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1. 发明专利

JP2005236230A Component mounting apparatus and method of driving the same 有权
标题翻译：组件安装装置及其驱动方法
公开(公告)号：JP2005236230A
公开(公告)日：2005-09-02
申请号：JP2004046984
申请日：2004-02-23
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： ONOBORI SHUNJI , SHIDA SATOSHI , HIRATA SHUICHI , KANAYAMA SHINJI
IPC分类号： H05K13/04
摘要： PROBLEM TO BE SOLVED: To provide a component mounting apparatus capable of easily changing the coating quantity and the coating pattern of the bonding material for the mounting. SOLUTION: The component mounting apparatus is furnished with a vertically movable head 210 for mounting a component, a vertically movable dispenser 220 which is connected to a cylinder 230 and applies the bonding material to a substrate, and the cylinder 230 for pushing the dispenser 220 downward. The head 210 has a first stopper 211, while the dispenser 220 has a second stopper 221 which touches the first stopper by pushing the dispenser 220 with a prescribed force by the cylinder 230. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种能够容易地改变用于安装的接合材料的涂布量和涂布图案的部件安装装置。
解决方案：部件安装装置配备有用于安装部件的可垂直移动的头部210，连接到圆筒230并将接合材料施加到基底的可垂直移动的分配器220，以及用于推动分配器220向下。头部210具有第一止动件211，而分配器220具有第二止动件221，第二止动件221通过由缸230以规定的力推动分配器220而接触第一止动件。（C）2005，JPO＆NCIPI

2. 发明专利

JP2004336071A Part mounting tool and method and device of mounting part using the same 审中-公开
公开(公告)号：JP2004336071A
公开(公告)日：2004-11-25
申请号：JP2004205052
申请日：2004-07-12
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： MINAMITANI SHOZO , KANAYAMA SHINJI , UENO YASUHARU , SHIDA SATOSHI
IPC分类号： H01L21/60
CPC分类号： H01L24/75 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/14 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To prevent a fault caused by slipping from occurring between a mounting tool and a part when ultrasonic bonding is performed on an area between metal junctions each formed on the part and an object to be mounted. SOLUTION: An adsorbing surface 14a which absorbs the part at an adsorbing nozzle 14 is formed of a resin material 14b. The part 3 is adsorbed to the adsorbing surface 14a, the metal junction section 5 of the part and the metal junction section 6 of the object 4 to be mounted are contacted and are pressurized together, an ultrasonic oscillation is applied to the adsorbing nozzle 14 from a horn 17, an area between the metal junction sections 5, 6 are bonded with an oscillating friction. Since the hardness of the resin material 14b is low and the adsorbing surface 14a is formed to be a rough surface, a frictional force to the part 3 becomes big, slipping with the part 3 is suppressed, and the oscillation is efficiently transmitted to the part, a stable bonding can be conducted. COPYRIGHT: (C)2005,JPO&NCIPI

3. 发明专利

JP2003258032A METHOD AND APPARATUS FOR MOUNTING ELECTRONIC COMPONENT 审中-公开
公开(公告)号：JP2003258032A
公开(公告)日：2003-09-12
申请号：JP2002058979
申请日：2002-03-05
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： SHIDA SATOSHI , NAITO HIROYUKI , MARUMO SHINYA , MORIKAWA MAKOTO
IPC分类号： H01L21/60 , H01L21/56
摘要： PROBLEM TO BE SOLVED: To achieve mounting including sealing with high productivity with high reliability by filling a sealing material between objects to be mounted without involving bubbles simultaneously at the mounting of an electronic component. SOLUTION: A method for mounting the electronic component comprises steps of drawing and coating the sealing material 31 along sealing material coating lines 31a to 31d so as to cross at a center and radially extend from the center toward a periphery at least at one of the protruding electrode disposing surface of the component and the mounting surface of the object to be mounted, and bringing a protruding electrode of the component into contact with an electrode of the object to be mounted by aligning the component at the object, filling the material 31 in the gap between the component and the object, then imparting connecting energy to the component while loading a pressing load to the component, and connecting the protruding electrode to the electrode of the object to be mounted. COPYRIGHT: (C)2003,JPO

