10 are 40°-80°.
    • 要解决的问题:提供具有非极性表面或半极性表面作为主表面的半导体本体晶体,并且包括具有较小层压缺陷和优异结晶度的III族金属氮化物晶体及其方法。解决方案:提供半导体体 具有生长在具有非极性表面或半极性表面作为主表面的接地衬底10的主表面上的III族金属氮化物半导体晶体20的晶体,其具有条纹凹部。 在接地衬底10和生长的III族金属氮化物半导体晶体20之间形成空腔1A,III族金属氮化物半导体晶体20一侧的空腔1A的表面具有相对的小面20A,20B和倾斜角 从面接地基板10的主表面的面面20A,20B的面积为40°-80°。
    • 5. 发明专利
    • Method for producing nitride semiconductor crystal
    • 生产氮化硅半导体晶体的方法
    • JP2009046377A
    • 2009-03-05
    • JP2008033347
    • 2008-02-14
    • Mitsubishi Chemicals Corp三菱化学株式会社
    • KUBO SHUICHIFUJITO TAKESHI
    • C30B29/38C30B25/20H01L21/205
    • PROBLEM TO BE SOLVED: To provide a method for producing a nitride semiconductor crystal where an objective nitride semiconductor can be efficiently grown while suppressing the growth of a polycrystal and where the grown nitride semiconductor crystal can be easily taken out without causing cracks.
      SOLUTION: The method for producing the nitride semiconductor crystal comprises a step of growing the nitride semiconductor crystal by supplying raw material gases G3, G4 on a main face where a seed crystal 110 having the main face and its rear face is placed so that the rear face is in contact with a support 107. At least a part of the outer periphery of the rear face of the seed crystal 110 is exposed in the state in contact with the raw material gases G3, G4.
      COPYRIGHT: (C)2009,JPO&INPIT
    • 要解决的问题:提供一种用于制造氮化物半导体晶体的方法,其中可以有效地生长目标氮化物半导体,同时抑制多晶体的生长,并且其中可以容易地取出生长的氮化物半导体晶体而不引起裂纹。 解决方案:用于制造氮化物半导体晶体的方法包括通过在主表面上提供原料气体G3,G4而将氮化物半导体晶体生长的步骤,其中主面上具有主面及其背面的晶种110等 后表面与支撑件107接触。晶种110的后表面的外周的至少一部分以与原料气体G3,G4接触的状态暴露。 版权所有(C)2009,JPO&INPIT
    • 6. 发明专利
    • Ground substrate for growing group iii nitride semiconductor and method for growing group iii nitride semiconductor
    • 用于生长III族氮化物半导体的接地衬底和用于生长III族氮化物半导体的方法
    • JP2008290919A
    • 2008-12-04
    • JP2007139839
    • 2007-05-28
    • Mitsubishi Chemicals Corp三菱化学株式会社
    • FUJITO TAKESHINAGAOKA HIROFUMI
    • C30B29/38C30B25/18H01L33/32H01S5/323
    • PROBLEM TO BE SOLVED: To provide a ground substrate with which a thick-film crystal of a group III nitride semiconductor having a good surface state and cross-sectional shape can be grown. SOLUTION: The ground substrate 112 has a first crystal growth surface 110 and a second crystal growth surface 109 which faces the same direction as a direction to which the first crystal growth surface 110 faces. The second crystal growth surface 109 is consecutively connected to at least 50% of the peripheral edge of or the whole peripheral edge of the first crystal growth surface 110 through a downward step. The first crystal growth surface 110 has a circular shape, and the second crystal growth surface 109 has a ring shape and is concentric with the first crystal growth surface 110. COPYRIGHT: (C)2009,JPO&INPIT
    • 要解决的问题:提供可以生长具有良好的表面状态和横截面形状的III族氮化物半导体的厚膜晶体的接地衬底。 解决方案:接地衬底112具有面向与第一晶体生长面110所面向的方向相同的方向的第一晶体生长面110和第二晶体生长面109。 第二晶体生长表面109通过向下的步骤连续地连接到第一晶体生长表面110的周边边缘或整个周边边缘的至少50%。 第一晶体生长表面110具有圆形形状,并且第二晶体生长表面109具有环形并与第一晶体生长表面110同心。版权所有:(C)2009,JPO&INPIT
    • 7. 发明专利
    • Method for manufacturing semiconductor crystal of nitride of group 13 metal in periodic table and semiconductor light-emitting device using semiconductor crystal of nitride of group 13 metal in periodic obtained by the manufacturing method
