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1. 发明专利

JP2006074007A Light emitting source, manufacturing method of light emitting source, lighting apparatus, and display apparatus 有权
标题翻译：发光源，发光源的制造方法，照明装置和显示装置
公开(公告)号：JP2006074007A
公开(公告)日：2006-03-16
申请号：JP2005203062
申请日：2005-07-12
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： UEMOTO TAKAARI , NAITO HIROYUKI
IPC分类号： F21S2/00 , F21V19/00 , F21Y101/02 , H01L33/48
CPC分类号： H01L24/11 , F21K9/20 , F21K9/233 , F21K9/90 , F21V5/007 , F21Y2105/10 , F21Y2115/10 , H01L33/38 , H01L33/62 , H01L2224/1134 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/09701 , H01L2924/12041 , H01L2924/12042 , H01L2924/15787 , H01L2224/13099 , H01L2924/00 , H01L2224/0401
摘要： PROBLEM TO BE SOLVED: To provide a light emitting source that has high reliability and hardly causes conductivity failure between a light emitting device and a conductive land. SOLUTION: In an LED light source, an LED bare chip is mounted to the conductive land of a substrate through bumps 55a, 55b. The LED bare chip is provided with a P-type electrode Lp and an N-type electrode Ln on a rear surface. The P-type electrode Lp is larger in area than the N-type electrode Ln. The P-type electrode Lp is bonded to the conductive land via four bumps 55a, whereas the N-type electrode Ln is bonded to the conductive land via one bump 55b. A bonded area Sn between the N-type electrode Ln and the bump 55b is larger than a bonded area Sp between the P-type electrode Lp and one of the bumps 55a. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种在发光器件和导电焊盘之间具有高可靠性并且几乎不引起电导率故障的发光源。解决方案：在LED光源中，通过凸块55a，55b将LED裸芯片安装到基板的导电焊盘。 LED裸芯片在后表面上设置有P型电极Lp和N型电极Ln。 P型电极Lp的面积比N型电极Ln大。 P型电极Lp经由四个凸块55a接合到导电焊盘，而N型电极Ln经由一个凸块55b接合到导电焊盘。 N型电极Ln和凸块55b之间的接合区域Sn大于P型电极Lp和凸块55a之一之间的接合面积Sp。版权所有（C）2006，JPO＆NCIPI

2. 发明专利

JP2006073873A Method and apparatus for mounting electronic component 有权
标题翻译：用于安装电子元件的方法和装置
公开(公告)号：JP2006073873A
公开(公告)日：2006-03-16
申请号：JP2004257044
申请日：2004-09-03
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： MORIKAWA MAKOTO , HIRATA SHUICHI , UENO YASUHARU , KAWACHI ISAMU , NAITO HIROYUKI
IPC分类号： H01L21/60 , H01L21/607
CPC分类号： H01L24/75 , H01L24/81 , H01L2224/75744 , H01L2924/14 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a method and an apparatus for mounting an electronic component capable of mounting the electronic component with high precision and high bonding reliability, and without causing damage in the mounting of the electronic component having projecting electrodes to be heated, melted and bonded which are arranged with a small pitch, even when the material of the projecting electrodes has a high melting point and is difficult to be uniformly melted.
SOLUTION: The method for mounting the electronic component comprises the steps of holding the electronic component having a plurality of projecting electrodes by a mounting head, and holding a substrate having a plurality of substrate electrodes on a mounting stage; abutting the projecting electrodes on the substrate electrodes after moving the mounting head to align the projecting electrodes with the substrate electrodes and lowering the mounting head; melting the projecting electrodes by heating the electronic component; and bonding both electrodes by cooling after the melting of the projecting electrodes. Further, the method comprises the steps of detecting the abutment load between the projecting electrodes and the substrate electrodes; and scrubbing to give rise to a vibration achieving horizontal relative displacement between the electronic component and the substrate for a predetermined time, after the detection of the disapperance of the abutment load due to the melting after the heating.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种能够以高精度和高粘合可靠性安装电子部件的电子部件的安装方法和装置，并且不会在具有突出电极的电子部件的安装中造成损坏即使在突出电极的材料具有高熔点且难以均匀熔融的情况下，也以小间距排列加热熔融粘合。解决方案：用于安装电子部件的方法包括以下步骤：通过安装头保持具有多个突出电极的电子部件，并将具有多个基板电极的基板保持在安装台上; 在移动安装头之后，将突出的电极邻接在基板电极上，以使突出电极与基板电极对准并降低安装头; 通过加热电子部件来熔化突出电极; 并且在突出电极熔化之后通过冷却来接合两个电极。此外，该方法包括检测突出电极和基板电极之间的邻接载荷的步骤; 并且在检测到由于加热之后的熔化引起的抵接载荷的失效之后，擦洗以产生在电子部件和基板之间达到水平相对位移的振动预定时间。版权所有（C）2006，JPO＆NCIPI