4. 发明专利

JP2002176295A PART MOUNTING DEVICE 失效
公开(公告)号：JP2002176295A
公开(公告)日：2002-06-21
申请号：JP2000370124
申请日：2000-12-05
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： UENO YASUHARU , MINAMITANI SHOZO , SHIDA SATOSHI , KANAYAMA SHINJI , SAKAI ICHIJI
IPC分类号： H05K13/04 , H01L21/60 , H05K13/08
摘要： PROBLEM TO BE SOLVED: To provide a part mounting device wherein a reflecting part is provided for precision mounting of a part. SOLUTION: There are provided a part recognizing means 5 which recognizes the image on a part supply head 4 side, a substrate recognizing means 12 which recognizes the sight field in the direction opposite to the part recognizing means 5 to recognize the image on a substrate 7 side, and a reflecting part 11 which reflects an incident optical flux to project it in the direction opposite to the incident direction. The board recognizing means 12 recognizes an image on the part supply head 4 side through the reflecting part 11. The reflecting part 11 allows both the part recognizing means 5 and the board recognizing means 12 to recognize the same reference point on the part supply head 4. So, the dislocation amount of the part recognizing means 5 and the board recognizing means 12 is precisely calculated. With the calculated data used, the correction amount of a part 2 and the board 7 in a production process is precisely calculated.

5. 发明专利

JP2000357862A METHOD AND DEVICE FOR LOADING COMPONENT 失效
公开(公告)号：JP2000357862A
公开(公告)日：2000-12-26
申请号：JP2000122670
申请日：2000-04-24
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： TAKAHASHI KENJI , OJI SHIRO , SHIDA SATOSHI
IPC分类号： G02F1/13 , G02F1/1345 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To reduce work processes by loading a component on a glass substrate on which an ultraviolet-ray-curing resin is coated by a component holding means, and, at the loading position, irradiating the ultraviolet-ray-curing resin with ultraviolet ray by an ultraviolet-ray projecting means. SOLUTION: An ultraviolet-ray curing resin is applied on a glass substrate by a resin coating means 2, and then a sucking nozzle 3 which is a component holding means chucks an electronic component out of an electronic component supply means 4. The kind of a chucked electronic component is recognized by its profile and product number using a component recognizing camera 5. A position recognizing camera 20 recognizes, through the glass substrate, the position of electronic component chucked to the chucking nozzle 3 and the wiring pattern of the glass substrate, and in a loading process, the electronic component is loaded to a loading position of the glass substrate, and then an ultraviolet-ray projecting means 30 projects, through the position recognizing camera, ultraviolet ray so that the electrode of an electronic component and that of the glass substrate are jointed.

6. 发明专利

JPH11103199A PARTS MOUNTER AND MOUNTING METHOD 失效
公开(公告)号：JPH11103199A
公开(公告)日：1999-04-13
申请号：JP26468597
申请日：1997-09-29
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： MOTOKAWA YUICHI , HIRAI WATARU , FUJIWARA MUNEYOSHI , SHIDA SATOSHI , OTA HIROSHI
IPC分类号： B23P19/00 , H05K13/04 , H05K13/08
摘要： PROBLEM TO BE SOLVED: To reduce the movement required for positioning an object to be mounted by adjusting the parts holding position on a supporting mechanism for moving a parts handling member depending on the positioning of the object thereby mounting the parts at a position corresponding to the object. SOLUTION: A mounting head 6 is held to be tuned by a rotary shaft 8 having an axis 8a eccentric to a central axis 7 for handling a suction nozzle 15. The suction nozzle 15 is turned by a specified angle about the axis 8a depending on the positioning of parts at a parts mounting position 5 on a circuit board 2 by means of a position adjusting mechanism 9 provided for the mounting head 6 and the parts holding position at the parts mounting position 5 is adjusted by the suction nozzle 15. The parts holding position at the parts mounting position 5 by the suction nozzle 15 is performed on the mounting head 6 for moving the suction nozzle 15 depending on the positioning of the circuit board 2 at a positioning part 4 and corresponding electronic parts 1 are mounted at the mounting position 2a on the circuit board 2.