    • 使用制造方法获得的第13组金属的氮化物的半导体晶体在周期性表和半导体发光器件中制造13族金属的氮化物的半导体晶体的方法
    • JP2013227202A
    • 2013-11-07
    • JP2013061527
    • 2013-03-25
    • Mitsubishi Chemicals Corp三菱化学株式会社
    • MITANI HIROSHISUZUKI YOSHINORIFUJITO TAKESHI
    • C30B29/38C23C16/04C23C16/34C30B25/04H01L21/205H01L33/32
    • PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor crystal of nitride of group 13 metal in a periodic table, capable of briefly suppressing warps and cracks of the crystal.SOLUTION: A method for manufacturing a semiconductor crystal of nitride of group 13 metal in a periodic table includes a growing step for epitaxially growing the semiconductor crystal of nitride of group 13 metal in a periodic table on a ground substrate, wherein the ground substrate is a crystal different from the crystal to be epitaxially grown, an area ratio (a) of a main surface area Sof the ground substrate and a main surface area Gof the semiconductor crystal of nitride of group 13 metal in the periodic table satisfies an expression (1) over the growing step, and is characterized by using a growth inhibiting member satisfying an expression (2) in the growing step. The expression (1): (area ratio (a))=G/S≤0.90 (S:the main surface area of the ground substrate, and G:the main surface area of the semiconductor crystal of nitride of group 13 metal in the periodic table), the expression (2): T/T≤100 (T:a growth thickness of the semiconductor crystal of nitride of group 13 metal in a periodic table, T:a thickness of the growth inhibiting member).
    • 要解决的问题:提供能够简单地抑制晶体的翘曲和裂纹的周期表中的第13族金属的氮化物的半导体晶体的制造方法。解决方案:一种用于制造第13族氮化物的半导体晶体的方法 周期表中的金属包括用于在接地衬底上在周期表中外延生长第13族金属的氮化物的生长步骤,其中接地衬底是与要外延生长的晶体不同的晶体,面积比( a)主表面区域Sof的接地衬底和周期表中第13族金属的氮化物的主表面积Gof满足生长步骤中的表达式(1),并且其特征在于使用生长抑制构件 在增长的步骤中满足表达式(2)。 式(1):(面积比(a))= G /S≤0.90(S:接地基板的主表面积,G:第13族金属的氮化物半导体晶体的主面积 周期表),式(2):T /T≤100(T:周期表中第13族金属的氮化物的半导体晶体的生长厚度,T:生长抑制构件的厚度)。
    • 8. 发明专利
    • Method for producing periodic table group 13 metal nitride semiconductor bulk crystal
    • 用于生产周期表13族金属氮化物半导体大块晶体的方法
    • JP2013224250A
    • 2013-10-31
    • JP2013039106
    • 2013-02-28
    • Mitsubishi Chemicals Corp三菱化学株式会社
    • TANAKA HIROYUKIFUJITO TAKESHISUZUKI YOSHINORI
    • C30B29/38C30B25/14
    • PROBLEM TO BE SOLVED: To provide a method for producing a periodic table group 13 metal nitride semiconductor bulk crystal capable of growing the crystal stably for long hours by preventing clogging of an exhaust pipe or the like of a crystal growing apparatus for epitaxially growing the periodic table group 13 metal nitride semiconductor crystal.SOLUTION: By controlling so that an exhaust component in epitaxial growth of a periodic table group 13 metal nitride semiconductor crystal has a temperature below a specific temperature before reaching an exhaust pipe, and by controlling so that the temperature in the exhaust pipe becomes below a specific temperature, the exhaust pipe or the like hardly clogs, and the crystal can be grown stably for long hours.
    • 要解决的问题:提供一种能够通过防止用于外延生长周期性的晶体生长装置的排气管等的堵塞而能够长时间稳定地生长晶体的周期表第13族金属氮化物半导体本体晶体的制造方法 表组13金属氮化物半导体晶体。解决方案:通过控制使得周期表组13金属氮化物半导体晶体的外延生长中的排气成分在到达排气管之前具有低于特定温度的温度,并且通过控制使得温度 排气管中的排气管变得低于特定温度时,排气管等几乎不堵塞,并且可以长时间稳定地生长晶体。