3. 发明专利

JP2005340692A Component mounting method 审中-公开
标题翻译：组件安装方法
公开(公告)号：JP2005340692A
公开(公告)日：2005-12-08
申请号：JP2004160581
申请日：2004-05-31
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： MORIKAWA MAKOTO , NAITO HIROYUKI , SHIDA SATOSHI
IPC分类号： H05K13/04 , H01L21/60 , H05K3/32
CPC分类号： H01L2224/1134 , H01L2924/12041
摘要： PROBLEM TO BE SOLVED: To provide a component mounting method which improves bonding quality between a component and a substrate. SOLUTION: In the component mounting method which improves bonding quality between the component 20 and the substrate 10, a height specification process (step S108) for specifying bump bonding height of a bump b wherein bonding area when the bump b of the substrate 10 and an electrode 23 of the component 20 are joined is made at least a predetermined area, and a pushing process (step S112) wherein pushing of the component 20 is performed to the substrate 10 in the state that the bump b is made to face the electrode 23, and the bump b is crushed as far as height of the bump b becomes a bump bonding height which is specified by the height specification process are contained. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种提高部件和基板之间的接合质量的部件安装方法。解决方案：在提高部件20和基板10之间的接合质量的部件安装方法中，用于指定凸块b的凸起接合高度的高度指定处理（步骤S108），其中当基板的凸起b处的接合面积 10和组件20的电极23被连接成至少一个预定区域，并且在凸起b被制成面对的状态下，对基板10进行部件20的推压的步骤（步骤S112）电极23和凸起b被破碎，直到凸起b的高度成为由高度指定处理规定的凸起接合高度。版权所有（C）2006，JPO＆NCIPI

4. 发明专利

JP2004207589A Method for mounting electronic part, substrate, and circuit board 审中-公开
公开(公告)号：JP2004207589A
公开(公告)日：2004-07-22
申请号：JP2002376618
申请日：2002-12-26
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： NAITO HIROYUKI , SHIDA SATOSHI , ATOKAWA KAZUYA , MORIKAWA MAKOTO , MINAMITANI SHOZO , SAKATA TOSHIKAZU
IPC分类号： H01L21/60 , H01L21/607
CPC分类号： H01L2224/1134 , H01L2224/16 , H01L2924/01078
摘要： PROBLEM TO BE SOLVED: To provide a method for mounting an electronic part by which the electronic part is properly connected even when a substrate has large recesses and projections.
SOLUTION: The method comprises: a protruding electrode forming process of forming protruding electrodes 7 such as stud bumps on respective electrode pads 4 of the substrate 1; a leveling process of molding the end faces 9 of the respective protruding electrodes 7 to be one plane; a process of positioning the ceramic substrate 1 and the electronic part 2 so that the protruding electrodes 6 of the electronic part 2 such as a semiconductor chip and the protruding electrodes 7 of the substrate 1 may oppose each other; and an electrode connecting process for connecting the protruding electrodes 6 of the electronic part 2 with the protruding electrodes 7 of the substrate 1. By providing the protruding electrodes 7 on the substrate 1, the electronic part is properly connected even when the substrate 1 has large recesses and projections.
COPYRIGHT: (C)2004,JPO&NCIPI

5. 发明专利

JP2003282644A Ultrasonic head 有权
标题翻译：超声波头
公开(公告)号：JP2003282644A
公开(公告)日：2003-10-03
申请号：JP2002087595
申请日：2002-03-27
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： MINAMITANI SHOZO , MAE TAKAHARU , UENO YASUHARU , YAMADA AKIRA , MORIKAWA MAKOTO , MARUMO SHINYA , NAITO HIROYUKI
IPC分类号： B06B1/02 , H01L21/60
CPC分类号： H01L24/75 , H01L2224/85205
摘要： PROBLEM TO BE SOLVED: To provide an ultrasonic head that accurately performs ultrasonic junction with high reliability even when a junction area on a junction surface is wide. SOLUTION: The head comprises a ultrasonic vibration generating means 6, a resonant body 7 where a base and face is connected to the ultrasonic vibration generating means 6 and the other end face is an operating surface 10, and a heating means 16 that applies heat near the operating surface of the resonant body 7. Ultrasonic vibration is generated and thermal energy is supplied while pressing load is worked on the operating surface 10. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：即使当接合面上的接合面积较宽时，也可提供高精度地进行超声波接合的超声波头。解决方案：头部包括超声波振动发生装置6，共振体7，其中基部和面部连接到超声波振动发生装置6，另一个端面是操作表面10;以及加热装置16，在谐振体7的操作面附近施加热量。产生超声波振动，并在对操作面10施加压力负荷的同时供给热能。（C）2004，JPO