7. 发明专利

JPH08203966A SEMICONDUCTOR MOUNTING EQUIPMENT 失效
公开(公告)号：JPH08203966A
公开(公告)日：1996-08-09
申请号：JP752495
申请日：1995-01-20
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： SHIDA SATOSHI , KABESHITA AKIRA , KANAYAMA SHINJI , TAKAHASHI KENJI , IMANISHI MAKOTO
IPC分类号： H01L21/607 , H01L21/52 , H01L21/60
摘要： PURPOSE: To detect the abutting of a semiconductor element against a circuit board and interrupt it, by controlling the operation of a voice coil motor, on the basis of position detection data and a counterelectromotive force of the voice coil motor which is generated when the semiconductor element comes into contact with the circuit board. CONSTITUTION: A driving current superposed on a base current for canceling the self weight of a pressing shaft 2 and a suction means 7 is made to flow in a VCM 3. The pressing shaft 2 is moved up and down by the electromagnetic force generated by the driving current. The pressing shaft ascends or discends by changing the direction of the driving current. When resistance exists in the movement of the pressing shaft 2, a counterelectromotive force is generated in the VCM 3. The instance when a semiconductor element sucked and retained by the sucking means 7 fixed to the lower end of the pressing shaft 2 abuts against a circuit board 8 for mounting is detected with the counterelectromotive force, and the VCM 3 is interrupted. Thereby the semiconductor element can be stably mounted.

8. 发明专利

JPH07326891A SEMICONDUCTOR DEVICE MANUFACTURING EQUIPMENT 失效
公开(公告)号：JPH07326891A
公开(公告)日：1995-12-12
申请号：JP11719294
申请日：1994-05-30
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： SHIDA SATOSHI , TAKAHASHI KENJI , KABESHITA AKIRA , IMANISHI MAKOTO
IPC分类号： H05K13/04
摘要： PURPOSE:To obtain a semiconductor device excellent in ohmic contact applying a resin bonding method. CONSTITUTION:A chip pressing head 10 is provided with a suction hole 11 which holds an IC chip 3 by suction, the bumps 3a and 3b of the IC chip 3 sucked by the chip pressing head 10 are made to bear direct against the conductive films 2a and 2b of a wiring board 2, a pressing means is made to press down the chip pressing head 10 so as to spread an adhesive agent layer 4 interposed between the IC chip 3 and the wiring board 2, and a pulse heating element 12 is provided to the tip of the chip pressing head 10 to cure the spread adhesive agent layer by heating. The heating element 12 can be held at the tip of the chip pressing head 10 by suction.

9. 发明专利

JPH07193104A WIRE BONDING DEVICE 失效
公开(公告)号：JPH07193104A
公开(公告)日：1995-07-28
申请号：JP33160593
申请日：1993-12-27
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： IMANISHI MAKOTO , KABESHITA AKIRA , YONEZAWA TAKAHIRO , SHIDA SATOSHI
IPC分类号： H01L21/60 , H01L21/607
摘要： PURPOSE:To shorten bonding work time for improved productivity by balancing the moment around a supporting point with the dead weight of a movable part for lighter weight and higher speed. CONSTITUTION:A holder 11 face to rotate vertically around a supporting point 8, a supersonic horn 10 mounted on the holder 11, a capillary 4 mounted on the supersonic horn 10, a clamper 9 built in the holder 11 above the capillary 4, a bracket 12 holding the holder 11 free to rotate around the supporting point 8, and a linear motor 13 driving the holder mounted on the bracket 12, are provided. Then, each element is so assigned that the moment around the supporting point 8 balances only with its dead weight.

10. 发明专利

JPH0722788A COMPONENT TRANSFER APPARATUS INTEGRATED WITH RECOGNITION CAMERA EQUIPPED WITH ZOOM FUNCTION 失效
公开(公告)号：JPH0722788A
公开(公告)日：1995-01-24
申请号：JP16081493
申请日：1993-06-30
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： TAKAHASHI KENJI , KABESHITA AKIRA , ENCHI KOUHEI , SHIDA SATOSHI
IPC分类号： B23P21/00 , G02B15/00 , H05K13/04 , H05K13/08
摘要： PURPOSE:To provide a zoom function-equipped recognition camera-integrated transfer apparatus which can be made small, which can recognize a component surely even when its size is changed and which can transfer the component stably at high tact. CONSTITUTION:A recognition camera 10 which is arranged in the central line E which is coaxial with a component holding part 12 changes the magnification of a zoom lens 21 attached to a camera body 11 in such a way that the magnification is changed by an actuator 22 according to the size of a component 13 to be transferred. The component 13 to be transferred is imaged and recognized through the component holding part 12. On the basis of a recognized result, the component holding part 12 is driven so as to be lowered by the actuator 22 which has made the magnification of the zoom lens 21 variable, it holds the component 13 to be transferred, and it transfers the component to a transfer position.

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