6. 发明专利

JP2005136399A Semiconductor device mounting method and mounting substrate of semiconductor device 有权
标题翻译：半导体器件的半导体器件安装方法和安装衬底
公开(公告)号：JP2005136399A
公开(公告)日：2005-05-26
申请号：JP2004294968
申请日：2004-10-07
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： NAITO HIROYUKI , SHIDA SATOSHI , HAJI HIROSHI , MORIKAWA MAKOTO
IPC分类号： H01L21/60 , H01L21/607 , H01L33/36 , H01L33/62 , H01L33/00
CPC分类号： H01L24/81 , H01L2924/01015 , H01L2924/12041 , H01L2924/15787 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To allow joining to be surely, efficiently carried out by reducing the occurrence of a joining failure caused by the application of ultrasonic vibration, in mounting where a semiconductor device is mounted on a substrate by joining substrate electrodes of the substrate and device electrodes of the semiconductor device between them by applying the ultrasonic vibration. SOLUTION: Joining components made of gold nanopaste are located between each of the device electrodes and each of the substrate electrodes, and each of the device electrodes and each of the substrate electrodes are abutted interposing each of the joining components between them. In the abutted state, each of the joining components, each of the substrate electrodes and each of the device electrodes are joined. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了通过减少由施加超声波振动引起的接合故障的发生而有效地进行接合，在将半导体器件安装在基板上的安装中，通过接合基板电极通过施加超声波振动，在它们之间的半导体器件的衬底和器件电极。解决方案：将由金纳米糊状物制成的组件连接在每个器件电极和每个衬底电极之间，并且每个器件电极和每个衬底电极在其间插入每个接合部件。在接合状态下，接合部件，每个基板电极和每个器件电极中的每一个接合。版权所有（C）2005，JPO＆NCIPI

7. 发明专利

JP2003258032A METHOD AND APPARATUS FOR MOUNTING ELECTRONIC COMPONENT 审中-公开
公开(公告)号：JP2003258032A
公开(公告)日：2003-09-12
申请号：JP2002058979
申请日：2002-03-05
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： SHIDA SATOSHI , NAITO HIROYUKI , MARUMO SHINYA , MORIKAWA MAKOTO
IPC分类号： H01L21/60 , H01L21/56
摘要： PROBLEM TO BE SOLVED: To achieve mounting including sealing with high productivity with high reliability by filling a sealing material between objects to be mounted without involving bubbles simultaneously at the mounting of an electronic component. SOLUTION: A method for mounting the electronic component comprises steps of drawing and coating the sealing material 31 along sealing material coating lines 31a to 31d so as to cross at a center and radially extend from the center toward a periphery at least at one of the protruding electrode disposing surface of the component and the mounting surface of the object to be mounted, and bringing a protruding electrode of the component into contact with an electrode of the object to be mounted by aligning the component at the object, filling the material 31 in the gap between the component and the object, then imparting connecting energy to the component while loading a pressing load to the component, and connecting the protruding electrode to the electrode of the object to be mounted. COPYRIGHT: (C)2003,JPO

8. 发明专利

JPH0613217B2 失效
公开(公告)号：JPH0613217B2
公开(公告)日：1994-02-23
申请号：JP20910384
申请日：1984-10-05
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： ODA HAJIME , MIURA MASAYOSHI , AKAMI KENJI , NAITO HIROYUKI
IPC分类号： B41J2/045 , B41J2/015 , B41J2/06

9. 发明专利

JPH0455112B2 失效
公开(公告)号：JPH0455112B2
公开(公告)日：1992-09-02
申请号：JP351185
申请日：1985-01-11
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： AKAMI KENJI , MIURA MASAYOSHI , NAITO HIROYUKI
IPC分类号： B41J2/045 , B41J2/16

10. 发明专利

JPH0343985B2 失效
公开(公告)号：JPH0343985B2
公开(公告)日：1991-07-04
申请号：JP22241983
申请日：1983-11-25
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： YAMAMORI SEIJI , AKAMI KENJI , NAITO HIROYUKI
IPC分类号： B41J2/045 , B41J2/055 , B41J2/19

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